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Contents

README

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ADM2491EBRWZ-REEL7

Analog Devices · Isolated RS-485/422 Transceivers · SOIC-16-300mil

ADM2491EBRWZ-REEL7 from Analog Devices, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD1 power_in Power supply (logic side), 3.0 to 5.5 V; requires 0.01-0.1 µF bypass capacitor to GND1.
2 GND1 power_in Ground reference (logic side).
3 RxD tri_state Receiver output with tri-state operation (disabled by RE high); logic low outputs 0.2-0.4 V, logic high outputs VDD1-0.3 to VDD1-0.2 V.
4 RE input Receiver enable (active low); receiver enabled when ≤0.25×VDD1, disabled when ≥0.7×VDD1.
5 DE input Driver enable (active high); driver enabled when ≥0.7×VDD1, disabled when ≤0.25×VDD1.
6 TxD input Transmit data logic input; thresholds 0.25×VDD1 (low) and 0.7×VDD1 (high), input current ±10 µA.
7 NC unconnected No connect pin, must remain floating.
8 GND1 power_in Ground reference (logic side).
9 GND2 power_in Ground reference (bus side).
10 NC unconnected No connect pin, must remain floating.
11 Y output Driver noninverting output (RS-485/RS-422), differential output ±2.0 to ±5.0 V into 54-100 Ω loads, max short-circuit current 250 mA.
12 Z output Driver inverting output (RS-485/RS-422), complementary to Y, differential output ±2.0 to ±5.0 V into 54-100 Ω loads, max short-circuit current 250 mA.
13 B input Receiver inverting input (RS-485/RS-422 bus); differential threshold voltage ±0.2 V, 12 kΩ input impedance.
14 A input Receiver noninverting input (RS-485/RS-422 bus); differential threshold voltage ±0.2 V, 12 kΩ input impedance.
15 GND2 power_in Ground reference (bus side).
16 VDD2 power_in Isolated power supply (bus side), 4.5 to 5.5 V; requires 0.01-0.1 µF bypass capacitor to GND2.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package SOIC-16-300mil
Category Signal Isolation Devices
Pins 16

CAD (KiCad official)

  • Symbol: ADM2491EBRWZ-REEL7
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
  • 3D model files: adm2491ebrwz-reel7-etched.step / adm2491ebrwz-reel7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); adm2491ebrwz-reel7.step / adm2491ebrwz-reel7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (16 pp, sha256 d2765fb01d46c583, retrieved 2026-09-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-4-6 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF