ADM3061EARZ-R7 from Analog Devices, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	RO	output	Receiver output is high when (A − B) ≥ −30 mV and low when (A − B) ≤ −200 mV, and is tristated when the receiver is disabled by driving RE high.
2	RE	input	Active-low receiver enable input: driving it low enables the receiver and driving it high disables the receiver.
3	DE	input	Driver enable input: a high level enables the driver differential outputs A and B, and a low level places the driver output into a high impedance state.
4	DI	input	Transmit data input: data to be transmitted by the driver is applied to this pin.
5	GND	power_in	Ground connection for the device.
6	A	bidirectional	Noninverting driver output and receiver input; when the driver is disabled or VCC is powered down, this pin is put into a high impedance state to avoid overloading the bus.
7	B	bidirectional	Inverting driver output and receiver input; when the driver is disabled or VCC is powered down, this pin is put into a high impedance state to avoid overloading the bus.
8	VCC	power_in	Power supply of 3.0 V to 5.5 V; adding a 0.1 µF decoupling capacitor between VCC and GND is recommended.

Key specifications

Parameter	Value
Manufacturer	Analog Devices
Package	SOIC-8
Category	Communication Interface Chip/UART/485/232
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
No Load Supply Current	ICC	3.5		7.5	mA	DE = VIO, RE = 0 V	4
No Load Supply Current	ICC	3		4.5	mA	DE = 0 V, RE = 0 V	4
Supply Current, Data Rate = 500 kbps	ICC	100		165	mA	RL = 54 Ω, DE = VIO, RE = 0 V (VCC ≥ 4.5 V)	4
Supply Current, Data Rate = 500 kbps	ICC	56		74	mA	RL = 54 Ω, DE = VIO, RE = 0 V (VCC = 3.0 V)	4
Supply Current in Shutdown Mode	ISHDN	210		450	µA	DE = 0 V, RE = VIO	4
Output Voltage, Loaded	/VOD2/	2		2.5	V	VCC ≥ 3.0 V, RL = 50 Ω, see Figure 38	4
Output Voltage, Loaded	/VOD2/	1.5		2.1	V	VCC ≥ 3.0 V, RL = 27 Ω (RS-485), see Figure 38	4
Output Voltage, Loaded	/VOD2/	2.1		3.5	V	VCC ≥ 4.5 V, RL = 50 Ω, see Figure 38	4
Output Voltage, Loaded	/VOD2/	2.1		3	V	VCC ≥ 4.5 V, RL = 27 Ω (RS-485), see Figure 38	4
Output Voltage, Loaded (common-mode range)	/VOD3/	1.5		2.1	V	VCC ≥ 3.0 V, −7 V ≤ VCM ≤ +12 V, see Figure 39	4
Output Voltage, Loaded (common-mode range)	/VOD3/	2.1		3	V	VCC ≥ 4.5 V, −7 V ≤ VCM ≤ +12 V, see Figure 39	4
Change in Differential Input Voltage for /VOD/	∆/VOD/			0.2	V	RL = 27 Ω or 50 Ω, see Figure 38	4
Common-Mode Output Voltage	VOC	1.6		3	V	RL = 27 Ω or 50 Ω, see Figure 38	4
Change in Common-Mode Voltage for /VOC/	∆/VOC/			0.2	V	RL = 27 Ω or 50 Ω, see Figure 38	4
Output Short-Circuit Current	IOS	-250		250	mA	−7 V < VOUT < +12 V	4
Output Leakage (Y, Z)	IO			100	µA	DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V, VIN = 12 V	4
Output Leakage (Y, Z)	IO	-100			µA	DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V, VIN = −7 V	4
Input Current	II	-2		2	µA	DE, RE, DI, 1.62 V ≤ VIO ≤ 5.5 V, 0 V ≤ VIN ≤ VIO	4
Differential Input Threshold Voltage	VTH	-200	-125	-30	mV	−7 V < VCM < +12 V	4
Input Voltage Hysteresis	VHYS		30		mV	−7 V < VCM < +12 V	4
Input Current (A, B)	II	0.1		0.25	mA	DE = 0 V, VCC = powered/unpowered, VIN = 12 V	4
Input Current (A, B)	II	-0.2		-0.1	mA	DE = 0 V, VCC = powered/unpowered, VIN = −7 V	4
Line Input Resistance	RIN	48		96	kΩ	−7 V ≤ VCM ≤ +12 V	4
Supply Voltage	VCC	3		5.5	V		4
Operating Temperature Range (A grade)	TA	-40		85	°C	A grade	3
Maximum VCC for 500 kbps data rate	VCC			5.5	V	500 kbps data rate, 8-lead SOIC_N	3
VCC to GND	VCC			6	V		8
Driver Output and Receiver Input Voltage		-9		14	V		8
Operating Temperature Range		-40		85	°C	A grade	8
Storage Temperature Range		-65		150	°C		8
Maximum Junction Temperature	TJ			150	°C		8
Continuous Total Power Dissipation, 8-Lead SOIC_N				0.225	W	8-Lead SOIC_N	8
Lead Temperature Soldering (10 sec)				300	°C	10 sec	8
Lead Temperature Vapor Phase (60 sec)				215	°C	60 sec	8
Lead Temperature Infrared (15 sec)				220	°C	15 sec	8
ESD on Bus Pins IEC 61000-4-2 Contact Discharge		-12		12	kV	IEC 61000-4-2 contact discharge, bus pins (A, B, Y, Z)	8
ESD Human Body Model on Bus Pins		-30		30	kV	≥ ±30 kV, bus pins (A, B, Y, Z)	8
ESD Human Body Model on All Other Pins		-8		8	kV	All other pins	8
Thermal Resistance Junction to Ambient, R-8	θJA		110.88		°C/W	JEDEC 2S2P board, no bias	8
Thermal Resistance Junction to Case, R-8	θJC		58.63		°C/W	junction to case	8

CAD (KiCad official)

Symbol: ADM3061EARZ-R7
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOIC-8 (KiCad packages3D, STEP)
3D model files: adm3061earz-r7-etched.step / adm3061earz-r7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); adm3061earz-r7.step / adm3061earz-r7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Analog Devices datasheet (25 pp, sha256 7ce4130f0f613a46, retrieved 2026-11-02, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

ADM3061EARZ-R7

Verified ADM3061EARZ-R7

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

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