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ADM3075EYRZ

Analog Devices · RS-485/RS-422 ICs · SOIC-8

ADM3075EYRZ from Analog Devices, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output; when enabled, RO is high if (A − B) ≥ −50 mV and low if (A − B) ≤ −200 mV.
2 RE input Receiver output enable; a low level enables the receiver output, a high level places it in high impedance, and RE high with DE low enters low power shutdown mode.
3 DE input Driver output enable; a high level enables the driver A and B outputs, a low level places them in high impedance, and RE high with DE low enters low power shutdown mode.
4 DI input Driver input; when the driver is enabled, a logic low forces A low and B high, and a logic high forces A high and B low.
5 GND power_in Ground.
6 A bidirectional Noninverting receiver input A and noninverting driver output A.
7 B bidirectional Inverting receiver input B and inverting driver output B.
8 VCC power_in Power supply, 3.3 V ± 10%; bypass VCC to GND with a 0.1 µF capacitor.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package SOIC-8
Category Communication Interface Chip/UART/485/232
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VCC to GND VCC -0.3 6 V TA = 25°C 8
Digital Input/Output Voltage (DE, RE, DI) -0.3 6 V TA = 25°C 8
Driver Output (A, B)/Receiver Input (A, B) Voltage -8 13 V TA = 25°C 8
Driver Output Current -250 250 mA TA = 25°C 8
Operating Temperature Range (ADM307xEY) -40 125 °C ADM307xEY 8
Storage Temperature Range -65 150 °C 8
Lead Temperature, Soldering (10 sec) 300 °C 10 sec 8
Lead Temperature, Vapor Phase (10 sec) 215 °C 10 sec 8
Lead Temperature, Infrared (15 sec) 220 °C 15 sec 8
Power Supply Tolerance VCC -10 10 % Power Supply, 3.3 V ± 10% 9
Power Supply Nominal VCC 3.3 V 3.3 V ± 10% 9
Thermal Impedance, 8-Lead SOIC_N θJA 158 °C/W 8-Lead SOIC_N 8

CAD (KiCad official)

  • Symbol: ADM3075EYRZ
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: adm3075eyrz-etched.step / adm3075eyrz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); adm3075eyrz.step / adm3075eyrz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (20 pp, sha256 f6e1b96c4dce3dff, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF