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ADA4930-1YCPZ-R2

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Analog Devices Pre-ordered Chips, LFCSP-16(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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ADA4930-1YCPZ-R2

Analog Devices · Pre-ordered Chips · LFCSP-16(3x3)

ADA4930-1YCPZ-R2 from Analog Devices, in a LFCSP-16(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 -FB output Negative output for feedback component connection, used to connect the external gain-setting feedback network.
2 +IN input Positive input summing node.
3 -IN input Negative input summing node.
4 +FB output Positive output for feedback component connection, used to connect the external gain-setting feedback network.
5 +VS power_in Positive supply voltage; pins 5 to 8 are all connected to +VS.
6 +VS power_in Positive supply voltage; pins 5 to 8 are all connected to +VS.
7 +VS power_in Positive supply voltage; pins 5 to 8 are all connected to +VS.
8 +VS power_in Positive supply voltage; pins 5 to 8 are all connected to +VS.
9 VOCM input Output common-mode voltage control pin that sets the amplifier output common-mode level (datasheet example connects it to an ADC VCM output).
10 +OUT output Positive output for load connection.
11 -OUT output Negative output for load connection.
12 PD input Power-down pin; the datasheet gives no logic threshold for this pin in the pin table.
13 -VS power_in Negative supply voltage; pins 13 to 16 are all connected to -VS.
14 -VS power_in Negative supply voltage; pins 13 to 16 are all connected to -VS.
15 -VS power_in Negative supply voltage; pins 13 to 16 are all connected to -VS.
16 -VS power_in Negative supply voltage; pins 13 to 16 are all connected to -VS.
17 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Analog Devices
Package LFCSP-16(3x3)
Category Interface ICs
Pins 17

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Offset Voltage -3.1 -0.5 3.1 mV VS = 3.3 V; VIP = VIN = VOCM = 0 V, RL = open circuit 3
Input Bias Current -36 -24 -16 μA VS = 3.3 V 3
Input Offset Current -1.8 0.1 1.8 μA VS = 3.3 V 3
Input Common-Mode Voltage Range 0.3 1.2 V VS = 3.3 V 3
Output Voltage 0.11 1.74 V VS = 3.3 V; each single-ended output; RF = RG = 10 kΩ 3
VOCM Input Voltage Range 0.8 1.1 V VS = 3.3 V 4
VOCM Input Resistance 7 8.3 10.3 kΩ VS = 3.3 V 4
VOCM Input Offset Voltage VOS, cm -25 15.4 31 mV VS = 3.3 V; VOS,cm = VO,cm − VOCM; VIP = VIN = VOCM = 0 V 4
VOCM Gain 0.99 1 1.02 V/V VS = 3.3 V 4
Quiescent Current per Amplifier, Enabled 32 35 40 mA VS = 3.3 V; enabled 4
Quiescent Current per Amplifier, Disabled 0.44 1.8 2.35 mA VS = 3.3 V; disabled 4
PD Input Voltage, Disabled 0.8 V VS = 3.3 V; printed as <0.8 V 4
PD Input Voltage, Enabled 1.3 V VS = 3.3 V; printed as >1.3 V 4
Input Offset Voltage -3.1 -0.15 3.1 mV VS = 5 V; VIP = VIN = VOCM = 0 V, RL = open circuit 5
Input Bias Current -34 -23 -15 μA VS = 5 V 5
Input Offset Current -0.82 0.1 0.82 μA VS = 5 V 5
Input Common-Mode Voltage Range 0.3 2.8 V VS = 5 V 5
Output Voltage 0.18 3.38 V VS = 5 V; each single-ended output; RF = RG = 10 kΩ 5
VOCM Input Voltage Range 0.5 2.3 V VS = 5 V 6
VOCM Input Resistance 7 8.3 10.2 kΩ VS = 5 V 6
VOCM Input Offset Voltage VOS, cm -25 0.35 15 mV VS = 5 V; VOS,cm = VO,cm − VOCM; VIP = VIN = VOCM = 0 V 6
VOCM Gain 0.99 1 1.02 V/V VS = 5 V 6
Quiescent Current per Amplifier, Enabled 31.1 34 38.4 mA VS = 5 V; enabled 6
Quiescent Current per Amplifier, Disabled 0.45 1.8 2.6 mA VS = 5 V; disabled 6
PD Input Voltage, Disabled 2.5 V VS = 5 V; printed as <2.5 V 6
PD Input Voltage, Enabled 3 V VS = 5 V; printed as >3 V 6
Supply Voltage 5.5 V 7
Storage Temperature Range -65 125 °C 7
Operating Temperature Range -40 105 °C 7
Lead Temperature (Soldering) 300 °C 10 sec soldering 7
Junction Temperature 150 °C 7
Thermal Resistance, Junction-to-Ambient (θJA) θJA 98 °C/W 16-lead LFCSP (exposed pad); soldered to 2s2p board per EIA/JESD51-7 7

CAD (KiCad official)

  • Symbol: ADA4930-1YCPZ-R2
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: LFCSP-16(3x3) (KiCad packages3D, STEP)
  • 3D model files: ada4930-1ycpz-r2-etched.step / ada4930-1ycpz-r2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ada4930-1ycpz-r2.step / ada4930-1ycpz-r2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (25 pp, sha256 c97047572cc99f25, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF