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ADR3650BRMZ

Analog Devices · Voltage Reference · MSOP-8

ADR3650BRMZ from Analog Devices, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 ENABLE input Enable connection that enables or disables the device; logic high ≥1.17 V enables, low ≤0.63 V shuts down (1.8 V compatible, internal active pull-up, 1.5 µA typical shutdown current).
2 VIN power_in Input voltage connection, specified for 3 V to 16 V operation (absolute maximum 18 V relative to GND SENSE).
3 GND FORCE power_in Ground connection that carries the load sinking current.
4 GND SENSE power_in Ground sensing connection; connect directly to the GND connection of the load device.
5 GND power_in Ground pin to be connected to GND FORCE.
6 VOUT FORCE power_out Reference voltage output (5.000 V typical for ADR3650) requiring 0.1 µF to 10 µF load capacitance, with 70 mA typical sourcing and 20 mA typical sinking capacity.
7 VOUT SENSE input Reference voltage output sensing connection; connect directly to the voltage input of the load device.
8 GND power_in Ground pin to be connected to GND FORCE.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package MSOP-8
Category Power Management (PMIC)
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output Voltage (ADR3650B) VOUT 4.998 5 5.002 V TA = 25°C 4
Initial Output Voltage Error B Grade VOUT_ERR -0.04 0.04 % TA = 25°C 4
Solder Heat Resistance Shift -0.06 0.06 % 4
Temperature Coefficient B Grade TCVOUT 2 3 ppm/°C See the Terminology section 4
Line Regulation ΔVOUT/ΔVIN 0.5 2 ppm/V VIN = VOUT + VDO to 16 V 4
Load Regulation Sourcing 0-10 mA ΔVOUT/ΔIL 10 15 ppm/mA IL = 0 mA to 10 mA, VIN = VOUT + VDO 4
Load Regulation Sourcing 0-50 mA ΔVOUT/ΔIL 3 5 ppm/mA IL = 0 mA to 50 mA, VIN = VOUT + VDO 4
Load Regulation Sinking 0-10 mA ΔVOUT/ΔIL 20 30 ppm/mA IL = 0 mA to 10 mA, VIN = VOUT + VDO 4
Output Current Capacity Sourcing IL 50 70 mA VIN = VOUT + VDO to 16 V 4
Output Current Capacity Sinking IL 10 20 mA VIN = VOUT + VDO to 16 V 4
Short Circuit to GND 90 mA VIN = 16 V 4
Short Circuit to VIN 70 mA VIN = 16 V 4
Quiescent Current Normal Operation (ADR3630 and ADR3650) IQ 70 90 μA VEN ≥ 1.17 V 4
Quiescent Current Shutdown IQ 1.5 3 μA VEN ≤ 0.63 V 4
Dropout Voltage IL = 10 mA (ADR3630 and ADR3650) VDO 0.15 0.3 V IL = 10 mA 4
Dropout Voltage IL = 50 mA (ADR3630 and ADR3650) VDO 0.7 0.9 V IL = 50 mA 4
ENABLE Input High Voltage VENH 1.17 V 4
ENABLE Input Low Voltage VENL 0.63 V 4
ENABLE Leakage Current VENLEAK 0.3 1 μA 4
Output Voltage Noise 0.1 Hz to 10 Hz eN p-p 3 ppm p-p TA = 25°C 4
Output Voltage Noise 10 Hz to 1 kHz 4 ppm RMS 5
Output Voltage Noise Density ADR3650 eN 600 nV/√Hz TA = 25°C, 1 kHz 5
Thermal Hysteresis full cycle ΔVOUT_HYS 7 ppm +25°C to +125°C to -40°C to +25°C (full cycle) 5
Thermal Hysteresis half cycle ΔVOUT_HYS 15 ppm 25°C to 125°C to 25°C (half cycle) 5
Ripple Rejection Ratio ADR3650 RRR 60 dB TA = 25°C, fIN = 60 Hz 5
Long-Term Drift 1000 hours ΔVOUT_LTD 140 ppm TA = 25°C, relative humidity = 30% 5
Long-Term Drift 3500 hours ΔVOUT_LTD 160 ppm TA = 25°C, relative humidity = 30% 5
Turn-On Settling Time ADR3650 tR 900 μs TA = 25°C, COUT = 0.1 µF, RL = 1 kΩ 5
Minimum Load Capacitance CL 0.1 μF 5
Maximum Load Capacitance CL 10 μF 5
Input Voltage VIN 3 16 V Electrical characteristics condition 4
VIN to GND SENSE VIN -0.3 18 V 6
ENABLE to GND SENSE ENABLE -0.3 18 V 6
VOUT FORCE to GND SENSE -0.3 V max is VIN + 0.3 V 6
VOUT SENSE to VOUT FORCE -0.3 0.3 V 6
GND FORCE to GND SENSE -0.3 0.3 V 6
Storage Temperature Range -65 150 °C 6
Operating Temperature Range -40 125 °C 6
Junction Temperature Range -65 150 °C 6
Lead Soldering Temperature 300 °C 10 sec 6
Thermal Resistance Junction-to-Ambient θJA 132.5 °C/W RM-8 6
Thermal Resistance Junction-to-Case θJC 43.9 °C/W RM-8 6

CAD (KiCad official)

  • Symbol: ADR3650BRMZ
  • Footprint: Package_SO:MSOP-8_3x3mm_P0.65mm
  • 3D model: MSOP-8 (KiCad packages3D, STEP)
  • 3D model files: adr3650brmz-etched.step / adr3650brmz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); adr3650brmz.step / adr3650brmz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (26 pp, sha256 2f631c6ea705aa46, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF