# ABS10-HF

**Comchip** · Bridge Rectifiers · ABS

ABS10-HF from Comchip, in a ABS. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | + | passive | Positive DC output of the bridge rectifier, marked + on the body. |
| 2 | 2 | passive | AC input terminal of the bridge, marked ~ on the body. |
| 3 | 3 | passive | AC input terminal of the bridge, marked ~ on the body. |
| 4 | - | passive | Negative DC output of the bridge rectifier, marked - on the body. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Comchip |
| Package | ABS |
| Category | Diodes |
| Pins | 4 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Recurrent Peak Reverse Voltage | VRRM |  |  | 1000 | V |  | 1 |
| Maximum RMS Voltage | VRMS |  |  | 700 | V |  | 1 |
| Maximum DC Blocking Voltage | VDC |  |  | 1000 | V |  | 1 |
| Maximum Average Forward Rectified Current | I(AV) |  |  | 1 | A | Mounted on P.C.Board (Note 1) | 1 |
| Peak Forward Surge Current, 8.3ms Single Half Sine-Wave, Super Imposed on Rated Load (JEDEC Method) | IFSM |  |  | 30 | A | 8.3ms single half sine-wave, superimposed on rated load (JEDEC method) | 1 |
| Maximum Forward Voltage | VF |  |  | 1.1 | V | at 1.0A DC | 1 |
| Maximum DC Reverse Current | IR |  |  | 5 | µA | @TJ=25°C, at rated DC blocking voltage | 1 |
| Maximum DC Reverse Current | IR |  |  | 500 | µA | @TJ=125°C, at rated DC blocking voltage | 1 |
| Typical Thermal Resistance junction to ambient | RθJA |  | 80 |  | °C/W | Note 2: thermal resistance junction to ambient | 1 |
| Typical Thermal Resistance junction to case | RθJC |  | 12 |  | °C/W |  | 1 |
| Operating Temperature Range | TJ | -55 |  | 150 | °C |  | 1 |
| Storage Temperature Range | TSTG | -55 |  | 150 | °C |  | 1 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | tin | -Lead tin plated copper. | 1 |

## CAD (KiCad official)

- Symbol: `ABS10-HF`
- Footprint: `Diode_SMD:Diode_Bridge_Diotec_ABS`
- 3D model: ABS (KiCad packages3D, STEP)
- 3D model files: `abs10-hf-etched.step` / `abs10-hf-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `abs10-hf.step` / `abs10-hf.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Comchip datasheet](docs/abs10-hf-datasheet.pdf) (4 pp, sha256 `88583f1462fb5c2f`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/abs10-hf-datasheet.pdf)