component
ADAU7118ACPZRL
Public Made by Adomby adom
Analog Devices Analog To Digital Converters (ADC), LFCSP-16(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
Open in new tab ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Symbol & Footprint
Schematic Symbol
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
PCB Footprint
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
Datasheet
Open in new tab ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
README
markdownADAU7118ACPZRL
Analog Devices · Analog To Digital Converters (ADC) · LFCSP-16(3x3)
ADAU7118ACPZRL from Analog Devices, in a LFCSP-16(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | PDM_CLK0 | output | PDM output clock 0, with output drive strength set by PDM_CLK0_DS (2.5 mA to 15 mA at 3.3 V). |
| 2 | PDM_DAT0 | input | PDM input data 0 from the digital microphone(s) on this channel pair. |
| 3 | PDM_DAT1 | input | PDM input data 1 from the digital microphone(s) on this channel pair. |
| 4 | PDM_CLK1 | output | PDM output clock 1, with output drive strength set by PDM_CLK1_DS (2.5 mA to 15 mA at 3.3 V). |
| 5 | PDM_DAT2 | input | PDM input data 2 from the digital microphone(s) on this channel pair. |
| 6 | PDM_DAT3 | input | PDM input data 3 from the digital microphone(s) on this channel pair. |
| 7 | SCL | input | I2C serial clock input; the pin is open-drain and requires pull-up resistors to IOVDD. |
| 8 | SDA | bidirectional | I2C serial data; the pin is open-drain and requires pull-up resistors to IOVDD. |
| 9 | FSYNC | input | I2S/TDM frame sync or left/right clock, used as the slave frame sync input. |
| 10 | BCLK | input | I2S/TDM bit clock input, which the device uses as a slave clock; BCLK removal automatically powers the device down. |
| 11 | SDATA | output | I2S/TDM serial data output, with output drive strength set by SDATA_DS (2.5 mA to 15 mA at 3.3 V). |
| 12 | ADDR/CONFIG | input | I2C address or standalone hardware configuration selection, set by tying the pin to IOVDD, GND, through a 47 kΩ resistor, or leaving it open. |
| 13 | EN | input | Chip enable; grounding this pin disables the device into low power mode, and applying IOVDD enables normal operation. |
| 14 | DVDD | power_in | Internal core digital power supply, 1.10 V to 1.98 V. |
| 15 | GND | power_in | Ground. |
| 16 | IOVDD | power_in | Digital input/output power supply, 1.70 V to 3.63 V. |
| 17 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Analog Devices |
| Package | LFCSP-16(3x3) |
| Category | Data Acquisition |
| Pins | 17 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Digital Voltage (DVDD Pin) supply | 1.1 | 1.98 | V | Supply for digital circuitry | 3 | ||
| I/O Supply Voltage (IOVDD Pin) | 1.7 | 3.63 | V | Supply for input/output circuitry, including pads and level shifters | 4 | ||
| Operating ambient temperature range | TA | -40 | 85 | °C | Commercial temperature range | 1 | |
| Output Sampling Rate | fS | 4 | 48 | 192 | kHz | FSYNC pulse rate | 4 |
| Bit Clock Frequency | fBCLK | 0.256 | 12.288 | 24.576 | MHz | 4 | |
| PDM_CLKx Frequency | fPDM_CLK | 0.256 | 3.072 | 6.144 | MHz | 4 | |
| IOVDD operating current (Operation State) | 2 | mA | IOVDD = 3.3 V, 48 kHz fS, TDM-8 format, all channels driven, default drive strength, 25 pF capacitance, only one PDM_CLKx pin used | 4 | |||
| DVDD operating current (Operation State) | 1.4 | mA | Over all temperatures, full voltage range and silicon skews, 8 channels, 48 kHz fS | 4 | |||
| DVDD operating current (Operation State) | 1.2 | mA | DVDD = 1.8 V, 8 channels, 48 kHz fS | 4 | |||
| Shutdown current | 16 | µA | Power applied, frame and bit clocks applied, device placed into power-down state using procedure in Table 10 | 4 | |||
| Shutdown current | 3 | µA | Power applied, frame and bit clocks applied, device placed into power-down state using procedure in Table 9 | 4 | |||
| Frequency Response | -0.1 | 0.01 | dB | DC to 0.45 × output sampling rate (fS) | 3 | ||
| Gain | 0 | 0 | 0 | dB | PDM to PCM | 4 | |
| Group Delay | 4.47 | 4.47 | 4.47 | FSYNC cycles | 0.02 fS input signal, 64× decimation | 3 | |
| Group Delay | 5.02 | 5.02 | 5.02 | FSYNC cycles | 0.02 fS input signal, 32× decimation | 3 | |
| Group Delay | 5.83 | 5.83 | 5.83 | FSYNC cycles | 0.02 fS input signal, 16× decimation | 3 | |
| Start-Up Time | 63 | 64 | 64 | FSYNC cycles | After power-up reset and initialization code runs | 4 | |
| Interchannel Phase | 0 | 0 | 0 | Degrees | 4 | ||
| High-Pass Filter −3 dB Point | 0.23328 | 0.9312 | 242.4 | Hz | fS = 48 kHz, cutoff frequency set using the HPF_FC bits in the HPF_CONTROL register, typical value is default setting | 4 | |
| FSYNC frequency | fFSYNC | 192 | kHz | 5 | |||
| BCLK frequency | fBCLK | 24.576 | MHz | Sample rate ranging from 4 kHz to 192 kHz | 5 | ||
| BCLK period | tBCLK | 40.7 | ns | 5 | |||
| BCLK low pulse width | tBIL | 18 | ns | Slave mode, BCLK frequency = 24.576 MHz, BCLK period = 40.6 ns | 5 | ||
| BCLK high pulse width | tBIH | 18 | ns | Slave mode, BCLK frequency = 24.576 MHz, BCLK period = 40.6 ns | 5 | ||
| FSYNC setup to BCLK input rising edge | tLIS | 10 | ns | Slave mode, FSYNC frequency = 192 kHz | 5 | ||
| FSYNC hold from BCLK input rising edge | tLIH | 10 | ns | Slave mode, FSYNC frequency = 192 kHz | 5 | ||
| SDATA delay from BCLK output falling edge | tSOD | 20.63 | ns | 25 pF load over entire range of IOVDD, all temperatures and skews, default drive strength of 10 mA | 5 | ||
| SDATA delay from BCLK output falling edge | tSOD | 11.71 | ns | IOVDD = 3.3 V ± 10%, drive strength set to 0b00, with 25 pF load | 5 | ||
| SDATA delay from BCLK output falling edge | tSOD | 10.37 | ns | IOVDD = 3.3 V ± 10%, drive strength set to 0b01, with 25 pF load | 5 | ||
| SDATA delay from BCLK output falling edge | tSOD | 9.03 | ns | IOVDD = 3.3 V ± 10%, drive strength set to 0b10, with 25 pF load | 5 | ||
| SDATA delay from BCLK output falling edge | tSOD | 8.72 | ns | IOVDD = 3.3 V ± 10%, drive strength set to 0b11, with 25 pF load | 5 | ||
| SDATA delay from BCLK output falling edge | tSOD | 31.02 | ns | IOVDD = 1.7 V to 1.89 V, drive strength set to 0b00, with 25 pF load | 5 | ||
| SDATA delay from BCLK output falling edge | tSOD | 25.83 | ns | IOVDD = 1.7 V to 1.89 V, drive strength set to 0b01, with 25 pF load | 5 | ||
| SDATA delay from BCLK output falling edge | tSOD | 20.33 | ns | IOVDD = 1.7 V to 1.89 V, drive strength set to 0b11, with 25 pF load | 5 | ||
| SCL clock frequency | fSCL | 1000 | kHz | 6 | |||
| SCL pulse width high | tSCLH | 0.26 | µs | 6 | |||
| SCL pulse width low | tSCLL | 0.5 | µs | 6 | |||
| Start and repeated start condition setup time | tSCS | 0.26 | µs | 6 | |||
| Start condition hold time | tSCH | 0.26 | µs | 6 | |||
| Data setup time | tDS | 50 | ns | 6 | |||
| Data hold time | tDH | 0.45 | µs | 6 | |||
| SDA rise time | tSDR | 120 | ns | 6 | |||
| SDA fall time | tSDF | 120 | ns | 6 | |||
| Bus-free time between stop and start | tBFT | 0.5 | µs | 6 | |||
| Stop condition setup time | tSUSTO | 0.26 | µs | 6 | |||
| Data setup time (PDM) | tSETUP | 9 | ns | PDM data latched on both edges of the clock | 6 | ||
| Data hold time (PDM) | tHOLD | 3 | ns | PDM data latched on both edges of the clock | 6 | ||
| DVDD to Ground | 1.98 | V | 7 | ||||
| IOVDD to Ground | 3.63 | V | 7 | ||||
| Junction Temperature Range | -65 | 165 | °C | 7 | |||
| Storage Temperature Range | -65 | 150 | °C | 7 | |||
| Soldering temperature | 300 | °C | 60 sec | 7 | |||
| Electrostatic Discharge (ESD) Susceptibility | 4.5 | kV | Test model not stated | 7 | |||
| Thermal resistance, junction-to-ambient | θJA | 57 | °C/W | Package CP-16-22; JEDEC 1S0P thermal test board (table footnote 1) | 7 | ||
| Thermal resistance, junction-to-case | θJC | 15 | °C/W | Package CP-16-22; JEDEC 2S2P thermal test board with four thermal vias (table footnote 2) | 7 |
CAD (KiCad official)
- Symbol:
ADAU7118ACPZRL - Footprint:
Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm - 3D model: LFCSP-16(3x3) (KiCad packages3D, STEP)
- 3D model files:
adau7118acpzrl-etched.step/adau7118acpzrl-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);adau7118acpzrl.step/adau7118acpzrl.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Analog Devices datasheet (35 pp, sha256
8b720e57686f67dd, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).