Adom Custom Electronic Load

@@ -0,0 +1,94 @@+# Historical checkpoints — not resume instructions++Superseded by [the active completion plan](completion-plan.md). Old commands, board versions and counts below describe past work; do not replay them.++# Current checkpoint — 2026-10-10, 15:50 UTC++The exact adopted board is AIFlow board 21 / candidate v85. Native DRC has zero errors, warnings and opens. All six current checks pass on the matching 0.1 mm Fields report: DUT_POS 53.48, DUT_FUSED 50.66, LOAD_POS 40.11, SHUNT_P 56.50, GND 58.18 and 5V_AUX 19.04 A/mm² surface maxima, against the unchanged 60 A/mm² screen. AIFlow also checks every plated connection and explicit physical terminal. The dashboard has advanced to Thermal (13 of 19).++The schematic/netlist/BOM and native models now include SBR10U45SP5-13. The v85 change removes one redundant track fully contained in a wider track, preserving physical copper and all other circuit intent. Both native views were refreshed and inspected. [Adoption evidence](../design/v85-adoption-review.json) · [Exact report](../checkpoints/unclipped-hotspots-v1/fields-v85-full-0p1/fields.json).++Thermal acceptance is still failed. The board-only model injects 5.5 W through Q1’s PCB terminal region and lacks its external case-to-heatsink path; its extreme temperatures are not a prediction of an assembled cooled unit. The actual interface, supported sink/fan mounting, duct pressure/flow and fault behavior require completion. The stock sink envelope clears all 91 fitted models and probe approaches, but this excludes mating connectors and hardware. [Package sensitivity](package-cooling-review.md) · [Fan airflow review](fan-airflow-review.md).++AIFlow 0.1.86 is published and installed with 147 tests passing, verified live presentation refresh and read-only existing-pour verification. Fields PR10 remains a separate owner-review change, and the shared runtime is not replaced. There are 89 raw takes, including static/rejected footage, 33 reviewed excerpts and 29 storyboard clips. The latest excerpt records the actual current-to-thermal dashboard transition. The final narrated 4–5 minute film remains unfinished.++Next: complete the package/interface/duct cooling design and represent its supported operating/fault cases; then same-input thermal acceptance, Fields/pour walkthroughs, current-board silkscreen/3D review, prototype manufacturing outputs and final video. Physical calibration, safety tests and industrial qualification remain separate from digital design acceptance. No fabrication release, order or flash has occurred.++## Historical checkpoints below++## Latest checkpoint — lower-loss rectifier feasibility++SBR10U45SP5-13 on isolated v82: six explicit-pad current screens pass at 0.1 mm; D1 32.8 C still / 24.7 C moving under unchanged 35 C limit. Q1 heat remains excluded: not full-board thermal acceptance. V83 extra 16 vias did not improve the previous diode result and are not selected. Prepare SBR library/schematic/BOM/model adoption, then same-input formal checks. AIFlow 0.1.83 source and registry are published and installed, 133 tests pass. Live board19 verified unchanged.++## Latest continuation — combined current and diode cooling candidate++AIFlow 0.1.82 remains published and installed. Shared Fields is now 0.7.1 from another thread; this work does not replace it. PR9 remains under owner review. Board19 remains live and unchanged.++V77 passes the isolated fine-grid main-net screen: LOAD_POS 56.09, GND 58.31, SHUNT_P 56.50 A/mm² against 60. The Q1 drain land variant preserves its 1.1 mm drill and 0.25 mm nominal minimum annular ring. V80's PowerDI5 diode study predicts D1 +34.5°C still / +26.0°C assumed moving convection, with Q1 heat excluded. V82 combines those layouts and has zero native DRC errors, warnings and opens. Its full six-net fine-grid current maxima pass (highest GND 58.18 A/mm²), but D1 still-air rise is 36.4°C and fails 35°C. The explicit-pad coarse solve passes at 59.04 A/mm² / 34.6°C; finer thermal evidence controls. V83 adds 16 off-pad thermal vias for native validation and refinement. Physical-pad support is in owner-review PR10.++Expected copper nets remain checked before/after refill and save/reload. Clearing stale zone fills before connectivity rebuild prevents false reassignment against old pours. No net check or manufacturing rule was relaxed. The explicit-pad selector has 35 passing source tests and a production build; it is not installed as the shared executable.++No candidate is landed. Current/thermal/finish gates remain open pending complete same-board evidence, component/schematic updates and package cooling. There are 73 raw takes; the newest 29.6-second current-screen milestone take decoded and its contact sheet was reviewed. The final narrated film is not assembled.++## Latest continuation — v30 fine mesh running++V27 failed 0.1 mm with GND 72.94, LOAD_POS 60.66 and SHUNT_P 70.56 A/mm2. V29 splits the return transfer and widens the two necks; v30 additionally fills the inside shunt bend. V30 passes native DRC 0/0/0 and the 0.2 mm three-net screen. Fresh v29/v30 fine solves are running. V30 plan is prepared but marked DO NOT EXECUTE; zone definitions and existing copper nets are unchanged. Installed AIFlow 0.1.81 correctly rejects the v27 fine result in an isolated CLI regression. The new current-map review clip brings raw takes to 70; storyboard now has 13 clips. Live board unchanged, current and thermal gates open.++## Current checkpoint — corrected plated-wall model, candidate v27++AIFlow 0.1.81 is source-pushed, registry-published and installed here; 130 tests and workflow checks pass. Fields PR9 remains under owner review and shared Fields is unchanged. Candidate v27 has zero native DRC errors, opens and warnings with actual project libraries present; complete diff has 44 copper changes, Q2/R7/U3 moves and zero existing copper net changes. Corrected 0.2 mm GND/LOAD_POS/SHUNT_P peaks are 50.70/57.68/59.67 A/mm2. The 0.1 mm refinement is running. Live board unchanged; current and thermal acceptance remain open. Continue engineering rather than stopping at this checkpoint.++## Current checkpoint — plated-hole model correction++Do not execute the v18 landing plan. The 0.1 mm refinement produced GND 102.24, drain 63.25 and shunt 78.40 A/mm². The complete GND and shunt peak cells lie inside drilled holes: the old raster painted solid discs and coupled layers at their centers. An isolated Fields correction removes drill voids and distributes wall coupling, with 32 passing tests and a production build. Its v18 rerun still fails real surface screens (GND 71.93 and shunt 89.36 at 0.2 mm); the fix does not manufacture a passing result. Barrel currents are now reported separately.++Candidate v21 preserves the three dedicated shunt thermal vias, removes two intermediate power vias that constrain in-plane copper, and restores smaller drills in two narrow paths. Native net invariants and DRC pass (zero errors/opens, 15 inherited warnings); its corrected-field solve is running. Neither candidate is landed. Fields source remains under owner review; installed shared Fields is unchanged.++## Active checkpoint — unclipped current rework v18++The isolated candidate passes native net-intent invariants, DRC (zero errors and opens; 15 inherited library warnings), and the six-net 0.2 mm current screen. Ground 58.70, drain 57.30 and shunt 59.33 A/mm² remain below the unchanged 60 threshold at this mesh only. A 0.1 mm three-net refinement is running. The live PCB is unchanged. No current or thermal gate is marked passed.++The saved diff inventories 37 copper changes and moves Q2, R7 and U3. A landing plan is prepared but must not execute before the refinement review. A heat-source attribution run, deliberately omitting Q1 loss, still predicts D1 copper rise of 107.2 C in still air or 82.4 C at the model's moving-air coefficient. This is not an operating case or a cooling qualification; it identifies the diode spread as remaining work.++Twelve individually described action clips are open in the video-post storyboard. User feedback is pending before film concatenation; board work continues independently. The package's missing executable is already tracked as adom/adom-video-post#1; a local source build provides the review app without claiming a shared release fix.++Latest checkpoint: AIFlow 0.1.80 is published and installed (128 tests). Fields PR8 supersedes PR7 and contains unclipped current reporting plus consistent CLI/viewer summaries. Native v11 candidate passes DRC and copper-net preservation, but still fails density: GND 66.49, LOAD_POS 64.95, SHUNT_P 60.97 at 0.2 mm. v12 is under native checks; see tools/hotspot_via_candidate_v12.py. No candidate has landed. Raw video count is 69. Continue this current rework and full thermal/firmware/molecule/video scope; do not stop at this checkpoint.++Critical current finding: Fields peakJ was display-clipped. Unclipped 0.2 mm screening reports LOAD_POS 68.6 and SHUNT_P 61.0 A/mm² above 60. The earlier isolated pass is invalid for maximum-density acceptance; live current stayed failed. Review the actual hotspot geometry and fix the source reporting before acceptance. See design/step12-unclipped-peaks.json.++Latest 10 October work: AIFlow 0.1.79 is source-published, registry-published and installed; 127 workspace tests passed. Explicit branch-current analysis passed an isolated copy of this run, not the live acceptance gate. Fields PR 6 remains open on PR 5. The current ground review is quantifying analog-supply return offset on SHUNT_N_SENSE. A centerline resistor graph refused disconnected overlaps, so a separately instrumented copper-field diagnostic is being used instead. The dashboard is on step 12 and the reviewed raw video inventory is 68. Continue current/thermal engineering, not another source-release handoff.++# Active completion contract++Current-step gate is explicitly failed: its width-only heuristic flags DUT_POS 0.25 mm and DUT_FUSED 1.0 mm, and a same-input formal Fields report is missing. The saved main-path review proves separate continuous front-layer paths of 1.5 mm and 2.0 mm respectively (IPC-2221 estimates 8.58 C and 5.34 C at 3 A), but excludes branch loads/pad necks and does not override the gate. See design/step12-main-path-review.json. Next work is a terminal-aware capacity check and supported same-board Fields integration, not blindly widening the voltage-sense branch.++The active objective is to finish this electronic-load design through AIFlow, then its wiki/molecule/control-panel delivery and edited demo. Dashboard appearance, tool fixes and research are supporting work, not completion. After a supporting task, resume the earliest incomplete engineering gate without requiring another user nudge. Read this file and the live run on resumption; never infer completion from a previous chat response.++## Latest accepted board++Native-saved board 19 SHA-256 `54f1aab0a34622d1c3675c13f4aeb7a678b0cee8b5a4d3bfd7484b10edb8dcf6` is adopted. Seven existing copper zones were preserved and two Kelvin-sense pour keepouts added, with zero native DRC errors/opens and 15 inherited library warnings. Step 9 completed with explicit Q1 and RSH1 generic via-count exceptions; these are not thermal passes. See via-planning-review.md and pour-review.md. Rebuild the routing/pour proofs invalidated by adoption, then advance outline and same-board current/thermal checks.++Shared Fields is 0.7.1 as of this continuation; physical two-layer/plated-pad PR 5 is still open. Its rectangular heat blocks contact the PCB face, not the MOSFET case. Do not substitute that model for the missing package/interface/sink/airflow analysis. The four-hole 40 mm sink pattern was rejected against routed copper. The stock Wakefield 680-125220 candidate aligns a factory TO-220 hole with the existing Q1 3.5 mm hole and clears the current fitted-body/probe envelope screen; see stock-cooling-candidate.md. Exact model/contact, fasteners, insulation, cradle support, mating access and airflow remain unresolved. Do not call this a qualified assembly.++## Resume here++1. Inspect the live AdomLapper board and AIFlow run; current required step is current (12/19). Board 19 is adopted; routing/pour proofs and rounded-outline verification passed. Do not replay the successful native zone transaction. The outline proof is recorded. Repeated landing unexpectedly regenerated keepout UUIDs while preserving complete definitions; see design/step10-repeat-review.json. Preserve the 5 W basis and unresolved physical cooling/Fields gates.+2. Continue the compact 5 W prototype basis announced on 9 October. It follows the original size/cost priority and 5 V/1 A DUT. The prior 25 W assistant assumption is documented as a future option, not a blocker. Keep the 55 C trip and all validation requirements.+3. Solve the actual MOSFET case/interface/sink/fan assembly and probe clearance. The shunt-via candidate now passes only with the verified GND stitch at (133.018,77.818). Earlier candidates without that stitch disconnected ground; do not replay them. Via-count acknowledgements require actual engineering justification, not a desire to advance the timeline.+4. Complete and revalidate pours, outline, same-board current/thermal Fields screens, net tour, full fitted-model/silkscreen review, native 3D, finish and fabrication exports in the enforced sequence. Record significant real actions. Never mark these passed to bypass an unresolved gate.+5. Complete firmware/HAL/USB integration and control-panel behavior, full component/provenance review, molecule assets, cost/BOM coverage and wiki delivery. Label hardware-dependent calibration, airflow, fan-stall and thermal qualification explicitly unverified until tested.+6. Edit and review the 4–5 minute narrated film from actual clips. Label simulations and historical reviews; exclude static/rejected takes. No YouTube upload is implied by preparation alone.++The finish gate has not passed. The board is not released for fabrication.++## Fan component delivery++Sunon MF40200V1-1000U-G99 version 0.2.3 is published in source and registry: factory flying leads, explicitly added Harwin harness, connector symbols/header footprint, complete static STEP/GLB variants and gentle 20-second hero cycle. Published playback, stopped mode and native connector parsing passed. Wiki Skill Pack 0.8.42 and Component Widgets 1.1.17 teach restrained state heroes and honest termination variants. Three raw recordings were added; two full-cycle takes decoded and reviewed, one short take is not a complete cycle. This supporting task does not complete load cooling or the finish gate.++## Firmware continuation++Fresh latch acknowledgement, instrument readback/fault injection, and null-sensor diagnostic host connections are implemented and host-tested (25 Python tests plus C suites). MCU output stays locked; no flash occurred. Diagnostic I2C integration, conversion-age cache and fake-HAL tests now pass; nominal ADC/temperature adaptation now compiles and its conversion math passes host tests. ADC adapter fault injection now passes for every HAL operation, channel isolation, saturation and stale/timer-wrap handling. Board calibration and physical timing tests remain. Do not mistake these checks for physical qualification or use them to close thermal/finish gates. The reviewed fan-stall replay brings the raw inventory to 63 at that historical checkpoint (the latest static fastener-page take is excluded from the action edit).++## Browser recovery and fastener review++AIFlow 0.1.77 source commit `8ee8f9a3558e1d49a5faa2787f9fe326dc9cfcab` is directly published, registry-published and locally installed. Its visible-challenge regression passes against the recorded Native Browser evidence. Colby's installed version is not verified. See cooling-fastener-review.md: no examined PPS washer establishes our conservative full-depth insulation geometry. This is an unresolved mechanical gate, not authorization to drill or waive it.

@@ -1,90 +1,29 @@-# Current checkpoint — 2026-10-10, 15:50 UTC+# Active completion plan -The exact adopted board is AIFlow board 21 / candidate v85. Native DRC has zero errors, warnings and opens. All six current checks pass on the matching 0.1 mm Fields report: DUT_POS 53.48, DUT_FUSED 50.66, LOAD_POS 40.11, SHUNT_P 56.50, GND 58.18 and 5V_AUX 19.04 A/mm² surface maxima, against the unchanged 60 A/mm² screen. AIFlow also checks every plated connection and explicit physical terminal. The dashboard has advanced to Thermal (13 of 19).+Continue the custom electronic load through AIFlow, firmware/control-panel and molecule delivery, complete wiki assets and the reviewed 4–5 minute narrated film. Supporting releases or status answers do not complete this objective. Do not order, fabricate, flash or publish to YouTube without authorization. -The schematic/netlist/BOM and native models now include SBR10U45SP5-13. The v85 change removes one redundant track fully contained in a wider track, preserving physical copper and all other circuit intent. Both native views were refreshed and inspected. [Adoption evidence](../design/v85-adoption-review.json) · [Exact report](../checkpoints/unclipped-hotspots-v1/fields-v85-full-0p1/fields.json).+## Resume from this state -Thermal acceptance is still failed. The board-only model injects 5.5 W through Q1’s PCB terminal region and lacks its external case-to-heatsink path; its extreme temperatures are not a prediction of an assembled cooled unit. The actual interface, supported sink/fan mounting, duct pressure/flow and fault behavior require completion. The stock sink envelope clears all 91 fitted models and probe approaches, but this excludes mating connectors and hardware. [Package sensitivity](package-cooling-review.md) · [Fan airflow review](fan-airflow-review.md).+- Project: `/home/adom/project/adom-custom-electronic-load`; AIFlow run `aiflow/run`, id `bfd48cdd114aa95e`; target AdomLapper, thread `adom-custom-load`.+- Saved PCB v85 / AIFlow board 21: SHA-256 `1681eb90e49f4f229afe89bb75ff1738b7503907a52cd174e8b3d64b120082f4`. Verify the live path/revision before any native mutation. Native DRC recorded zero errors, warnings and opens. Preserve all current net intent and successful native zone work.+- Current step: Thermal (13/19), twelve steps done. Current screen passed for the exact formal 35 µm inputs; thermal is failed. No finish or fabrication release.+- Two-layer, 5 W / 24 V / 3 A simultaneous envelope; first DUT 5 V / 1 A. Keep Q1 5.5 W guard allowance, 40 C ambient and 55 C case ceiling. Never lower a rating or limit to advance a gate.+- [Finished-copper dependency](finished-copper-review.md): private 3rdPartyFab guide lists 0.5 oz without resolving starting versus finished copper. The user clarification is pending. Minimum finished surface and barrel copper require confirmation. At 17.5 µm, five nets fail the unchanged density limit. Do not adopt a stackup by assuming an answer.+- Candidate 35 µm / 1.51 mm dielectric refinement passes six current screens at 0.1 mm, with maximum 58.14 A/mm². `checkpoints/stackup-v85/stackup-refinement-review.json` binds inputs. It does not replace the formal specification; board-only thermal still fails. -AIFlow 0.1.86 is published and installed with 147 tests passing, verified live presentation refresh and read-only existing-pour verification. Fields PR10 remains a separate owner-review change, and the shared runtime is not replaced. There are 89 raw takes, including static/rejected footage, 33 reviewed excerpts and 29 storyboard clips. The latest excerpt records the actual current-to-thermal dashboard transition. The final narrated 4–5 minute film remains unfinished.+## Next engineering actions -Next: complete the package/interface/duct cooling design and represent its supported operating/fault cases; then same-input thermal acceptance, Fields/pour walkthroughs, current-board silkscreen/3D review, prototype manufacturing outputs and final video. Physical calibration, safety tests and industrial qualification remain separate from digital design acceptance. No fabrication release, order or flash has occurred.+1. Resolve the complete case-to-sink stack. [Nominal PEEK fastener study](../mechanical/peek-fastener-study/README.md) clears current component and sensor geometry, but interface outline/hole, tolerances, preload, creep, vibration retention and tool access remain open. Do not substitute fit for qualification. [Sensor candidate](../mechanical/sensor-study/README.md) has routed leads and J10 mating parts; adhesive/contact and case-tracking lag remain unresolved.+2. Establish installed airflow and fault operation. Fan RPM does not prove airflow; a blocked fan may keep spinning. Package-cooling sensitivity predicts approximately 75.6 C still / 51.1 C moving under assumed sink values. These are not measured or accepted results. Preserve the full-power still-air failure and solve the actual cooling/fault strategy.+3. After supported physical/spec changes, rerun exact-input current and thermal acceptance. Continue fields, net tour, silkscreen, native 3D, finish and export in enforced order. Review-only manufacturing exports already exist; do not present them as released.+4. Complete firmware/calibration and molecule integration. Control panel 0.0.4 drives the digital rotor only from fresh valid hardware RPM; stale/disconnected means unknown/paused. Host tests pass; output remains locked and hardware unflashed. Physical timing, sensor calibration and load accuracy remain unverified.+5. Complete procurement and component provenance. [Cost review](cost/README.md) lists $70.88 known proposed subtotal with 63 board references unpriced and substantial assembly/process exclusions. Candidate hardware is not an approved BOM.+6. Continue significant-action captures. Inventory is 90 raw takes, 34 reviewed excerpts and 30 storyboard candidates. Three scenes have draft narration in `videos/narrated-review`; storyboard is `videos/build-storyboard.json`, port 8798. Obtain per-clip feedback before final assembly as required by aiflow-process-video. No final film exists. -## Historical checkpoints below+## Tool and delivery boundaries -## Latest checkpoint — lower-loss rectifier feasibility+AIFlow 0.1.86 source, registry and installed executable were verified separately; direct updates are authorized but must use fresh upstream state. Fields owner PRs remain review-only; never merge them or replace shared Fields 8875. The isolated solver is in `fields-package-load-target/release/adom-fields`. -SBR10U45SP5-13 on isolated v82: six explicit-pad current screens pass at 0.1 mm; D1 32.8 C still / 24.7 C moving under unchanged 35 C limit. Q1 heat remains excluded: not full-board thermal acceptance. V83 extra 16 vias did not improve the previous diode result and are not selected. Prepare SBR library/schematic/BOM/model adoption, then same-input formal checks. AIFlow 0.1.83 source and registry are published and installed, 133 tests pass. Live board19 verified unchanged.+Keep the timeline visible at `http://8893.localhost:63548/`. Wrap real external engineering in `adom-aiflow exec`; no idle heartbeat. Register unique artifact filenames to avoid the known basename collision. Keep public fabrication terminology to 3rdPartyFab. Preserve other threads, pinned bridges and user browser tabs. -## Latest continuation — combined current and diode cooling candidate--AIFlow 0.1.82 remains published and installed. Shared Fields is now 0.7.1 from another thread; this work does not replace it. PR9 remains under owner review. Board19 remains live and unchanged.--V77 passes the isolated fine-grid main-net screen: LOAD_POS 56.09, GND 58.31, SHUNT_P 56.50 A/mm² against 60. The Q1 drain land variant preserves its 1.1 mm drill and 0.25 mm nominal minimum annular ring. V80's PowerDI5 diode study predicts D1 +34.5°C still / +26.0°C assumed moving convection, with Q1 heat excluded. V82 combines those layouts and has zero native DRC errors, warnings and opens. Its full six-net fine-grid current maxima pass (highest GND 58.18 A/mm²), but D1 still-air rise is 36.4°C and fails 35°C. The explicit-pad coarse solve passes at 59.04 A/mm² / 34.6°C; finer thermal evidence controls. V83 adds 16 off-pad thermal vias for native validation and refinement. Physical-pad support is in owner-review PR10.--Expected copper nets remain checked before/after refill and save/reload. Clearing stale zone fills before connectivity rebuild prevents false reassignment against old pours. No net check or manufacturing rule was relaxed. The explicit-pad selector has 35 passing source tests and a production build; it is not installed as the shared executable.--No candidate is landed. Current/thermal/finish gates remain open pending complete same-board evidence, component/schematic updates and package cooling. There are 73 raw takes; the newest 29.6-second current-screen milestone take decoded and its contact sheet was reviewed. The final narrated film is not assembled.--## Latest continuation — v30 fine mesh running--V27 failed 0.1 mm with GND 72.94, LOAD_POS 60.66 and SHUNT_P 70.56 A/mm2. V29 splits the return transfer and widens the two necks; v30 additionally fills the inside shunt bend. V30 passes native DRC 0/0/0 and the 0.2 mm three-net screen. Fresh v29/v30 fine solves are running. V30 plan is prepared but marked DO NOT EXECUTE; zone definitions and existing copper nets are unchanged. Installed AIFlow 0.1.81 correctly rejects the v27 fine result in an isolated CLI regression. The new current-map review clip brings raw takes to 70; storyboard now has 13 clips. Live board unchanged, current and thermal gates open.--## Current checkpoint — corrected plated-wall model, candidate v27--AIFlow 0.1.81 is source-pushed, registry-published and installed here; 130 tests and workflow checks pass. Fields PR9 remains under owner review and shared Fields is unchanged. Candidate v27 has zero native DRC errors, opens and warnings with actual project libraries present; complete diff has 44 copper changes, Q2/R7/U3 moves and zero existing copper net changes. Corrected 0.2 mm GND/LOAD_POS/SHUNT_P peaks are 50.70/57.68/59.67 A/mm2. The 0.1 mm refinement is running. Live board unchanged; current and thermal acceptance remain open. Continue engineering rather than stopping at this checkpoint.--## Current checkpoint — plated-hole model correction--Do not execute the v18 landing plan. The 0.1 mm refinement produced GND 102.24, drain 63.25 and shunt 78.40 A/mm². The complete GND and shunt peak cells lie inside drilled holes: the old raster painted solid discs and coupled layers at their centers. An isolated Fields correction removes drill voids and distributes wall coupling, with 32 passing tests and a production build. Its v18 rerun still fails real surface screens (GND 71.93 and shunt 89.36 at 0.2 mm); the fix does not manufacture a passing result. Barrel currents are now reported separately.--Candidate v21 preserves the three dedicated shunt thermal vias, removes two intermediate power vias that constrain in-plane copper, and restores smaller drills in two narrow paths. Native net invariants and DRC pass (zero errors/opens, 15 inherited warnings); its corrected-field solve is running. Neither candidate is landed. Fields source remains under owner review; installed shared Fields is unchanged.--## Active checkpoint — unclipped current rework v18--The isolated candidate passes native net-intent invariants, DRC (zero errors and opens; 15 inherited library warnings), and the six-net 0.2 mm current screen. Ground 58.70, drain 57.30 and shunt 59.33 A/mm² remain below the unchanged 60 threshold at this mesh only. A 0.1 mm three-net refinement is running. The live PCB is unchanged. No current or thermal gate is marked passed.--The saved diff inventories 37 copper changes and moves Q2, R7 and U3. A landing plan is prepared but must not execute before the refinement review. A heat-source attribution run, deliberately omitting Q1 loss, still predicts D1 copper rise of 107.2 C in still air or 82.4 C at the model's moving-air coefficient. This is not an operating case or a cooling qualification; it identifies the diode spread as remaining work.--Twelve individually described action clips are open in the video-post storyboard. User feedback is pending before film concatenation; board work continues independently. The package's missing executable is already tracked as adom/adom-video-post#1; a local source build provides the review app without claiming a shared release fix.--Latest checkpoint: AIFlow 0.1.80 is published and installed (128 tests). Fields PR8 supersedes PR7 and contains unclipped current reporting plus consistent CLI/viewer summaries. Native v11 candidate passes DRC and copper-net preservation, but still fails density: GND 66.49, LOAD_POS 64.95, SHUNT_P 60.97 at 0.2 mm. v12 is under native checks; see tools/hotspot_via_candidate_v12.py. No candidate has landed. Raw video count is 69. Continue this current rework and full thermal/firmware/molecule/video scope; do not stop at this checkpoint.--Critical current finding: Fields peakJ was display-clipped. Unclipped 0.2 mm screening reports LOAD_POS 68.6 and SHUNT_P 61.0 A/mm² above 60. The earlier isolated pass is invalid for maximum-density acceptance; live current stayed failed. Review the actual hotspot geometry and fix the source reporting before acceptance. See design/step12-unclipped-peaks.json.--Latest 10 October work: AIFlow 0.1.79 is source-published, registry-published and installed; 127 workspace tests passed. Explicit branch-current analysis passed an isolated copy of this run, not the live acceptance gate. Fields PR 6 remains open on PR 5. The current ground review is quantifying analog-supply return offset on SHUNT_N_SENSE. A centerline resistor graph refused disconnected overlaps, so a separately instrumented copper-field diagnostic is being used instead. The dashboard is on step 12 and the reviewed raw video inventory is 68. Continue current/thermal engineering, not another source-release handoff.--# Active completion contract--Current-step gate is explicitly failed: its width-only heuristic flags DUT_POS 0.25 mm and DUT_FUSED 1.0 mm, and a same-input formal Fields report is missing. The saved main-path review proves separate continuous front-layer paths of 1.5 mm and 2.0 mm respectively (IPC-2221 estimates 8.58 C and 5.34 C at 3 A), but excludes branch loads/pad necks and does not override the gate. See design/step12-main-path-review.json. Next work is a terminal-aware capacity check and supported same-board Fields integration, not blindly widening the voltage-sense branch.--The active objective is to finish this electronic-load design through AIFlow, then its wiki/molecule/control-panel delivery and edited demo. Dashboard appearance, tool fixes and research are supporting work, not completion. After a supporting task, resume the earliest incomplete engineering gate without requiring another user nudge. Read this file and the live run on resumption; never infer completion from a previous chat response.--## Latest accepted board--Native-saved board 19 SHA-256 `54f1aab0a34622d1c3675c13f4aeb7a678b0cee8b5a4d3bfd7484b10edb8dcf6` is adopted. Seven existing copper zones were preserved and two Kelvin-sense pour keepouts added, with zero native DRC errors/opens and 15 inherited library warnings. Step 9 completed with explicit Q1 and RSH1 generic via-count exceptions; these are not thermal passes. See via-planning-review.md and pour-review.md. Rebuild the routing/pour proofs invalidated by adoption, then advance outline and same-board current/thermal checks.--Shared Fields is 0.7.1 as of this continuation; physical two-layer/plated-pad PR 5 is still open. Its rectangular heat blocks contact the PCB face, not the MOSFET case. Do not substitute that model for the missing package/interface/sink/airflow analysis. The four-hole 40 mm sink pattern was rejected against routed copper. The stock Wakefield 680-125220 candidate aligns a factory TO-220 hole with the existing Q1 3.5 mm hole and clears the current fitted-body/probe envelope screen; see stock-cooling-candidate.md. Exact model/contact, fasteners, insulation, cradle support, mating access and airflow remain unresolved. Do not call this a qualified assembly.--## Resume here--1. Inspect the live AdomLapper board and AIFlow run; current required step is current (12/19). Board 19 is adopted; routing/pour proofs and rounded-outline verification passed. Do not replay the successful native zone transaction. The outline proof is recorded. Repeated landing unexpectedly regenerated keepout UUIDs while preserving complete definitions; see design/step10-repeat-review.json. Preserve the 5 W basis and unresolved physical cooling/Fields gates.-2. Continue the compact 5 W prototype basis announced on 9 October. It follows the original size/cost priority and 5 V/1 A DUT. The prior 25 W assistant assumption is documented as a future option, not a blocker. Keep the 55 C trip and all validation requirements.-3. Solve the actual MOSFET case/interface/sink/fan assembly and probe clearance. The shunt-via candidate now passes only with the verified GND stitch at (133.018,77.818). Earlier candidates without that stitch disconnected ground; do not replay them. Via-count acknowledgements require actual engineering justification, not a desire to advance the timeline.-4. Complete and revalidate pours, outline, same-board current/thermal Fields screens, net tour, full fitted-model/silkscreen review, native 3D, finish and fabrication exports in the enforced sequence. Record significant real actions. Never mark these passed to bypass an unresolved gate.-5. Complete firmware/HAL/USB integration and control-panel behavior, full component/provenance review, molecule assets, cost/BOM coverage and wiki delivery. Label hardware-dependent calibration, airflow, fan-stall and thermal qualification explicitly unverified until tested.-6. Edit and review the 4–5 minute narrated film from actual clips. Label simulations and historical reviews; exclude static/rejected takes. No YouTube upload is implied by preparation alone.--The finish gate has not passed. The board is not released for fabrication.--## Fan component delivery--Sunon MF40200V1-1000U-G99 version 0.2.3 is published in source and registry: factory flying leads, explicitly added Harwin harness, connector symbols/header footprint, complete static STEP/GLB variants and gentle 20-second hero cycle. Published playback, stopped mode and native connector parsing passed. Wiki Skill Pack 0.8.42 and Component Widgets 1.1.17 teach restrained state heroes and honest termination variants. Three raw recordings were added; two full-cycle takes decoded and reviewed, one short take is not a complete cycle. This supporting task does not complete load cooling or the finish gate.--## Firmware continuation--Fresh latch acknowledgement, instrument readback/fault injection, and null-sensor diagnostic host connections are implemented and host-tested (25 Python tests plus C suites). MCU output stays locked; no flash occurred. Diagnostic I2C integration, conversion-age cache and fake-HAL tests now pass; nominal ADC/temperature adaptation now compiles and its conversion math passes host tests. ADC adapter fault injection now passes for every HAL operation, channel isolation, saturation and stale/timer-wrap handling. Board calibration and physical timing tests remain. Do not mistake these checks for physical qualification or use them to close thermal/finish gates. The reviewed fan-stall replay brings the raw inventory to 63 at that historical checkpoint (the latest static fastener-page take is excluded from the action edit).--## Browser recovery and fastener review--AIFlow 0.1.77 source commit `8ee8f9a3558e1d49a5faa2787f9fe326dc9cfcab` is directly published, registry-published and locally installed. Its visible-challenge regression passes against the recorded Native Browser evidence. Colby's installed version is not verified. See cooling-fastener-review.md: no examined PPS washer establishes our conservative full-depth insulation geometry. This is an unresolved mechanical gate, not authorization to drill or waive it.+Before a final handoff run `finish-guard --json`. Continue while useful authorized work remains; a failed thermal gate or pending owner review is not by itself a global stop. [Historical checkpoints](completion-history-2026-10-10.md) are retained for evidence, not as current instructions.