Use generic 3rd party fab wording
1.0.25: heatsink vias carry KiCad's pad_prop_heatsink property
1.0.24 (docs only): README coverage for heatsinkVias (1.0.23) and the silkscreen rules (1.0.22), and a CHANGELOG
1.0.23: heatsinkVias in the create JSON expand to plated thru_hole pads numbered like the exposed pad (0.3 mm drill, 0.…
1.0.22: silkscreen never lands on copper; pin-1 mark only on polarized parts (new polarized input). The body-outline re…
Sync current source (open-source, up to date)