project
Adom Custom Electronic Load
Public Made by Adomby adom
Two-layer digitally controlled electronic-load prototype. Compact R11 is under active electrical, cooling and probe-access review; not a manufacturing release.
← Commit history
Keep thermal interface selection bound to exact geometry and test conditions
1 file changed
+9
docs/thermal-interface-alternatives.mdadded+9@@ -0,0 +1,9 @@+# Thermal-interface alternatives remain screened candidates++The present AlN/grease calculation still uses an unqualified interface: the exact 178-25-220 outline and mounting-hole drawing are unresolved. The nominal PEEK fastener model does not close that gap.++Wakefield 175-6-220P has a published drawing (18.034 × 12.7 mm, 3.5814 mm hole, 0.1524 mm thickness). However, its catalog's 0.40 C/W entry is identified as a TO-3 / one-square-inch test. It cannot be copied into this TO-220 case-to-sink model as the actual interface resistance. The catalog also recommends 350–550 psi mounting pressure; the PEEK screw study does not establish that pressure. This alternative is not adopted merely because a distributor lists an attractive thermal-resistance number. [Manufacturer catalog, printed pages 4–5](https://wakefieldthermal.com/content/catalogs/TIM-Catalog_WakefieldThermal-2026_REV-12.pdf).++Boyd 4169G provides a fully dimensioned 19.30 × 13.97 × 1.57 mm alumina option with a 3.68 mm hole. Its greater thickness changes sink height, fastener engagement and the thermal calculation. It is not interchangeable with the present 0.635 mm AlN assumption. [Manufacturer catalog, printed page 100](https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Heatsinks-Catalog.pdf).++Next selection must bind an exact orderable insulator drawing, the contact area and pressure, compatible grease if required, fastener preload and tolerance stack. Recompute cooling and recheck assembled geometry together. No BOM, thermal limit or acceptance is changed by this review.