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ADM3063EARZ

Analog Devices · RS-485/RS-422 ICs · SOIC-14

ADM3063EARZ from Analog Devices, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NIC unconnected No Internal Connection; this pin is not internally connected.
2 RO output Receiver Output Data is high when (A − B) ≥ −30 mV and low when (A − B) ≤ −200 mV, and is tristated when RE is driven high.
3 RE input Receiver Enable Input is active low: driving it low enables the receiver and driving it high disables the receiver.
4 DE input Driver Enable: a high level enables the driver differential outputs Y and Z, and a low level places the driver output into a high impedance state.
5 DI input Transmit Data Input: data to be transmitted by the driver is applied to this input.
6 GND power_in Ground.
7 GND power_in Ground.
8 NIC unconnected No Internal Connection; this pin is not internally connected.
9 Y output Driver Noninverting Output is put into a high impedance state when the driver is disabled or VCC is powered down, to avoid overloading the bus.
10 Z output Driver Inverting Output is put into a high impedance state when the driver is disabled or VCC is powered down, to avoid overloading the bus.
11 B input Inverting Receiver Input.
12 A input Noninverting Receiver Input.
13 VCC power_in 3.0 V to 5.5 V power supply; adding a 0.1 µF decoupling capacitor between the VCC and GND pins is recommended.
14 VCC power_in 3.0 V to 5.5 V power supply; adding a 0.1 µF decoupling capacitor between the VCC and GND pins is recommended.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package SOIC-14
Category Communication Interface Chip/UART/485/232
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
No Load Supply Current (DE = VIO, RE = 0 V) ICC 3.5 7.5 mA DE = VIO, RE = 0 V 4
No Load Supply Current (DE = VIO, RE = VIO) ICC 3.5 7.5 mA DE = VIO, RE = VIO 4
No Load Supply Current (DE = 0 V, RE = 0 V) ICC 3 4.5 mA DE = 0 V, RE = 0 V 4
Supply Current, Data Rate = 500 kbps ICC 100 165 mA RL = 54 Ω, DE = VIO, RE = 0 V (VCC ≥ 4.5 V) 4
Supply Current, Data Rate = 500 kbps ICC 56 74 mA RL = 54 Ω, DE = VIO, RE = 0 V (VCC = 3.0 V) 4
Supply Current in Shutdown Mode ISHDN 210 450 µA DE = 0 V, RE = VIO 4
Output Voltage, Loaded /VOD2/ 2 2.5 V VCC ≥ 3.0 V, RL = 50 Ω, see Figure 38 4
Output Voltage, Loaded (RS-485) /VOD2/ 1.5 2.1 V VCC ≥ 3.0 V, RL = 27 Ω (RS-485), see Figure 38 4
Output Voltage, Loaded /VOD2/ 2.1 3.5 V VCC ≥ 4.5 V, RL = 50 Ω, see Figure 38 4
Output Voltage, Loaded (RS-485) /VOD2/ 2.1 3 V VCC ≥ 4.5 V, RL = 27 Ω (RS-485), see Figure 38 4
Output Voltage over Common-Mode Range /VOD3/ 1.5 2.1 V VCC ≥ 3.0 V, −7 V ≤ VCM ≤ +12 V, see Figure 39 4
Output Voltage over Common-Mode Range /VOD3/ 2.1 3 V VCC ≥ 4.5 V, −7 V ≤ VCM ≤ +12 V, see Figure 39 4
Common-Mode Output Voltage VOC 1.6 3 V RL = 27 Ω or 50 Ω, see Figure 38 4
Output Short-Circuit Current IOS -250 250 mA −7 V < VOUT < +12 V 4
Output Leakage (Y, Z) IO 100 µA DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V, VIN = 12 V 4
Output Leakage (Y, Z) IO -100 µA DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V, VIN = −7 V 4
Logic Input Current II -2 2 µA DE, RE, DI, 1.62 V ≤ VIO ≤ 5.5 V, 0 V ≤ VIN ≤ VIO 4
Differential Input Threshold Voltage VTH -200 -125 -30 mV −7 V < VCM < +12 V 4
Input Current (A, B) II 0.1 0.25 mA DE = 0 V, VCC = powered/unpowered, VIN = 12 V 4
Input Current (A, B) II -0.2 -0.1 mA DE = 0 V, VCC = powered/unpowered, VIN = −7 V 4
Line Input Resistance RIN 48 96 kΩ −7 V ≤ VCM ≤ +12 V 4
Supply Voltage (VCC) VCC 3 5.5 V 4
Operating Temperature Range (A grade) -40 85 °C A grade 8
VCC to GND VCC 6 V 8
Digital Input and Output Voltage (DE, RE, DI, and RO) -0.3 V DE, RE, DI, and RO 8
Driver Output and Receiver Input Voltage -9 14 V 8
Storage Temperature Range -65 150 °C 8
Maximum Junction Temperature TJ 150 °C 8
Lead Temperature Soldering 300 °C 10 sec 8
Lead Temperature Vapor Phase 215 °C 60 sec 8
Lead Temperature Infrared 220 °C 15 sec 8
Continuous Total Power Dissipation 0.239 W 14-Lead SOIC_N 8
ESD on Bus Pins, IEC 61000-4-2 Contact Discharge -12 12 kV Bus pins (A, B, Y, Z), IEC 61000-4-2 contact discharge 8
ESD Human Body Model, All Other Pins -8 8 kV All other pins, HBM 8
Thermal Resistance Junction to Ambient (R-14) θJA 104.5 °C/W JEDEC 2S2P thermal test board, no bias 8
Thermal Resistance Junction to Case (R-14) θJC 42.9 °C/W JEDEC 2S2P thermal test board, no bias 8

CAD (KiCad official)

  • Symbol: ADM3063EARZ
  • Footprint: Package_SO:SOIC-14_3.9x8.7mm_P1.27mm
  • 3D model: SOIC-14 (KiCad packages3D, STEP)
  • 3D model files: adm3063earz-etched.step / adm3063earz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); adm3063earz.step / adm3063earz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (25 pp, sha256 7ce4130f0f613a46, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF