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ADM3067EBRZ

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Analog Devices Pre-ordered Chips, SOIC-14. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentinterface icsadm3067ebrzfactory-2.0.0extractor-text

Verified ADM3067EBRZ

by Ray · last 30 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

30 Oct 2026RayPublished by the parts factory: tier mfr, 14 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: ADM3067EBRZ · SOIC-14 · 14 pins
  • ✓copper: 14 copper pads, none touching another net
  • ✓datasheet: all 14 pin names found in the 25-page datasheet
  • ✓distributor: lcsc C658157, digikey ADM3067EBRZ-ND, mouser 584-ADM3067EBRZ
  • ✓family: SOIC-14_3.9x8.7mm_P1.27mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-iygjvx0r/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 14 pins = 14 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 14 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ adm3067ebrz.kicad_sym✓ adm3067ebrz.kicad_mod✓ adm3067ebrz.step
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ADM3067EBRZ

Analog Devices · Pre-ordered Chips · SOIC-14

ADM3067EBRZ from Analog Devices, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NIC unconnected No internal connection; this pin is not internally connected.
2 RO output Receiver output data, high when (A − B) ≥ −30 mV and low when (A − B) ≤ −200 mV, tristated when RE is driven high.
3 RE input Active-low receiver enable input; driving low enables the receiver and driving high disables it.
4 DE input Driver enable; a high level enables the driver differential outputs Y and Z, a low level places them in high impedance.
5 DI input Transmit data input; data to be transmitted by the driver is applied to this input.
6 GND power_in Ground.
7 GND power_in Ground.
8 NIC unconnected No internal connection; this pin is not internally connected.
9 Y tri_state Driver noninverting output; high impedance when the driver is disabled or VCC is powered down to avoid overloading the bus.
10 Z tri_state Driver inverting output; high impedance when the driver is disabled or VCC is powered down to avoid overloading the bus.
11 B input Inverting receiver input.
12 A input Noninverting receiver input.
13 VCC power_in 3.0 V to 5.5 V power supply; a 0.1 µF decoupling capacitor to GND is recommended.
14 VCC power_in 3.0 V to 5.5 V power supply; a 0.1 µF decoupling capacitor to GND is recommended.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package SOIC-14
Category Interface ICs
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VCC 3 5.5 V 3.0 V to 5.5 V operating voltage range on VCC 1
No Load Supply Current ICC 3.5 7.5 mA DE = VIO, RE = 0 V 4
No Load Supply Current ICC 3 4.5 mA DE = 0 V, RE = 0 V 4
Supply Current, Data Rate = 50 Mbps ICC 107 172 mA RL = 54 Ω, DE = VIO, RE = 0 V (VCC ≥ 4.5 V) 4
Supply Current, Data Rate = 50 Mbps ICC 67 75 mA RL = 54 Ω, DE = VIO, RE = 0 V (VCC = 3.0 V) 4
Supply Current in Shutdown Mode ISHDN 210 450 µA DE = 0 V, RE = VIO 4
Output Voltage, Loaded /VOD2/ 2 2.5 V VCC ≥ 3.0 V, RL = 50 Ω, see Figure 38 (max printed as VCC) 4
Output Voltage, Loaded /VOD2/ 1.5 2.1 V VCC ≥ 3.0 V, RL = 27 Ω (RS-485), see Figure 38 (max printed as VCC) 4
Output Voltage, Loaded /VOD2/ 2.1 3.5 V VCC ≥ 4.5 V, RL = 50 Ω, see Figure 38 (max printed as VCC) 4
Output Voltage, Loaded /VOD2/ 2.1 3 V VCC ≥ 4.5 V, RL = 27 Ω (RS-485), see Figure 38 (max printed as VCC) 4
Output Voltage over common mode /VOD3/ 1.5 2.1 V VCC ≥ 3.0 V, −7 V ≤ VCM ≤ +12 V, see Figure 39 (max printed as VCC) 4
Output Voltage over common mode /VOD3/ 2.1 3 V VCC ≥ 4.5 V, −7 V ≤ VCM ≤ +12 V, see Figure 39 (max printed as VCC) 4
Change in Differential Output Voltage for Complementary Output States ∆/VOD/ 0.2 V RL = 27 Ω or 50 Ω, see Figure 38 4
Common-Mode Output Voltage VOC 1.6 3 V RL = 27 Ω or 50 Ω, see Figure 38 4
Change in Common-Mode Voltage for Complementary Output States ∆/VOC/ 0.2 V RL = 27 Ω or 50 Ω, see Figure 38 4
Output Short-Circuit Current IOS -250 250 mA −7 V < VOUT < +12 V 4
Output Leakage (Y, Z) IO 100 µA DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V, VIN = 12 V 4
Output Leakage (Y, Z) IO -100 µA DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V, VIN = −7 V 4
Logic Input Voltage Low VIL 0.33 × VIO DE, RE, DI, 1.62 V ≤ VIO ≤ 5.5 V 4
Logic Input Voltage High VIH 0.67 × VIO DE, RE, DI, 1.62 V ≤ VIO ≤ 5.5 V 4
Logic Input Current II -2 2 µA DE, RE, DI, 1.62 V ≤ VIO ≤ 5.5 V, 0 V ≤ VIN ≤ VIO 4
Differential Input Threshold Voltage VTH -200 -125 -30 mV −7 V < VCM < +12 V 4
Input Voltage Hysteresis VHYS 30 mV −7 V < VCM < +12 V 4
Receiver Input Current (A, B) II 0.1 0.25 mA DE = 0 V, VCC = powered/unpowered, VIN = 12 V 4
Receiver Input Current (A, B) II -0.2 -0.1 mA DE = 0 V, VCC = powered/unpowered, VIN = −7 V 4
Line Input Resistance RIN 48 96 kΩ −7 V ≤ VCM ≤ +12 V 4
Supply Voltage VCC 6 V VCC to GND 8
Digital Input and Output Voltage (DE, RE, DI, RO) -0.3 V −0.3 V to VIO + 0.3 V (VIO = VCC on ADM3067E); upper limit is VIO + 0.3 V 8
Driver Output and Receiver Input Voltage -9 14 V 8
Operating Temperature Range (B grade) -40 125 °C −40°C to +125°C 8
Storage Temperature Range -65 150 °C 8
Continuous Total Power Dissipation, 14-Lead SOIC_N 0.239 W 14-Lead SOIC_N 8
Maximum Junction Temperature TJ 150 °C 8
Lead Temperature, Soldering 300 °C 10 sec 8
ESD IEC 61000-4-2 Contact Discharge -12 12 kV Bus pins (A, B, Y, Z), ±12 kV 8
ESD HBM, Bus Pins -30 30 kV A, B, Y, Z, ≥±30 kV 8
ESD HBM, All Other Pins -8 8 kV All other pins 8
Thermal Resistance Junction to Ambient, R-14 θJA 104.5 °C/W R-14 (14-lead SOIC_N), JEDEC 2S2P simulated 8
Thermal Resistance Junction to Case, R-14 θJC 42.9 °C/W R-14 (14-lead SOIC_N), JEDEC 2S2P simulated 8

CAD (KiCad official)

  • Symbol: ADM3067EBRZ
  • Footprint: Package_SO:SOIC-14_3.9x8.7mm_P1.27mm
  • 3D model: SOIC-14 (KiCad packages3D, STEP)
  • 3D model files: adm3067ebrz-etched.step / adm3067ebrz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); adm3067ebrz.step / adm3067ebrz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (25 pp, sha256 7ce4130f0f613a46, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF