component
AD8432ACPZ-R7
Public Made by Adomby adom
Analog Devices Low Noise Amplifiers (LNA) - RF, QFN-24-EP(4x4). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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AD8432ACPZ-R7
Analog Devices · Low Noise Amplifiers (LNA) - RF · QFN-24-EP(4x4)
AD8432ACPZ-R7 from Analog Devices, in a QFN-24-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | INH1 | input | Noninverting input of LNA1. |
| 2 | INL1 | input | Inverting input of LNA1, which is ac-coupled to ground. |
| 3 | IND1 | passive | Integrated input clamping back-to-back diodes for channel 1. |
| 4 | COMM | power_in | Input ground. |
| 5 | INL2 | input | Inverting input of LNA2, which is ac-coupled to ground. |
| 6 | INH2 | input | Noninverting input of LNA2. |
| 7 | IND2 | passive | Integrated input clamping back-to-back diodes for channel 2. |
| 8 | VPS2 | power_in | 5 V supply for LNA2. |
| 9 | OPH2 | output | Noninverting output of LNA2. |
| 10 | GOH2 | input | Gain setting pin for LNA2. |
| 11 | GMH2 | input | Gain setting pin for LNA2. |
| 12 | GML2 | input | Gain setting pin for LNA2. |
| 13 | GOL2 | input | Gain setting pin for LNA2. |
| 14 | OPL2 | output | Inverting output of LNA2. |
| 15 | COM2 | power_in | LNA2 output ground. |
| 16 | COM1 | power_in | LNA1 output ground. |
| 17 | OPL1 | output | Inverting output of LNA1. |
| 18 | GOL1 | input | Gain setting pin for LNA1. |
| 19 | GML1 | input | Gain setting pin for LNA1. |
| 20 | GMH1 | input | Gain setting pin for LNA1. |
| 21 | GOH1 | input | Gain setting pin for LNA1. |
| 22 | OPH1 | output | Noninverting output of LNA1. |
| 23 | VPS1 | power_in | 5 V supply for LNA1. |
| 24 | ENB | input | Enable pin. |
| 25 | EPAD | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Analog Devices |
| Package | QFN-24-EP(4x4) |
| Category | RF & Radio |
| Pins | 25 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Gain Range (input to differential output) | 12.04 | 24.08 | dB | Input to differential output (selectable gain) | 3 | ||
| Gain Range (input to single output) | 6.02 | 18.06 | dB | Input to single output (selectable gain) | 3 | ||
| Gain Error | 0.1 | 1 | dB | 3 | |||
| Input Offset Voltage | -6.25 | 1 | 6.25 | mV | 4 | ||
| Output Offset Voltage | -25 | 4 | 25 | mV | 4 | ||
| Supply Voltage | 4.5 | 5 | 5.5 | V | 4 | ||
| Supply Current in Shutdown Mode | 50 | 100 | µA | ENB = GND | 4 | ||
| Output Resistance | 0.1 | Ω | Single-ended, either output | 4 | |||
| Operating Temperature | -40 | 85 | °C | 5 | |||
| Supply Voltage | 5.5 | V | 5 | ||||
| Input Voltage | 0 | V | Printed as 0 V to VPS | 5 | |||
| Power Dissipation | 120 | mW | 5 | ||||
| Storage Temperature | -65 | 150 | °C | 5 | |||
| Package Glass Transition Temperature (TG) | TG | 150 | °C | 5 | |||
| Lead Temperature (Soldering) | 300 | °C | 60 sec soldering | 5 | |||
| Junction-to-Ambient Thermal Resistance | θJA | 57.9 | °C/W | 4-layer JEDEC board (2S2P), zero airflow | 5 | ||
| Junction-to-Case Thermal Resistance | θJC | 11.2 | °C/W | 5 | |||
| Junction-to-Board Thermal Resistance | θJB | 35.9 | °C/W | 5 | |||
| Junction-to-Top Characterization Parameter | ΨJT | 1.1 | °C/W | 5 |
CAD (KiCad official)
- Symbol:
AD8432ACPZ-R7 - Footprint:
Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm - 3D model: QFN-24-EP(4x4) (KiCad packages3D, STEP)
- 3D model files:
ad8432acpz-r7-etched.step/ad8432acpz-r7-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ad8432acpz-r7.step/ad8432acpz-r7.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Analog Devices datasheet (32 pp, sha256
34244e932580fc09, retrieved 2026-10-29, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# AD8432ACPZ-R7
**Analog Devices** · Low Noise Amplifiers (LNA) - RF · QFN-24-EP(4x4)
AD8432ACPZ-R7 from Analog Devices, in a QFN-24-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | INH1 | input | Noninverting input of LNA1. |
| 2 | INL1 | input | Inverting input of LNA1, which is ac-coupled to ground. |
| 3 | IND1 | passive | Integrated input clamping back-to-back diodes for channel 1. |
| 4 | COMM | power_in | Input ground. |
| 5 | INL2 | input | Inverting input of LNA2, which is ac-coupled to ground. |
| 6 | INH2 | input | Noninverting input of LNA2. |
| 7 | IND2 | passive | Integrated input clamping back-to-back diodes for channel 2. |
| 8 | VPS2 | power_in | 5 V supply for LNA2. |
| 9 | OPH2 | output | Noninverting output of LNA2. |
| 10 | GOH2 | input | Gain setting pin for LNA2. |
| 11 | GMH2 | input | Gain setting pin for LNA2. |
| 12 | GML2 | input | Gain setting pin for LNA2. |
| 13 | GOL2 | input | Gain setting pin for LNA2. |
| 14 | OPL2 | output | Inverting output of LNA2. |
| 15 | COM2 | power_in | LNA2 output ground. |
| 16 | COM1 | power_in | LNA1 output ground. |
| 17 | OPL1 | output | Inverting output of LNA1. |
| 18 | GOL1 | input | Gain setting pin for LNA1. |
| 19 | GML1 | input | Gain setting pin for LNA1. |
| 20 | GMH1 | input | Gain setting pin for LNA1. |
| 21 | GOH1 | input | Gain setting pin for LNA1. |
| 22 | OPH1 | output | Noninverting output of LNA1. |
| 23 | VPS1 | power_in | 5 V supply for LNA1. |
| 24 | ENB | input | Enable pin. |
| 25 | EPAD | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Analog Devices |
| Package | QFN-24-EP(4x4) |
| Category | RF & Radio |
| Pins | 25 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Gain Range (input to differential output) | | 12.04 | | 24.08 | dB | Input to differential output (selectable gain) | 3 |
| Gain Range (input to single output) | | 6.02 | | 18.06 | dB | Input to single output (selectable gain) | 3 |
| Gain Error | | | 0.1 | 1 | dB | | 3 |
| Input Offset Voltage | | -6.25 | 1 | 6.25 | mV | | 4 |
| Output Offset Voltage | | -25 | 4 | 25 | mV | | 4 |
| Supply Voltage | | 4.5 | 5 | 5.5 | V | | 4 |
| Supply Current in Shutdown Mode | | | 50 | 100 | µA | ENB = GND | 4 |
| Output Resistance | | | | 0.1 | Ω | Single-ended, either output | 4 |
| Operating Temperature | | -40 | | 85 | °C | | 5 |
| Supply Voltage | | | | 5.5 | V | | 5 |
| Input Voltage | | 0 | | | V | Printed as 0 V to VPS | 5 |
| Power Dissipation | | | | 120 | mW | | 5 |
| Storage Temperature | | -65 | | 150 | °C | | 5 |
| Package Glass Transition Temperature (TG) | TG | | | 150 | °C | | 5 |
| Lead Temperature (Soldering) | | | | 300 | °C | 60 sec soldering | 5 |
| Junction-to-Ambient Thermal Resistance | θJA | | 57.9 | | °C/W | 4-layer JEDEC board (2S2P), zero airflow | 5 |
| Junction-to-Case Thermal Resistance | θJC | | 11.2 | | °C/W | | 5 |
| Junction-to-Board Thermal Resistance | θJB | | 35.9 | | °C/W | | 5 |
| Junction-to-Top Characterization Parameter | ΨJT | | 1.1 | | °C/W | | 5 |
## CAD (KiCad official)
- Symbol: `AD8432ACPZ-R7`
- Footprint: `Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm`
- 3D model: QFN-24-EP(4x4) (KiCad packages3D, STEP)
- 3D model files: `ad8432acpz-r7-etched.step` / `ad8432acpz-r7-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ad8432acpz-r7.step` / `ad8432acpz-r7.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Analog Devices datasheet](https://www.analog.com/media/en/technical-documentation/data-sheets/AD8432.pdf) (32 pp, sha256 `34244e932580fc09`, retrieved 2026-10-29, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/ad8432acpz-r7-datasheet.pdf)