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ACDBC360-HF

Public Made by Adom

by adom

Comchip Schottky Barrier Diodes (SBD), DO-214AB. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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ACDBC360-HF

Comchip · Schottky Barrier Diodes (SBD) · DO-214AB

ACDBC360-HF from Comchip, in a DO-214AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode, indicated by the cathode band on the DO-214AB (SMC) package; the diode conducts when this pin is negative relative to the anode (60V max repetitive peak reverse voltage for ACDBC360-HF).
2 A passive Anode terminal of the Schottky rectifier, rated for 3A maximum average forward rectified current with 0.70V max forward voltage at IF=3A for ACDBC360-HF.

Key specifications

Parameter Value
Manufacturer Comchip
Package DO-214AB
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Max. Repetitive peak reverse voltage VRRM 60 V TA=25°C 1
Max. RMS voltage VRMS 42 V TA=25°C 1
Max. DC blocking voltage VDC 60 V TA=25°C 1
Max. Average forward rectified current IF 3 A TA=25°C 1
Peak forward surge current IFSM 80 A 8.3ms single half sine-wave superimposed on rated load 1
Max. Instantaneous forward voltage VF 0.7 V IF=3A @ 25°C 1
Storage temperature range TSTG -55 150 °C 1
Typical thermal resistance, junction to ambient RθJA 55 °C/W Note 2: FR4 substrate, 0.4" x 0.5", 2oz, single-sided, 0.2" x 0.25" copper pad 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin - Terminals: Lead free plating (Tin finish). -Solderable per MIL-STD-202, Method 208. 1

CAD (KiCad official)

  • Symbol: ACDBC360-HF
  • Footprint: Diode_SMD:D_SMC
  • 3D model: DO-214AB (KiCad packages3D, STEP)
  • 3D model files: acdbc360-hf-etched.step / acdbc360-hf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); acdbc360-hf.step / acdbc360-hf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Comchip datasheet (4 pp, sha256 df1d382e916dda0b, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF