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Contents

README

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ADM2483BRWZ

Analog Devices · Isolated RS-485/422 Transceivers · SOIC-16-300mil

ADM2483BRWZ from Analog Devices, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD1 power_in Power supply for logic side; recommended operating range 2.7 V to 5.5 V.
2 GND1 power_in Ground for logic side; internally connected to Pin 8.
3 RxD tri_state Receiver output data; high when (A − B) ≥ −30 mV and enabled, low when (A − B) ≤ −200 mV and enabled, high impedance when RE is driven high.
4 RE input Receiver enable input (active low); low enables receiver, high disables receiver and puts RxD in high impedance state.
5 DE input Driver enable input; high enables driver, low disables driver and puts A and B in high impedance state.
6 TxD input Transmit data input; data to be transmitted by the driver is applied to this input.
7 PV input Power valid input; drive low until VDD1 exceeds 2.0 V during power-up, drive low before VDD1 drops below 2.0 V during power-down.
8 GND1 power_in Ground for logic side; internally connected to Pin 2.
9 GND2 power_in Ground for bus side; internally connected to Pin 15.
10 NC unconnected No connect; no internal connection.
11 NC unconnected No connect; no internal connection.
12 A bidirectional Noninverting driver output and receiver input; placed in high impedance state when driver is disabled or when VDD1 or VDD2 is powered down.
13 B bidirectional Inverting driver output and receiver input; placed in high impedance state when driver is disabled or when VDD1 or VDD2 is powered down.
14 NC unconnected No connect; no internal connection.
15 GND2 power_in Ground for bus side; internally connected to Pin 9.
16 VDD2 power_in Power supply for bus side; recommended operating range 4.75 V to 5.25 V.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package SOIC-16-300mil
Category Signal Isolation Devices
Pins 16

CAD (KiCad official)

  • Symbol: ADM2483BRWZ
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
  • 3D model files: adm2483brwz-etched.step / adm2483brwz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); adm2483brwz.step / adm2483brwz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (18 pp, sha256 3017d573a2c2801b, retrieved 2026-09-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-4-6 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF