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README

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ADM3066EARMZ

Analog Devices · RS-485/RS-422 ICs · MSOP-10

ADM3066EARMZ from Analog Devices, in a MSOP-10. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIO power_in 1.62 V to 5.5 V logic supply; a 0.1 µF decoupling capacitor between VIO and GND is recommended.
2 RO output Receiver output is high when (A − B) ≥ −30 mV and low when (A − B) ≤ −200 mV, and is tristated when the receiver is disabled (RE high).
3 DE input A high level enables the driver differential outputs A and B, and a low level places the driver output into a high impedance state.
4 RE input Active-low receiver enable input: driving it low enables the receiver and driving it high disables the receiver.
5 DI input Transmit data input; data to be transmitted by the driver is applied to this pin.
6 GND power_in Ground reference for the device.
7 NIC unconnected No internal connection; this pin is not internally connected.
8 A bidirectional Noninverting driver output and receiver input; when the driver is disabled or VCC is powered down, the pin is put into a high impedance state to avoid overloading the bus.
9 B bidirectional Inverting driver output and receiver input; when the driver is disabled or VCC is powered down, the pin is put into a high impedance state to avoid overloading the bus.
10 VCC power_in 3.0 V to 5.5 V power supply; a 0.1 µF decoupling capacitor between VCC and GND is recommended.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package MSOP-10
Category Communication Interface Chip/UART/485/232
Pins 10

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
No Load Supply Current ICC 3.5 7.5 mA DE = VIO, RE = 0 V 4
No Load Supply Current ICC 3 4.5 mA DE = 0 V, RE = 0 V 4
Supply Current, Data Rate = 50 Mbps ICC 107 172 mA Load resistance (RL) = 54 Ω, DE = VIO, RE = 0 V (VCC ≥ 4.5 V) 4
Supply Current, Data Rate = 50 Mbps ICC 67 75 mA RL = 54 Ω, DE = VIO, RE = 0 V (VCC = 3.0 V) 4
Supply Current in Shutdown Mode ISHDN 210 450 µA DE = 0 V, RE = VIO 4
VIO Shutdown Current IIOSHDN 1 50 µA DE = 0 V, RE = VIO 4
Output Voltage, Loaded /VOD2/ 2 2.5 V VCC ≥ 3.0 V, RL = 50 Ω, see Figure 38 4
Output Voltage, Loaded /VOD2/ 1.5 2.1 V VCC ≥ 3.0 V, RL = 27 Ω (RS-485), see Figure 38 4
Output Voltage, Loaded /VOD2/ 2.1 3.5 V VCC ≥ 4.5 V, RL = 50 Ω, see Figure 38 4
Output Voltage, Loaded /VOD2/ 2.1 3 V VCC ≥ 4.5 V, RL = 27 Ω (RS-485), see Figure 38 4
Output Voltage over common-mode range /VOD3/ 1.5 2.1 V VCC ≥ 3.0 V, −7 V ≤ common-mode voltage (VCM) ≤ +12 V, see Figure 39 4
Output Voltage over common-mode range /VOD3/ 2.1 3 V VCC ≥ 4.5 V, −7 V ≤ VCM ≤ +12 V, see Figure 39 4
Change in Differential Input Voltage for Complementary Output States Δ/VOD/ 0.2 V RL = 27 Ω or 50 Ω, see Figure 38 4
Common-Mode Output Voltage VOC 1.6 3 V RL = 27 Ω or 50 Ω, see Figure 38 4
Change in Common-Mode Voltage for Complementary Output States Δ/VOC/ 0.2 V RL = 27 Ω or 50 Ω, see Figure 38 4
Output Short-Circuit Current IOS -250 250 mA −7 V < output voltage (VOUT) < +12 V 4
Output Leakage (Y, Z) IO 100 µA DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V, input voltage (VIN) = 12 V 4
Output Leakage (Y, Z) IO -100 µA DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V, VIN = −7 V 4
Input Current (logic inputs DE, RE, DI) II -2 2 µA DE, RE, DI, 1.62 V ≤ VIO ≤ 5.5 V, 0 V ≤ VIN ≤ VIO 4
Differential Input Threshold Voltage VTH -200 -125 -30 mV −7 V < VCM < +12 V 4
Input Voltage Hysteresis VHYS 30 mV −7 V < VCM < +12 V 4
Input Current (A, B) II 0.1 0.25 mA DE = 0 V, VCC = powered/unpowered, VIN = 12 V 4
Input Current (A, B) II -0.2 -0.1 mA DE = 0 V, VCC = powered/unpowered, VIN = −7 V 4
Line Input Resistance RIN 48 96 kΩ −7 V ≤ VCM ≤ +12 V 4
VCC to GND VCC 6 V 8
VIO to GND VIO -0.3 6 V 8
Driver Output and Receiver Input Voltage -9 14 V 8
Operating Temperature Range TA -40 85 °C 8
Operating Temperature Range TA -40 125 °C 8
Storage Temperature Range -65 150 °C 8
Continuous Total Power Dissipation, 10-Lead MSOP PD 0.151 W 10-Lead MSOP 8
Maximum Junction Temperature TJ 150 °C 8
IEC 61000-4-2 Contact Discharge on bus pins -12 12 kV Bus pins (A, B, Y, Z) 8
Supply voltage VCC VCC 3 5.5 V 4
Logic supply voltage VIO VIO 1.62 5.5 V VIO = 1.62 V to VCC (ADM3062E/ADM3064E/ADM3066E/ADM3068E) 4
Thermal Resistance, junction to ambient θJA 165.69 °C/W RM-10 package, JEDEC 2S2P thermal test board, no bias 8
Thermal Resistance, junction to case θJC 49.61 °C/W RM-10 package 8

CAD (KiCad official)

  • Symbol: ADM3066EARMZ
  • Footprint: Package_SO:MSOP-10_3x3mm_P0.5mm
  • 3D model: MSOP-10 (KiCad packages3D, STEP)
  • 3D model files: adm3066earmz-etched.step / adm3066earmz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); adm3066earmz.step / adm3066earmz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (25 pp, sha256 7ce4130f0f613a46, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF