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AD7298BCPZ-RL7

Analog Devices · Analog To Digital Converters (ADCs) · LFCSP-20(4x4)

AD7298BCPZ-RL7 from Analog Devices, in a LFCSP-20(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN3 input Analog input channel 3, single-ended, accepts 0 V to 2.5 V; unused inputs should be connected to GND1.
2 VIN4 input Analog input channel 4, single-ended, accepts 0 V to 2.5 V; unused inputs should be connected to GND1.
3 VIN5 input Analog input channel 5, single-ended, accepts 0 V to 2.5 V; unused inputs should be connected to GND1.
4 VIN6 input Analog input channel 6, single-ended, accepts 0 V to 2.5 V; unused inputs should be connected to GND1.
5 VIN7 input Analog input channel 7, single-ended, accepts 0 V to 2.5 V; unused inputs should be connected to GND1.
6 GND1 power_in Ground reference for the internal reference circuitry and all analog inputs; must be within 0.3 V of GND and connected to the system GND plane, with VREF decoupled to it by 10 μF.
7 VREF power_in Internal 2.5 V reference output, which can be buffered and used externally, or disabled and driven by an external reference of 2.0 V to 2.5 V; decouple with 10 μF to GND1.
8 DCAP passive Decoupling capacitor pin for the internal LDO, requiring 1 μF recommended capacitors to GND.
9 GND power_in Ground reference for all analog and digital circuitry, which must be within 0.3 V of GND1 and connected to the system ground plane.
10 VDD power_in Main supply voltage of 2.8 V to 3.6 V, to be decoupled to GND with 10 μF and 100 nF capacitors.
11 CS input Active-low chip select; the falling edge starts a conversion and frames the serial transfer, with DOUT enabled while CS is low.
12 TSENSE_BUSY output Busy output that goes high when a temperature sensor conversion starts and stays high until it completes.
13 DIN input Serial data input for writing the control register, clocked in on the falling edge of SCLK.
14 DOUT output Serial data output carrying four channel address bits followed by 12 bits of MSB-first conversion data, clocked out on the falling edge of SCLK.
15 SCLK input Serial clock input for accessing conversion data from the AD7298 (fSCLK up to 20 MHz per Table 1 conditions).
16 VDRIVE power_in Logic supply that sets the digital interface voltage; range 1.65 V to 3.6 V, may be lower than VDD but must not exceed VDD by more than 0.3 V, and should be decoupled to GND.
17 PD/RST input Power-down pin that places the part in full power-down when held low beyond 100 ns, and resets the device when pulsed low for 1 ns to 100 ns; analog inputs must be at 0 V before power-down.
18 VIN0 input Analog input channel 0, single-ended, accepts 0 V to 2.5 V; unused inputs should be connected to GND1.
19 VIN1 input Analog input channel 1, single-ended, accepts 0 V to 2.5 V; unused inputs should be connected to GND1.
20 VIN2 input Analog input channel 2, single-ended, accepts 0 V to 2.5 V; unused inputs should be connected to GND1.
21 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Analog Devices
Package LFCSP-20(4x4)
Category ADC/DAC/Data Conversion
Pins 21

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VDD supply voltage VDD 2.8 3 3.6 V 4
VDRIVE logic supply voltage VDRIVE 1.65 3 3.6 V 4
Normal mode (operational) total supply current ITOTAL 5.8 6.3 mA VDD = 3.6 V, VDRIVE = 3.6 V 4
Normal mode (static) total supply current ITOTAL 4.1 4.6 mA VDD = 3.6 V, VDRIVE = 3.6 V 4
Partial power-down total supply current ITOTAL 2.7 3.3 mA VDD = 3.6 V, VDRIVE = 3.6 V 4
Full power-down total supply current ITOTAL 1 1.6 μA TA = −40°C to +25°C 4
Power dissipation, normal mode (operational) 17.4 18.9 mW VDD = 3 V, VDRIVE = 3 V 4
Power dissipation, normal mode (static) 14.8 16.6 mW 4
Power dissipation, partial power-down mode 9.8 11.9 mW 4
Power dissipation, full power-down mode 3.6 5.8 μW TA = −40°C to +25°C 4
Signal-to-noise ratio SNR 70 72 dB fIN = 50 kHz sine wave 3
Signal-to-noise and distortion ratio SINAD 70 71 dB fIN = 50 kHz sine wave 3
Total harmonic distortion THD -82 -77 dB fIN = 50 kHz sine wave 3
Spurious-free dynamic range SFDR -84 -77.5 dB fIN = 50 kHz sine wave 3
Integral nonlinearity INL -1 0.5 1 LSB 3
Differential nonlinearity DNL -0.99 0.5 0.99 LSB Guaranteed no missed codes to 12 bits 3
Offset error -4.5 2 4.5 LSB 3
Offset error matching -4.5 2.5 4.5 LSB 3
Gain error -4 1 4 LSB 3
Gain error matching -2.5 1 2.5 LSB 3
Analog input DC leakage current -1 0.01 1 μA 3
Reference output voltage 2.4925 2.5 2.5075 V ±0.3% maximum @ 25°C 3
Reference input voltage range 1 2.5 V 3
Reference DC leakage current -1 0.01 1 μA External reference applied to Pin VREF 3
VREF temperature coefficient 12 35 ppm/°C 3
Logic input current IIN -1 0.01 1 μA VIN = 0 V or VDRIVE 4
Floating state leakage current -1 0.01 1 μA 4
Internal temperature sensor accuracy -2 1 2 °C TA = −40°C to +85°C 4
Internal temperature sensor accuracy -3 1 3 °C TA = +85°C to +125°C 4
Internal temperature sensor operating range -40 125 °C 4
Conversion time, temperature sensor channel tCONVERT 100 μs Temperature sensor channel 5
Frequency of external serial clock (minimum) fSCLK 50 kHz Frequency of external serial clock 5
Frequency of external serial clock (maximum) fSCLK 20 MHz Frequency of external serial clock 5
Quiet time between end of serial read and start of next conversion tQUIET 6 ns Repeat and nonrepeat mode 5
CS to SCLK setup time t2 10 ns 5
Delay from CS falling edge until DOUT three-state disabled t3 15 ns 5
Data access time after SCLK falling edge t4 35 ns VDRIVE = 1.65 V to 3 V 5
Data access time after SCLK falling edge t4 28 ns VDRIVE = 3 V to 3.6 V 5
SCLK to DOUT valid hold time t7 14 ns 5
SCLK falling edge to DOUT high impedance t8 16 34 ns 5
DIN setup time prior to SCLK falling edge t9 5 ns 5
DIN hold time after SCLK falling edge t10 4 ns 5
TSENSE_BUSY falling edge to CS falling edge t11 100 ns 5
Delay from CS rising edge to DOUT high impedance t12 30 ns 5
Internal reference power-up time from full power-down tPOWER-UP 6 ms 5
VDD to GND VDD -0.3 5 V 6
VDRIVE to GND VDRIVE -0.3 5 V 6
Analog input voltage to GND1 -0.3 3 V 6
VREF to GND1 VREF -0.3 3 V 6
GND1 to GND -0.3 0.3 V 6
Input current to any pin except supplies -10 10 mA 6
Operating temperature range -40 125 °C 6
Storage temperature range -65 150 °C 6
Junction temperature 150 °C 6
Pb-free soldering reflow temperature 260 °C 6
Thermal resistance, junction-to-ambient θJA 52 °C/W 20-Lead LFCSP 6
Thermal resistance, junction-to-case θJC 6.5 °C/W 20-Lead LFCSP 6

CAD (KiCad official)

  • Symbol: AD7298BCPZ-RL7
  • Footprint: Package_DFN_QFN:QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm
  • 3D model: LFCSP-20(4x4) (KiCad packages3D, STEP)
  • 3D model files: ad7298bcpz-rl7-etched.step / ad7298bcpz-rl7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ad7298bcpz-rl7.step / ad7298bcpz-rl7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (24 pp, sha256 aa6164eb83a61130, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF