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Contents

README

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ADM2481BRWZ-RL7

Analog Devices · Isolated RS-485/422 Transceivers · SOIC-16-300mil

ADM2481BRWZ-RL7 from Analog Devices, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD1 power_in Power supply (logic side) within 3.0 V to 5.5 V relative to GND1.
2 GND1 power_in Ground (logic side), must be connected together with pins 7 and 8.
3 RxD tri_state Receiver output data, high when (A − B) ≥ −30 mV, low when (A − B) ≤ −200 mV, tristate when receiver disabled by RE driven high.
4 RE input Receiver enable input (active-low), enables receiver when low and disables receiver when driven high.
5 DE input Driver enable input (active-high), enables driver when driven high and disables driver when low.
6 TxD input Transmit data input for driver, accepts CMOS logic levels referenced to VDD1/GND1.
7 GND1 power_in Ground (logic side), must be connected together with pins 2 and 8.
8 GND1 power_in Ground (logic side), must be connected together with pins 2 and 7.
9 GND2 power_in Ground (bus side), isolated from logic side GND1.
10 GND2 power_in Ground (bus side), isolated from logic side GND1.
11 NC unconnected No connect, must not be connected to any circuit.
12 A tri_state Noninverting driver output and receiver input, high-impedance when driver disabled or VDD1/VDD2 powered down.
13 B tri_state Inverting driver output and receiver input, high-impedance when driver disabled or VDD1/VDD2 powered down.
14 NC unconnected No connect, must not be connected to any circuit.
15 GND2 power_in Ground (bus side), isolated from logic side GND1.
16 VDD2 power_in Power supply (bus side) within 4.75 V to 5.25 V relative to GND2.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package SOIC-16-300mil
Category Signal Isolation Devices
Pins 16

CAD (KiCad official)

  • Symbol: ADM2481BRWZ-RL7
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
  • 3D model files: adm2481brwz-rl7-etched.step / adm2481brwz-rl7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); adm2481brwz-rl7.step / adm2481brwz-rl7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (17 pp, sha256 3293123aba468dcb, retrieved 2026-09-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-4-6 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF