Adom Library
Public Made by Adomby adom
adom-lbr — the EDA library translator. Bring a component in from any supported EDA tool and convert it to any other (KiCad ⇄ Altium ⇄ EAGLE/Fusion) through one canonical adom-lbr JSON — symbol + footprint + 3D + pin↔pad map. Altium is written natively (no Altium needed). Includes the adom-lbr Manager: browse wiki components and view symbol/footprint/3D + the per-EDA layer stackup.
Canonical round trip silently drops per-pad solder-mask and paste margins
adom-lbr installed 2.39.0 and isolated development candidate 2.38.0 at 15f644b6a74ee8284eaac6c483c9340f2fae51d1; Linux WSL2. This is a local library-conversion issue, not a native CAD bridge call.
Importing and exporting the attached TPS389001DSER KiCad footprint loses all six solder_mask_margin and all six solder_paste_margin attributes. Both paths report success. The canonical Pad schema in the development source has no fields for them. Installed 2.39.0 reproduces the loss after creating its destination directory first.
TI drawing DSE0006A 4220552/B (01/2024), pages 25-26 of https://www.ti.com/lit/ds/symlink/tps3890.pdf, specifies a mixed land pattern: pads 1-3 solder-mask-defined, pads 4-6 non-solder-mask-defined, plus a longer pad 1. Our source transcription uses explicit per-pad negative mask/paste margins on the first row and positive mask margins on the second. Losing the attributes changes the solderable and paste apertures despite preserving the copper rectangles. The transcription remains subject to independent footprint review and InstaPCB process approval; the loss reproduces irrespective of its final numeric choices.
Repro: import the attached symbol/footprint with adom-lbr import-kicad, then export-kicad to an existing directory. Compare the source with the attached exported footprint and audit JSON. Expected: preserve neutral per-pad mask/paste geometry, footprint-level defaults and layers; map supported features accurately into KiCad/Fusion/Altium. For unsupported target semantics, fail explicitly or return structured lost-feature hints and a release block, rather than success with silent changes. Include signed-margin and round-trip tests, plus native aperture read-back for each EDA target before claiming parity.
The manufacturer STEP is preserved separately; model seating is not relevant to this repro. No converted footprint has been released for manufacture. Related output-directory false-success behavior is already addressed by the isolated source work attached to PR6; this issue focuses on aperture fidelity.