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ADM101EARMZ-REEL

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Analog Devices Buffers / Drivers, MSOP-10. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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ADM101EARMZ-REEL

Analog Devices · Buffers / Drivers · MSOP-10

ADM101EARMZ-REEL from Analog Devices, in a MSOP-10. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin, which must be connected to 0 V.
2 C1− passive Negative terminal of C1 (if C1 is a polarized capacitor).
3 V− power_out Internally generated negative supply voltage; the absolute maximum rating for V− is +0.3 V to −6 V.
4 TIN input Driver input accepting 3 V to 5 V TTL/CMOS logic levels, with an absolute maximum range of −0.3 V to (VCC + 0.3 V).
5 ROUT output Receiver output providing 3 V to 5 V TTL/CMOS logic levels.
6 RIN input Receiver input accepting EIA-232 signal levels, with overvoltage protection rated to ±30 V continuous.
7 TOUT output Driver output at EIA-232 signal levels, typically ±4.2 V swing with a 5 V supply, and continuous short-circuit duration allowed.
8 SD input Shutdown input; logic 1 puts the ADM101E into low power shutdown mode, switching off the dc-dc converter and disabling the transmitter while the receiver stays active.
9 C1+ passive Positive terminal of charge pump capacitor C1 (if C1 is a polarized capacitor).
10 VCC power_in Positive power supply, nominally 5 V (VCC = 5 V ± 10% for the specifications given).

Key specifications

Parameter Value
Manufacturer Analog Devices
Package MSOP-10
Category Logic ICs
Pins 10

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output Voltage Swing (magnitude, VCC = 5 V ±5%) VOUT 3.5 4.2 V VCC = 5 V ± 5%, TOUT loaded with 3 kΩ to GND 3
Output Voltage Swing (magnitude, VCC = 5 V ±10%) VOUT 3.25 4.2 V VCC = 5 V ± 10%, TOUT loaded with 3 kΩ to GND 3
VCC Power Supply Current (Unloaded) ICC 0.5 1 mA No load, TIN = VCC or GND 3
VCC Power Supply Current (Loaded) ICC 1.85 2.5 mA TOUT loaded with 3 kΩ to GND 3
VCC Power Supply Current (Shutdown) ICC 1 μA SD input = VCC 3
Input Logic Threshold Low VINL 0.8 V 3
Input Logic Threshold High VINH 2.4 V 3
Input Leakage Current -1 1 μA 3
RS-232 Input Voltage Range -15 15 V 3
RS-232 Input Threshold Low 0.8 2.2 V 3
RS-232 Input Threshold High 2.4 2.6 V 3
RS-232 Input Hysteresis 0.2 V 3
RS-232 Input Resistance 3 5 7 kΩ 3
TTL/CMOS Output Voltage Low VOL 0.4 V IOUT = 1.6 mA 3
TTL/CMOS Output Voltage High VOH 3.5 V IOUT = −1.0 mA 3
Propagation Delay 0.25 μs RS-232 to TTL 3
Instantaneous Slew Rate 25 V/μs CL = 10 pF, RL = 3 kΩ − 7 kΩ, TA = 25°C 3
Transition Region Slew Rate 11 V/μs RL = 3 kΩ, CL = 1000 pF; measured from +3 V to −3 V or vice versa 3
Baud Rate 460 kB RL = 3 kΩ, CL = 1 nF 3
Output Resistance 300 Ω VCC = 0 V, VOUT = ±2 V 3
RS-232 Output Short Circuit Current (magnitude) 25 60 mA 3
VCC (positive supply) VCC 6 V 4
V− (internally generated negative supply) V− -6 0.3 V Printed as +0.3 V to −6 V 4
Driver Input TIN TIN -0.3 V Printed upper limit is (VCC + 0.3 V) 4
Receiver Input RIN RIN -30 30 V 4
Receiver Output ROUT ROUT -0.3 V Printed upper limit is (VCC + 0.3 V) 4
Power Dissipation RM-10 1488 mW RM-10 package; derate 12 mW/°C above 70°C 4
Thermal Impedance 135 °C/W RM-10 package 4
Operating Temperature Range (Industrial, A Version) TA -40 85 °C A version 4
Storage Temperature Range TSTG -65 150 °C 4
ESD Rating 2000 V Printed as >2000 V 4
ESD Rating (I-O Pins) 15 kV I-O pins 4
Lead Temperature Soldering, Vapor Phase 215 °C Vapor phase, 60 sec 4
Lead Temperature Soldering, Infrared 220 °C Infrared, 15 sec 4
VCC Supply Tolerance VCC -10 10 % VCC = 5 V ± 10% 3
VCC Nominal Supply VCC 5 V Nominally 5 V 5

CAD (KiCad official)

  • Symbol: ADM101EARMZ-REEL
  • Footprint: Package_SO:MSOP-10_3x3mm_P0.5mm
  • 3D model: MSOP-10 (KiCad packages3D, STEP)
  • 3D model files: adm101earmz-reel-etched.step / adm101earmz-reel-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); adm101earmz-reel.step / adm101earmz-reel.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (12 pp, sha256 3ed9d935b0e7a117, retrieved 2026-10-29, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF