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README

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ADP2116ACPZ-R7

Analog Devices · DC-DC Converters · LFCSP-32(5x5)

ADP2116ACPZ-R7 from Analog Devices, in a LFCSP-32(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground for the internal analog and digital circuits; connect to the signal/analog ground plane before connecting to the power ground.
2 COMP1 output Channel 1 error amplifier output; connect a series RC network from COMP1 to GND to compensate the loop, and tie COMP1 and COMP2 together for multiphase operation.
3 FREQ input Frequency select input; connect through a resistor to GND to set the switching frequency per Table 5.
4 SCFG input Synchronization configuration input; tie to VDD to make SYNC/CLKOUT an output or tie to GND to make it an input.
5 SYNC/CLKOUT bidirectional External synchronization input or internal clock output (set by SCFG); as an output it provides a buffered clock at twice the switching frequency with 90° phase shift, and as an input it synchronizes the converters to an external clock.
6 OPCFG input Operation configuration input; tie to VDD or connect through a resistor to GND to set the operating mode per Table 7, including peak current limit selection and pulse skip enable/disable.
7 COMP2 output Channel 2 error amplifier output; connect a series RC network from COMP2 to GND to compensate the loop, and tie COMP1 and COMP2 together for multiphase operation.
8 VDD power_in Power supply input for internal circuitry, specified from 2.75 V to 5.5 V; connect to VINx through a 10 Ω resistor as close as possible to the device and bypass to GND with 1 µF or greater.
9 FB2 input Channel 2 feedback input; connect to VOUT2 for fixed output, or to a resistor divider between VOUT2 and GND for adjustable output with a 0.6 V reference.
10 V2SET input Channel 2 output voltage set pin; connect through a resistor to GND for a fixed output (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V), or through 82 kΩ to GND or directly to VDD for adjustable output.
11 SS2 passive Channel 2 soft-start input; a capacitor from SS2 to GND sets the soft-start period, where 10 nF gives 1 ms, and SS2 is connected to SS1 in multiphase configurations.
12 PGOOD2 output Channel 2 open-drain power-good output; use a 100 kΩ pull-up to VDD or to a voltage of 5.5 V or less, and it is held low when Channel 2 is out of regulation.
13 EN2 input Channel 2 enable input; drive high to turn on and low to turn off the Channel 2 converter, tie to VDD for startup with VDD, and connect to EN1 in multiphase operation.
14 VIN4 power_in Power supply input and source of the high-side internal power MOSFET of Channel 2; VINx pins are rated up to 6 V with respect to PGND.
15 VIN5 power_in Power supply input and source of the high-side internal power MOSFET of Channel 2; VINx pins are rated up to 6 V with respect to PGND.
16 VIN6 power_in Power supply input and source of the high-side internal power MOSFET of Channel 2; VINx pins are rated up to 6 V with respect to PGND.
17 SW4 output Channel 2 switch node, the drain of the P-channel switch and N-channel synchronous rectifier; tie to SW3 and connect the output LC filter between this node and VOUT.
18 SW3 output Channel 2 switch node, the drain of the P-channel switch and N-channel synchronous rectifier; tie to SW4 and connect the output LC filter between this node and VOUT.
19 PGND4 power_in Channel 2 power ground, the source of the low-side internal power MOSFET; PGND1 through PGND4 are rated within 0.3 V of GND.
20 PGND3 power_in Channel 2 power ground, the source of the low-side internal power MOSFET; PGND1 through PGND4 are rated within 0.3 V of GND.
21 PGND2 power_in Channel 1 power ground, the source of the low-side internal power MOSFET; PGND1 through PGND4 are rated within 0.3 V of GND.
22 PGND1 power_in Channel 1 power ground, the source of the low-side internal power MOSFET; PGND1 through PGND4 are rated within 0.3 V of GND.
23 SW2 output Channel 1 switch node, the drain of the P-channel switch and N-channel synchronous rectifier; tie to SW1 and connect the output LC filter between this node and VOUT.
24 SW1 output Channel 1 switch node, the drain of the P-channel switch and N-channel synchronous rectifier; tie to SW2 and connect the output LC filter between this node and VOUT.
25 VIN3 power_in Power supply input and source of the high-side internal power MOSFET of Channel 1; VINx pins are rated up to 6 V with respect to PGND.
26 VIN2 power_in Power supply input and source of the high-side internal power MOSFET of Channel 1; VINx pins are rated up to 6 V with respect to PGND.
27 VIN1 power_in Power supply input and source of the high-side internal power MOSFET of Channel 1; VINx pins are rated up to 6 V with respect to PGND.
28 EN1 input Channel 1 enable input; drive high to turn on and low to turn off the Channel 1 converter, tie to VDD for startup with VDD, and connect to EN2 in multiphase operation.
29 PGOOD1 output Channel 1 open-drain power-good output; use a 100 kΩ pull-up to VDD or to a voltage of 5.5 V or less, and it is held low when Channel 1 is out of regulation.
30 SS1 passive Channel 1 soft-start input; a capacitor from SS1 to GND sets the soft-start period, where 10 nF gives 1 ms, and SS1 is connected to SS2 in multiphase configurations.
31 V1SET input Channel 1 output voltage set pin; connect through a resistor to GND for a fixed output (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V), or through 82 kΩ to GND or directly to VDD for adjustable output.
32 FB1 input Channel 1 feedback input; connect to VOUT1 for fixed output, or to a resistor divider between VOUT1 and GND for adjustable output with a 0.6 V reference.
33 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Analog Devices
Package LFCSP-32(5x5)
Category Power Management (PMIC)
Pins 33

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VDD Bias Voltage VDD 2.75 5.5 V 3
Undervoltage Lockout Threshold (rising) UVLO 2.65 2.75 V VDD rising 3
Undervoltage Lockout Threshold (falling) UVLO 2.35 2.47 V VDD falling 3
Quiescent Current, Channel 1 IDD,CH1 1.7 2.5 mA EN1 = VDD = 5 V, EN2 = GND, VFB1 = VDD, OPCFG = GND 3
Quiescent Current, Channel 2 IDD,CH2 1.7 2.5 mA EN2 = VDD = 5 V, EN1 = GND, VFB2 = VDD, OPCFG = GND 3
Quiescent Current, Channel 1 + Channel 2 IDD,CH1 + CH2 3 4 mA EN1 = EN2 = VDD = 5 V, VFB2 = VFB1 = VDD, OPCFG = GND 3
Shutdown Current IDD,SD 1 10 µA EN1 = EN2 = GND, VDD = VINx = 2.75 V to 5.5 V, TJ = −40°C to +115°C 3
FB1, FB2 Input Bias Current (adjustable output) IFB 1 65 nA Adjustable output, VFBx = 0.6 V, V1SET, V2SET = VDD or via 82 kΩ to GND 4
COMPx Clamp High Voltage VCOMP, HI 2.36 2.45 V VDD = VINx = 2.75 V to 5.5 V 3
COMPx Clamp Low Voltage VCOMP, LO 0.65 0.7 V VDD = VINx = 2.75 V to 5.5 V 3
Output Voltage Accuracy, adjustable output (TJ = 25°C) VFB 0.597 0.6 0.603 V Adjustable output, TJ = 25°C, V1SET, V2SET = VDD or via 82 kΩ to GND 3
Output Voltage Accuracy, adjustable output (TJ = −40°C to +125°C) VFB 0.594 0.6 0.606 V Adjustable output, TJ = −40°C to +125°C, V1SET, V2SET = VDD or via 82 kΩ to GND 3
VFB Error, fixed output (TJ = 25°C) VFB ERROR -1 1 % Fixed output, TJ = 25°C, V1SET, V2SET = GND or via 4.7 kΩ, 8.2 kΩ, 15 kΩ, 27 kΩ, 47 kΩ to GND 3
VFB Error, fixed output (TJ = −40°C to +125°C) VFB ERROR -1.5 1.5 % Fixed output, TJ = −40°C to +125°C, V1SET, V2SET = GND or via 4.7 kΩ, 8.2 kΩ, 15 kΩ, 27 kΩ, 47 kΩ to GND 3
Switching Frequency fSW 255 300 345 kHz FREQ tied to GND 3
Switching Frequency fSW 510 600 690 kHz FREQ via 8.2 kΩ to GND 3
Switching Frequency fSW 1020 1200 1380 kHz FREQ via 27 kΩ to GND 3
SYNC Frequency Range fSYNC 400 1000 kHz fSYNC = 2 × fSW, FREQ tied to GND 3
SYNC Frequency Range fSYNC 800 2000 kHz fSYNC = 2 × fSW, FREQ via 8.2 kΩ to GND 3
SYNC Frequency Range fSYNC 1600 4000 kHz fSYNC = 2 × fSW, FREQ via 27 kΩ to GND 3
CLKOUT Frequency fCLKOUT 510 600 690 kHz fCLKOUT = 2 × fSW, FREQ tied to GND 4
CLKOUT Frequency fCLKOUT 1020 1200 1380 kHz fCLKOUT = 2 × fSW, FREQ via 8.2 kΩ to GND 4
CLKOUT Frequency fCLKOUT 2040 2400 2760 kHz fCLKOUT = 2 × fSW, FREQ via 27 kΩ to GND 4
Peak Output Current Limit, Channel 1 ILIMIT1 3.5 4.5 5.3 A OPCFG tied to VDD or via 82 kΩ to GND 4
Peak Output Current Limit, Channel 2 ILIMIT2 3.5 4.5 5.3 A OPCFG tied to VDD or via 82 kΩ to GND 4
Peak Output Current Limit (reduced setting) 2.4 3.3 4 A OPCFG via 47 kΩ or 27 kΩ to GND 4
Hiccup Time 10 13.6 17 ms fSW = 300 kHz 4
SWx Maximum Leakage Current 0.1 15 µA VDD = VINx = 2.75 V to 5.5 V, ENx = GND, TJ = −40°C to +115°C 4
EN1, EN2 Input Leakage Current IEN_LEAK 0.1 1 µA VDD = VINx = ENx = 2.75 V to 5.5 V, TJ = −40°C to +115°C 4
SS1, SS2 Pin Current ISS1, ISS2 4.8 6 7.8 µA VDD = VINx = 2.75 V to 5.5 V, VSS = 0 V 4
Overvoltage PGOODx Falling Threshold 100 108 114 % Expressed as a percentage of the nominal output voltage 4
Undervoltage PGOODx Rising Threshold 85 92 97 % Expressed as a percentage of the nominal output voltage 4
PGOODx Leakage Current 0.1 1 µA VPGOODx = VDD 4
PGOODx Low Saturation Voltage 50 110 mV IPGOODx = 1 mA 4
VDD to GND VDD -0.3 6 V 5
VIN1 to VIN6 to PGND1 to PGND4 VIN -0.3 6 V 5
EN1, EN2, SCFG, FREQ, SYNC/CLKOUT, PGOOD1, PGOOD2, V1SET, V2SET, COMP1, COMP2, SS1, SS2 to GND -0.3 V Maximum printed as VDD + 0.3 V 5
FB1, FB2 to GND FB -0.3 3.6 V 5
SW1, SW2, SW3, SW4 to PGND1, PGND2, PGND3, PGND4 SW -0.3 V Maximum printed as VDD + 0.3 V 5
PGND1, PGND2, PGND3, PGND4 to GND 0.3 V Printed as 0.3 V; sign not shown in text 5
VIN1 to VIN6 to VDD 0.3 V Printed as 0.3 V; sign not shown in text 5
Thermal Resistance, Junction-to-Ambient θJA 34 °C/W JEDEC 1S2P PCB, Natural Convection 5
Operating Junction Temperature Range TJ -40 125 °C 5
Storage Temperature Range TSTG -65 150 °C 5
Maximum Soldering Lead Temperature 260 °C 10 sec 5

CAD (KiCad official)

  • Symbol: ADP2116ACPZ-R7
  • Footprint: Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm
  • 3D model: LFCSP-32(5x5) (KiCad packages3D, STEP)
  • 3D model files: adp2116acpz-r7-etched.step / adp2116acpz-r7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); adp2116acpz-r7.step / adp2116acpz-r7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (36 pp, sha256 25682e0b04bc5f78, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF