project
Adom Custom Electronic Load
Public Made by Adomby adom
Two-layer digitally controlled electronic-load prototype. Compact R11 is under active electrical, cooling and probe-access review; not a manufacturing release.
← Commit history
aiflow run board-codex-20261007-1749: placement
4 files changed
+31−9
docs/runs/board-codex-20261007-1749/README.md+31−9@@ -1,6 +1,6 @@ # AI Flow run: codex on board-0 -**Running**: step `thermal-vias`, 296.1 min of AI time since the prompt (2585.1 min on the wall clock). This page updates at every step change.+**Running**: step `placement`, 323.5 min of AI time since the prompt (2643.4 min on the wall clock). This page updates at every step change. Prompt at 2026-10-07T17:49:14Z (UTC). Flow: board. Every number here is from the run's append-only ledger (run.jsonl). AI time is the time the AI was working on a prompt: from the human's prompt to the AI's done, with any gap over 15 min where no command ran (unobserved, not proven idle) cut out. @@ -17,8 +17,9 @@ One row per human prompt: the AI's time on it, unobserved gaps excluded by the h | 5 | 2026-10-09T09:59:18Z | (open) | 14.4 | 15 | Continue the electronic load through AIFlow to completion, keep dashboard progress visible | | 6 | 2026-10-09T10:28:54Z | (open) | 13.9 | 35 | Continue electronic-load engineering through AIFlow, with real dashboard progress and clip | | 7 | 2026-10-09T11:18:03Z | (open) | 4.6 | 69 | Keep going on AIFlow: continue electronic-load engineering and recorded board work. |-| 8 | 2026-10-09T12:31:28Z | (open) | 22.9 | 0 | Resume the electronic load through all AIFlow design gates after dashboard corrections; co |-| **all** | | | **296.1** | | |+| 8 | 2026-10-09T12:31:28Z | (open) | 24.5 | 31 | Resume the electronic load through all AIFlow design gates after dashboard corrections; co |+| 9 | 2026-10-09T13:26:48Z | (open) | 25.9 | 0 | Continue original electronic-load objective. Compact 5 W prototype is the working basis fr |+| **all** | | | **323.5** | | | ## Per step @@ -27,21 +28,22 @@ AI time only, the idle cut out. | Step | AI min | AI thinking min | Tool min | Turns | Visits | Returns | Longest think | |---|---|---|---|---|---|---|---| | intake | 2.6 | 0.3 | 2.2 | 3 | 1 | 0 | 0.3 min |-| placement | 3.9 | 0.0 | 3.9 | 8 | 2 | 1 | 0.0 min |+| placement | 3.9 | 0.0 | 3.9 | 9 | 3 | 2 | 0.0 min | | routing | 46.2 | 0.0 | 46.2 | 42 | 3 | 1 | 0.0 min | | components | 11.9 | 0.0 | 11.9 | 28 | 1 | 0 | 0.0 min | | design | 2.5 | 0.0 | 2.5 | 11 | 1 | 0 | 0.0 min | | libraries | 1.4 | 0.0 | 1.4 | 6 | 1 | 0 | 0.0 min | | models | 0.6 | 0.0 | 0.6 | 4 | 1 | 0 | 0.0 min |-| rules | 223.2 | 0.0 | 223.2 | 14 | 1 | 0 | 0.0 min |+| rules | 249.6 | 0.0 | 249.6 | 14 | 1 | 0 | 0.0 min | | test-plan | 0.1 | 0.0 | 0.1 | 5 | 1 | 0 | 0.0 min |-| thermal-vias | 3.7 | 0.0 | 3.7 | 44 | 2 | 0 | 0.0 min |-| **total** | **296.1** | **0.3** | **295.8** | | | | |+| thermal-vias | 4.8 | 0.0 | 4.8 | 65 | 2 | 0 | 0.0 min |+| **total** | **323.5** | **0.3** | **323.2** | | | | | ## Returns to earlier steps - 2026-10-08T14:37:07Z back to **placement** (visit 2): Compact BOOST_SW loop and orient precision sense pins toward the shunt before routing - 2026-10-09T12:52:33Z back to **routing** (visit 3): Adopt and recheck native USB layout and zero-ohm link revision before remaining thermal and fabrication stages+- 2026-10-09T13:52:38Z back to **placement** (visit 3): Make room for offset cooling while preserving probe access: relocate TP4, TP8 and fan connector after isolated native zero-error zero-open gate ## Decisions along the way @@ -59,6 +61,8 @@ AI time only, the idle cut out. - 2026-10-08T14:51:51Z capture-stop - 2026-10-08T20:21:00Z capture-stop - 2026-10-09T12:54:19Z clip-start:thermal-vias-2+- 2026-10-09T12:55:03Z capture-stop+- 2026-10-09T13:52:39Z clip-start:placement-3 ## Where the board stands @@ -230,12 +234,30 @@ Why the AI came back here: Adopt and recheck native USB layout and zero-ohm link What this step does: Heatsink vias where the heat is: for every part that dissipates real power (the regulator, the inductor, the catch diode, the FETs), an array of vias in its thermal pad or the copper it dumps heat into, stitched to the ground or the plane on the other side, sized and counted from its dissipation; the AI reviews the plan and the binary lands it. -**Clip: thermal-vias, visit 2, still recording (started 2026-10-09T12:54:19Z); it appears here when the step ends.**+**Clip: thermal-vias, visit 2, the PCB editor from 2026-10-09T12:54:19Z to 2026-10-09T12:55:03Z. Motion only: 0.7 min of real time, 5 s of it had something moving; the clock in the corner is the real elapsed time.**++<video width="100%" controls><source src="/blob/app/adom-custom-electronic-load/docs/runs/board-codex-20261007-1749/thermal-vias-2.mp4" type="video/mp4"></video>++**Contact sheet: nine frames spread through the thermal-vias, visit 2 clip, what the camera saw.**++ **Screenshot: the board when thermal-vias, visit 2 began.**  +### placement, visit 3 (rework)++What this step does: place the parts for routability, current and heat; the binary packs, checks courtyards and lands moves; reserve visible space for connector labels and the two-sided service silkscreen; the switch-node check refuses switch copper under another part or a switch loop longer than the spec allows, and sends the AI back here++Why the AI came back here: Make room for offset cooling while preserving probe access: relocate TP4, TP8 and fan connector after isolated native zero-error zero-open gate++**Clip: placement, visit 3 (rework), still recording (started 2026-10-09T13:52:39Z); it appears here when the step ends.**++**Screenshot: the board when placement, visit 3 (rework) began.**+++ ## Plan usage, the second cost line Percent of each plan limit used, as the provider reports it, at the start of the run and at its end.@@ -245,7 +267,7 @@ Percent of each plan limit used, as the provider reports it, at the start of the | claude | 5h | 17 % | 9 % | -8.0 % | | claude | Fable | 0 % | 3 % | 3.0 % | | claude | week | 54 % | 68 % | 14.0 % |-| codex | week | 2 % | 24 % | 22.0 % |+| codex | week | 2 % | 26 % | 24.0 % | *The limits are per account, not per run: every AI thread signed in as this user draws on the same numbers, so a run made while other threads were working shows their usage too. Read it as an upper bound unless this run was the only thread active.*
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