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Contents

README

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AD9219ABCPZ-65

Analog Devices · Analog To Digital Converters (ADCs) · LFCSP-48(7x7)

AD9219ABCPZ-65 from Analog Devices, in a LFCSP-48(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 AVDD power_in 1.8 V analog supply.
2 AVDD power_in 1.8 V analog supply.
3 VIN-D power_in ADC D analog input complement.
4 VIN+D power_in ADC D analog input true.
5 AVDD power_in 1.8 V analog supply.
6 AVDD power_in 1.8 V analog supply.
7 CLK- input Input clock complement.
8 CLK+ input Input clock true.
9 AVDD power_in 1.8 V analog supply.
10 AVDD power_in 1.8 V analog supply.
11 DRGND power_in Digital output driver ground.
12 DRVDD power_in 1.8 V digital output driver supply.
13 D-D output ADC D digital output complement.
14 D+D output ADC D digital output true.
15 D-C output ADC C digital output complement.
16 D+C output ADC C digital output true.
17 D-B output ADC B digital output complement.
18 D+B output ADC B digital output true.
19 D-A output ADC A digital output complement.
20 D+A output ADC A digital output true.
21 FCO- output Frame clock output complement.
22 FCO+ output Frame clock output true.
23 DCO- output Data clock output complement.
24 DCO+ output Data clock output true.
25 DRVDD power_in 1.8 V digital output driver supply.
26 DRGND power_in Digital output driver ground.
27 AVDD power_in 1.8 V analog supply.
28 SCLK/DTP input Serial clock input for the SPI, also serves as digital test pattern pin when strapped.
29 SDIO/ODM bidirectional Serial data input/output for the SPI, also serves as output driver mode pin when strapped.
30 CSB input Chip select bar, active low; enables or disables SPI read and write cycles.
31 PDWN input Power-down control input.
32 AVDD power_in 1.8 V analog supply.
33 VIN+A power_in ADC A analog input true.
34 VIN-A power_in ADC A analog input complement.
35 AVDD power_in 1.8 V analog supply.
36 AVDD power_in 1.8 V analog supply.
37 VIN-B power_in ADC B analog input complement.
38 VIN+B power_in ADC B analog input true.
39 AVDD power_in 1.8 V analog supply.
40 RBIAS passive External resistor sets the internal ADC core bias current.
41 SENSE passive Reference mode selection.
42 VREF power_in Voltage reference input/output.
43 REFB passive Differential reference (negative).
44 REFT passive Differential reference (positive).
45 AVDD power_in 1.8 V analog supply.
46 AVDD power_in 1.8 V analog supply.
47 VIN+C power_in ADC C analog input true.
48 VIN-C power_in ADC C analog input complement.
49 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Analog Devices
Package LFCSP-48(7x7)
Category ADC/DAC/Data Conversion
Pins 49

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage AVDD with respect to AGND AVDD -0.3 2 V With respect to AGND 10
Supply voltage DRVDD with respect to DRGND DRVDD -0.3 2 V With respect to DRGND 10
AGND with respect to DRGND -0.3 0.3 V With respect to DRGND 10
AVDD with respect to DRVDD -2 2 V With respect to DRVDD 10
Digital outputs (D+x, D-x, DCO+, DCO-, FCO+, FCO-) -0.3 2 V With respect to DRGND 10
CLK+, CLK- input voltage -0.3 3.9 V With respect to AGND 10
VIN+x, VIN-x analog input voltage -0.3 2 V With respect to AGND 10
SDIO/ODM voltage -0.3 2 V With respect to AGND 10
PDWN, SCLK/DTP, CSB voltage -0.3 3.9 V With respect to AGND 10
REFT, REFB, RBIAS voltage -0.3 2 V With respect to AGND 10
VREF, SENSE voltage -0.3 2 V With respect to AGND 10
Operating temperature range (ambient) -40 85 °C Ambient 10
Maximum junction temperature 150 °C 10
Lead temperature (soldering, 10 sec) 300 °C Soldering, 10 sec 10
Storage temperature range (ambient) -65 150 °C Ambient 10
Thermal resistance junction-to-ambient θJA 24 °C/W Airflow 0.0 m/sec; 4-layer PCB, exposed pad soldered 10
Thermal resistance junction-to-ambient θJA 21 °C/W Airflow 1.0 m/sec; 4-layer PCB, exposed pad soldered 10
Thermal resistance junction-to-board θJB 12.6 °C/W Airflow 1.0 m/sec 10
Thermal resistance junction-to-case θJC 1.2 °C/W Airflow 1.0 m/sec 10
Thermal resistance junction-to-ambient θJA 19 °C/W Airflow 2.5 m/sec; 4-layer PCB, exposed pad soldered 10

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper AD9219 exposed paddle, Pin 0. The copper plane must have 36

CAD (KiCad official)

  • Symbol: AD9219ABCPZ-65
  • Footprint: Package_DFN_QFN:QFN-48-1EP_7x7mm_P0.5mm_EP5.15x5.15mm
  • 3D model: LFCSP-48(7x7) (KiCad packages3D, STEP)
  • 3D model files: ad9219abcpz-65-etched.step / ad9219abcpz-65-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ad9219abcpz-65.step / ad9219abcpz-65.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (53 pp, sha256 12b26d1dd32fc77b, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF