project
Adom Custom Electronic Load
Public Made by Adomby adom
Two-layer digitally controlled electronic-load prototype. Compact R11 is under active electrical, cooling and probe-access review; not a manufacturing release.
← Commit history
README.md+5−3@@ -8,13 +8,15 @@ The architecture uses an IXTP15N50L2 linear MOSFET, four-terminal 20 mΩ shunt, ## Current evidence -- A 102-component hierarchical schematic passes native KiCad ERC; all 52 intended nets match the native exported netlist.+- A 104-component hierarchical schematic passes native KiCad ERC; all 52 intended nets match the native exported netlist. - Six limited current-servo sensitivity cases pass using TI's amplifier model and an approximate MOSFET. This is not full circuit or hardware validation. - The portable C safety-policy core passes host tests. Flashable MCU firmware and USB integration are not complete.-- A native molecule PCB and portable component models exist. Placement review is active; routing and fabrication outputs are not complete.+- The two-layer placement candidate has zero native DRC violations and 220 unrouted connections. All nine planned measurements have probe access, including dedicated fan-tach and Kelvin-minus pads. Routing and fabrication outputs are not complete.+- The fan has a [component page with GLB motion states](https://wiki.adom.inc/adom/mf40200v1-1000u-g99). Its preview is simulated; shared viewer integration remains proposed.+- The [thermal budget](docs/thermal-budget.md) now matches the 55 °C firmware trip ceiling. The 25 W target is not validated; bring-up remains capped at 5 W. - Build footage is being collected. Failed/static captures are identified in the shot log rather than included as action footage. -Read the [engineering status](docs/status.md), [placement review](docs/placement-review.md), [cost breakdown](docs/cost/README.md), [firmware/control-panel contract](docs/firmware-contract.md), and [raw clip log](videos/shotlog.json). The [AI Flow report](docs/runs/board-codex-20261007-1749/README.md) records the run.+Read the [engineering status](docs/status.md), [placement review](docs/placement-review.md), [library review](docs/library-review.md), [cost breakdown](docs/cost/README.md), [firmware/control-panel contract](docs/firmware-contract.md), and [raw clip log](videos/shotlog.json). The [AI Flow report](docs/runs/board-codex-20261007-1749/README.md) records the run. The 3rdPartyFab two-layer rules are loaded. Native DRC, current/thermal analysis, the cooling assembly, physical calibration and industrial qualification must pass before production use. No hardware has been built or ordered.