Adom Fields

@@ -1,7 +1,9 @@ --- name: adom-fields description: >--  Solve where the current and the heat go on a KiCad board and show it on the board in 3D (Adom Fields): current density per loaded net, heat flow in each copper layer with the vias, temperature over the board in still and moving air, the nets by what they carry, the hot parts by their rise, the issues with the fix; a server the AI drives over a live channel (view, select, issue, toast, tour) for the human to explore and for the AI Flow video. Trigger words: adom-fields, fields, current density, heat map, thermal analysis, copper pour analysis, thermal vias, where does the current go, hot tab, temperature rise, IR drop, current neck, heat flow, current flow animation, river view, voltage drop in 3D, ground bounce, exploded layer stack, current through vias.+  Adom Fields: solve where the current and the heat go on a KiCad or Fusion board (current density,+  heat flow through pours and vias, temperature rise) and show it in 3D, driven live by the AI. Use+  when asked for current density, a board heat map, thermal analysis, IR drop or thermal vias. ---  # Adom Fields

@@ -1,7 +1,8 @@ {   "slug": "adom-fields",   "type": "app",-  "version": "0.9.6",+  "version": "0.9.7",+  "changelog": "0.9.7: skill cleanup: shorter skill description, and the two SKILL.md copies are the same again.",   "title": "Adom Fields",   "brief": "Adom Fields: where the current and the heat go on your board.",   "summary": "Current density on the copper, heat flow through the pours and the vias, and the temperature over the board, solved from the board file itself and shown on the board in 3D. The AI does the analysis and drives the view; the human orbits, zooms, hovers for the number under the cursor, and reads the nets by what they carry and the issues by what to fix. A step in Adom's AI Flow: the walkthrough goes into the video.",

@@ -1,7 +1,7 @@ {   "slug": "adom-fields",   "type": "app",-  "version": "0.9.6",+  "version": "0.9.7",   "title": "Adom Fields",   "brief": "Adom Fields: where the current and the heat go on your board.",   "summary": "Current density on the copper, heat flow through the pours and the vias, and the temperature over the board, solved from the board file itself and shown on the board in 3D. The AI does the analysis and drives the view; the human orbits, zooms, hovers for the number under the cursor, and reads the nets by what they carry and the issues by what to fix. A step in Adom's AI Flow: the walkthrough goes into the video.",@@ -138,5 +138,6 @@   "author": {     "name": "John Lauer",     "email": "[email protected]"-  }+  },+  "changelog": "0.9.7: skill cleanup: shorter skill description, and the two SKILL.md copies are the same again." }\ No newline at end of file

@@ -1,7 +1,9 @@ --- name: adom-fields description: >--  Solve where the current and the heat go on a KiCad board and show it on the board in 3D (Adom Fields): current density per loaded net, heat flow in each copper layer with the vias, temperature over the board in still and moving air, the nets by what they carry, the hot parts by their rise, the issues with the fix; a server the AI drives over a live channel (view, select, issue, toast, tour) for the human to explore and for the AI Flow video. Trigger words: adom-fields, fields, current density, heat map, thermal analysis, copper pour analysis, thermal vias, where does the current go, hot tab, temperature rise, IR drop, current neck, heat flow, current flow animation, river view, voltage drop in 3D, ground bounce, exploded layer stack, current through vias.+  Adom Fields: solve where the current and the heat go on a KiCad or Fusion board (current density,+  heat flow through pours and vias, temperature rise) and show it in 3D, driven live by the AI. Use+  when asked for current density, a board heat map, thermal analysis, IR drop or thermal vias. ---  # Adom Fields@@ -11,7 +13,7 @@ One binary, three commands, one app. The AI does the analysis; the human explore ## Solve  ```-adom-fields analyze --board <board.kicad_pcb> --spec <spec.json> --out fields+adom-fields analyze --board <board.kicad_pcb | board.brd from Fusion> --spec <spec.json> --out fields ```  The board must be saved with its zones filled (the filled polygons are the copper). The spec is the AI Flow spec: `loads` (net: amps, maxRiseC, maxDropMv, draws: {part: amps}), `sources` (net: [the parts that feed it]), `hot` (ref: watts, tabNet, maxRiseC: that part's own limit, else hotMaxRiseC), `copperUm`, `hotMaxRiseC`, `thermalVias` (pad, count), optional `stackupMm` (three dielectric thicknesses). About two minutes for a 65 x 75 mm four-layer board at the default 0.2 mm cell; `--pitch 0.1` is four times longer and sharper.@@ -335,3 +337,11 @@ Each solve records SHA-256 identities of the board and spec in `fields.json.inpu Read `docs/heatsinks-and-signals.md` in the package before specifying these models. Use measured conductivity/contact resistance for `heatsinks`; contact is to the board face, not an automatically modeled chip lid. Never add a fictitious heatsink to make a gate pass. Inspect both air conditions and mesh sensitivity.  For signal screening, provide `signals.capacitance` or `signals.differentialPairs`, explicit consistent `stackupMm`, and justified epsilonR. Inspect Signals with `adom-fields ui --port 8874 view --quantity signals`. Unsupported geometry must stay unsupported; do not replace null estimates with guessed numbers. This is outer-layer microstrip and adjacent-layer overlap screening, not high-frequency signoff. The summary records assumptions and primary references.++## Fusion boards (0.6.0+)++A Fusion Electronics board works as `--board <board>.brd` (EAGLE source: `fusion_export_eagle_source`+on the Fusion bridge). Run RATSNEST in Fusion first so the pours are filled: the reader then uses+Fusion's own fill. Put the parts' STEP files, named by MPN, in a folder and pass `--models-dir` so the+chips sit over the fields.+