component
A8522KLPTR-T
Public Made by Adomby adom
Allegro MicroSystems, LLC LED Drivers, TSSOP-28-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
main
A8522KLPTR-T
Allegro MicroSystems, LLC · LED Drivers · TSSOP-28-EP
A8522KLPTR-T from Allegro MicroSystems, LLC, in a TSSOP-28-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GATE | output | Gate driver for an optional external PMOS input-disconnect switch, pulled high to turn off the input supply on a fault such as output shorted to GND; left open if not used. |
| 2 | INS | input | Input current sense used together with VIN to detect input overcurrent faults; tie to VIN if not used. |
| 3 | VIN | power_in | Input power to the A8522, specified over an input voltage range of 4.5 to 36 V. |
| 4 | EN | input | Enable input that keeps the IC in shutdown while EN = VEN(L) and enables the part when connected to VEN(H) or to VIN. |
| 5 | FSET/SYNC | bidirectional | A resistor RFSET from this pin to GND sets the switching frequency, and the pin can also be used to synchronize to an external switching frequency. |
| 6 | COMP | passive | Output of the error amplifier and compensation node; connect a type-2 feedback network from this pin to AGND for loop compensation. |
| 7 | AGND | power_in | Analog ground for noise-sensitive components, especially COMP, and connected to the thermal pad. |
| 8 | VDD | power_out | Output of the internal LDO; connect a 0.47 µF decoupling capacitor between this pin and AGND. |
| 9 | FLAG | output | Active-low open-drain pin indicating that system attention is required, such as during startup or a fault; connect a 10 to 100 kΩ pull-up to the target logic level. |
| 10 | LED1 | passive | LED current sink channel 1, up to 60 mA; any unused LEDx pin should be connected to GND through a 4.7 kΩ resistor. |
| 11 | LED2 | passive | LED current sink channel 2, up to 60 mA; any unused LEDx pin should be connected to GND through a 4.7 kΩ resistor. |
| 12 | LED3 | passive | LED current sink channel 3, up to 60 mA; any unused LEDx pin should be connected to GND through a 4.7 kΩ resistor. |
| 13 | LED4 | passive | LED current sink channel 4, up to 60 mA; any unused LEDx pin should be connected to GND through a 4.7 kΩ resistor. |
| 14 | LED5 | passive | LED current sink channel 5, up to 60 mA; any unused LEDx pin should be connected to GND through a 4.7 kΩ resistor. |
| 15 | AGND | power_in | Analog ground for noise-sensitive components, especially COMP, and connected to the thermal pad. |
| 16 | LED6 | passive | LED current sink channel 6, up to 60 mA; any unused LEDx pin should be connected to GND through a 4.7 kΩ resistor. |
| 17 | LED7 | passive | LED current sink channel 7, up to 60 mA; any unused LEDx pin should be connected to GND through a 4.7 kΩ resistor. |
| 18 | LED8 | passive | LED current sink channel 8, up to 60 mA; any unused LEDx pin should be connected to GND through a 4.7 kΩ resistor. |
| 19 | NC | unconnected | No connect; terminate to GND through a 4.7 kΩ resistor and do not short directly to GND. |
| 20 | NC | unconnected | No connect; terminate to GND through a 4.7 kΩ resistor and do not short directly to GND. |
| 21 | GPO2 | output | General purpose open-drain output 2, programmable by internal register. |
| 22 | GPO1 | output | General purpose open-drain output 1, programmable by internal register. |
| 23 | SDA | bidirectional | I2C data signal. |
| 24 | SCL | input | I2C clock signal. |
| 25 | ADDR | input | Four-level input that sets up to 4 physical IC addresses based on the voltage level set by a resistor to GND. |
| 26 | PGND | power_in | Power ground for the internal NMOS switching device; connect to the output capacitor ground and to the thermal pad. |
| 27 | OVP | input | Connect to output voltage VOUT to provide output overvoltage protection (OVP) and undervoltage protection (UVP). |
| 28 | SW | passive | Drain of the internal NMOS switch of the boost converter. |
| 29 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Allegro MicroSystems, LLC |
| Package | TSSOP-28-EP |
| Category | Display Modules / LED Drivers / Display Drivers |
| Pins | 29 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| LEDx Pins | VLEDx | -0.3 | 42 | V | 3 | ||
| FLAG, GPO2, and OVP Pins | -0.3 | 42 | V | 3 | |||
| EN, VIN, INS, and GATE Pins | -0.3 | 40 | V | INS and GATE pins should not exceed VIN by more than 0.4 V | 3 | ||
| SW Pin, continuous | VSW | -0.6 | 42 | V | Continuous | 3 | |
| SW Pin, transient | VSW | -1 | 46 | V | t < 50 ns | 3 | |
| VDD, FSET/SYNC, COMP, GPO1, SDA, SCL, and ADDR Pins | -0.3 | 5.5 | V | 3 | |||
| Operating Ambient Temperature | TA | -40 | 125 | °C | K temperature range | 3 | |
| Maximum Junction Temperature | TJ(max) | 150 | °C | 3 | |||
| Storage Temperature | Tstg | -65 | 150 | °C | 3 | ||
| Package Thermal Resistance | RθJA | 28 | °C/W | On 4-layer PCB based on JEDEC standard | 3 | ||
| Input Voltage Range | VIN | 4.5 | 36 | V | Measured at the VIN pin | 6 | |
| VIN Pin UVLO Start | VINUV(ON) | 4.35 | V | VIN rising | 6 | ||
| VIN Pin UVLO Stop | VINUV(OFF) | 3.9 | V | VIN falling | 6 | ||
| Input Sleep Supply Current | IQSLEEP | 3.5 | 10 | µA | Sum of VIN and INS pin currents, VIN = VINS = 16 V, VEN = 0 V | 6 | |
| EN Input Logic Level - Low | VEN(L) | 0.4 | V | 4.5 V < VIN < 36 V | 6 | ||
| EN Input Logic Level - High | VEN(H) | 1.5 | V | 4.5 V < VIN < 36 V | 6 | ||
| Overvoltage Threshold (minimum setting) | VOVPMIN | 7.5 | 8 | 8.5 | V | OVP register = xxx0 0000 | 6 |
| Overvoltage Threshold (maximum setting) | VOVPMAX | 38 | 39 | 40 | V | OVP register = xxx1 1111 | 6 |
| OVP Leakage Current | IOVPLKG | 0.1 | 1 | µA | VOVP =16 V, EN = VEN(L) | 6 | |
| Switch On-Resistance | RDS(ON) | 220 | 350 | mΩ | ISW = 0.750 A, VIN = 16 V | 6 | |
| Switch Leakage Current | ISWLKG | 0.1 | 10 | µA | VSW = 16 V, EN = VEN(L), TA = TJ = -40°C to 85°C | 6 | |
| Cycle-by-Cycle Switch Current Limit | ISW(LIM) | 3.6 | 4.2 | 4.8 | A | 6 | |
| Secondary Switch Current Limit | ISWLIM(sec) | 5.6 | 7 | A | Higher than maximum ISW(LIM) at any condition (A8522 latches when detected) | 6 | |
| Minimum Switch On-Time | tSWONTIME | 85 | 120 | ns | RFSET = 10 kΩ | 6 | |
| Minimum Switch Off-Time | tSWOFFTIME | 55 | 85 | ns | RFSET = 10 kΩ | 6 | |
| Boost Stage Switching Frequency | fSW | 1.8 | 2 | 2.2 | MHz | RFSET = 10 kΩ | 7 |
| Synchronized Boost Stage Switching Frequency | fSW_SYNC | 400 | 2300 | kHz | 7 | ||
| Synchronization Input Minimum Off-Time | tSYNCPWOFF | 150 | ns | 7 | |||
| Synchronization Input Minimum On-Time | tSYNCPWON | 150 | ns | 7 | |||
| Synchronization Input Logic, Low | VSYNCON(L) | 0.4 | V | 7 | |||
| Synchronization Input Logic, High | VSYNCON(H) | 2 | V | 7 | |||
| LEDx Accuracy (Average) | ErrLEDx | 0.7 | 3 | % | Measured at ILEDMAX (maximum LED current) | 7 | |
| LEDx Matching | ΔILEDx | 0.8 | 3 | % | Compared to average ILEDx, measured at ILEDMAX | 7 | |
| LEDx Regulation Voltage | VREG | 0.85 | 1 | V | ISET register= xx11 1111 | 7 | |
| ILEDx Step Size | ISETSTEP | 0.9 | 1 | 1.1 | mA | Total 64 steps | 7 |
| Maximum LEDx Current (Average) | ILEDMAX | 62 | 64 | 66 | mA | ISET register = xx11 1111 | 7 |
| Interrupt Pin Pull-Down Voltage | 0.4 | V | Fault/Interrupt condition asserted, pull-up current = 0.5 mA | 7 | |||
| Interrupt Pin Leakage Current | 1 | µA | Fault/Interrupt condition cleared, pull-up to 3.6 V | 7 | |||
| Master Clock Period | TCLK | 120 | 150 | 180 | ns | 7 | |
| Master Clock Temperature Deviation | DTCLK | -2.5 | 2.5 | % | TCLK change over temperature range | 7 | |
| GATE Voltage at On | VGSON | 5 | 8 | V | Gate-to-source voltage when gate is on, measured as VIN, VGATE | 8 | |
| GATE Pin Leakage Current | IGLKG | 1 | µA | EN = VEN(L), VGATE = VIN | 8 | ||
| INS Trip Point | VINSTRIP | 90 | 105 | 120 | mV | Measured between VIN and INS | 8 |
| Thermal Shutdown Threshold | TSD | 155 | 170 | °C | Temperature rising | 8 | |
| Logic Input (SDA, SCL), Low | VSCL(L) | 0.8 | V | 8 | |||
| Logic Input (SDA, SCL), High | VSCL(H) | 2.3 | V | 8 | |||
| Logic Input Current | II2CI | -1 | 1 | µA | 8 | ||
| Output Voltage SDA | VI2COut(L) | 0.4 | V | SDA = low, pull-up current = 2.5 mA | 8 | ||
| Output Leakage SDA | II2CLKG | 1 | µA | EN = low, pull-up to 5.5 V | 8 | ||
| SCL Clock Frequency | fCLK | 400 | kHz | 8 | |||
| Voltage Level for Address 100,0000 | VADDLEVEL1 | 0 | 0.5 | V | ADDR connected to GND | 8 | |
| Voltage Level for Address 101,0000 | VADDLEVEL2 | 0.9 | 1.3 | V | RADDR = 110 kΩ from ADDR to GND | 8 | |
| Voltage Level for Address 110,0000 | VADDLEVEL3 | 1.75 | 2.45 | V | RADDR = 210 kΩ from ADDR to GND | 8 | |
| Voltage Level for Address 111,0000 | VADDLEVEL4 | 3.2 | 3.6 | V | ADDR connected to VDD pin or open | 8 | |
| ADDR Pull-Up Current | IADDR | -8.5 | -10 | -11.5 | µA | VADDR = 1 V | 8 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | A8522KLPTR-T -40 to 125 28-pin TSSOP with exposed thermal pad 4000 pieces per 13-in. reel 100% matte tin | 2 |
CAD (KiCad official)
- Symbol:
A8522KLPTR-T - Footprint:
Package_SO:TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x6.7mm - 3D model: TSSOP-28-EP (KiCad packages3D, STEP)
- 3D model files:
a8522klptr-t-etched.step/a8522klptr-t-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);a8522klptr-t.step/a8522klptr-t.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Allegro MicroSystems, LLC datasheet (65 pp, sha256
d6a7732d3abb26ac, retrieved 2026-11-05, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# A8522KLPTR-T
**Allegro MicroSystems, LLC** · LED Drivers · TSSOP-28-EP
A8522KLPTR-T from Allegro MicroSystems, LLC, in a TSSOP-28-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GATE | output | Gate driver for an optional external PMOS input-disconnect switch, pulled high to turn off the input supply on a fault such as output shorted to GND; left open if not used. |
| 2 | INS | input | Input current sense used together with VIN to detect input overcurrent faults; tie to VIN if not used. |
| 3 | VIN | power_in | Input power to the A8522, specified over an input voltage range of 4.5 to 36 V. |
| 4 | EN | input | Enable input that keeps the IC in shutdown while EN = VEN(L) and enables the part when connected to VEN(H) or to VIN. |
| 5 | FSET/SYNC | bidirectional | A resistor RFSET from this pin to GND sets the switching frequency, and the pin can also be used to synchronize to an external switching frequency. |
| 6 | COMP | passive | Output of the error amplifier and compensation node; connect a type-2 feedback network from this pin to AGND for loop compensation. |
| 7 | AGND | power_in | Analog ground for noise-sensitive components, especially COMP, and connected to the thermal pad. |
| 8 | VDD | power_out | Output of the internal LDO; connect a 0.47 µF decoupling capacitor between this pin and AGND. |
| 9 | FLAG | output | Active-low open-drain pin indicating that system attention is required, such as during startup or a fault; connect a 10 to 100 kΩ pull-up to the target logic level. |
| 10 | LED1 | passive | LED current sink channel 1, up to 60 mA; any unused LEDx pin should be connected to GND through a 4.7 kΩ resistor. |
| 11 | LED2 | passive | LED current sink channel 2, up to 60 mA; any unused LEDx pin should be connected to GND through a 4.7 kΩ resistor. |
| 12 | LED3 | passive | LED current sink channel 3, up to 60 mA; any unused LEDx pin should be connected to GND through a 4.7 kΩ resistor. |
| 13 | LED4 | passive | LED current sink channel 4, up to 60 mA; any unused LEDx pin should be connected to GND through a 4.7 kΩ resistor. |
| 14 | LED5 | passive | LED current sink channel 5, up to 60 mA; any unused LEDx pin should be connected to GND through a 4.7 kΩ resistor. |
| 15 | AGND | power_in | Analog ground for noise-sensitive components, especially COMP, and connected to the thermal pad. |
| 16 | LED6 | passive | LED current sink channel 6, up to 60 mA; any unused LEDx pin should be connected to GND through a 4.7 kΩ resistor. |
| 17 | LED7 | passive | LED current sink channel 7, up to 60 mA; any unused LEDx pin should be connected to GND through a 4.7 kΩ resistor. |
| 18 | LED8 | passive | LED current sink channel 8, up to 60 mA; any unused LEDx pin should be connected to GND through a 4.7 kΩ resistor. |
| 19 | NC | unconnected | No connect; terminate to GND through a 4.7 kΩ resistor and do not short directly to GND. |
| 20 | NC | unconnected | No connect; terminate to GND through a 4.7 kΩ resistor and do not short directly to GND. |
| 21 | GPO2 | output | General purpose open-drain output 2, programmable by internal register. |
| 22 | GPO1 | output | General purpose open-drain output 1, programmable by internal register. |
| 23 | SDA | bidirectional | I2C data signal. |
| 24 | SCL | input | I2C clock signal. |
| 25 | ADDR | input | Four-level input that sets up to 4 physical IC addresses based on the voltage level set by a resistor to GND. |
| 26 | PGND | power_in | Power ground for the internal NMOS switching device; connect to the output capacitor ground and to the thermal pad. |
| 27 | OVP | input | Connect to output voltage VOUT to provide output overvoltage protection (OVP) and undervoltage protection (UVP). |
| 28 | SW | passive | Drain of the internal NMOS switch of the boost converter. |
| 29 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Allegro MicroSystems, LLC |
| Package | TSSOP-28-EP |
| Category | Display Modules / LED Drivers / Display Drivers |
| Pins | 29 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| LEDx Pins | VLEDx | -0.3 | | 42 | V | | 3 |
| FLAG, GPO2, and OVP Pins | | -0.3 | | 42 | V | | 3 |
| EN, VIN, INS, and GATE Pins | | -0.3 | | 40 | V | INS and GATE pins should not exceed VIN by more than 0.4 V | 3 |
| SW Pin, continuous | VSW | -0.6 | | 42 | V | Continuous | 3 |
| SW Pin, transient | VSW | -1 | | 46 | V | t < 50 ns | 3 |
| VDD, FSET/SYNC, COMP, GPO1, SDA, SCL, and ADDR Pins | | -0.3 | | 5.5 | V | | 3 |
| Operating Ambient Temperature | TA | -40 | | 125 | °C | K temperature range | 3 |
| Maximum Junction Temperature | TJ(max) | | | 150 | °C | | 3 |
| Storage Temperature | Tstg | -65 | | 150 | °C | | 3 |
| Package Thermal Resistance | RθJA | | 28 | | °C/W | On 4-layer PCB based on JEDEC standard | 3 |
| Input Voltage Range | VIN | 4.5 | | 36 | V | Measured at the VIN pin | 6 |
| VIN Pin UVLO Start | VINUV(ON) | | | 4.35 | V | VIN rising | 6 |
| VIN Pin UVLO Stop | VINUV(OFF) | | | 3.9 | V | VIN falling | 6 |
| Input Sleep Supply Current | IQSLEEP | | 3.5 | 10 | µA | Sum of VIN and INS pin currents, VIN = VINS = 16 V, VEN = 0 V | 6 |
| EN Input Logic Level - Low | VEN(L) | | | 0.4 | V | 4.5 V < VIN < 36 V | 6 |
| EN Input Logic Level - High | VEN(H) | 1.5 | | | V | 4.5 V < VIN < 36 V | 6 |
| Overvoltage Threshold (minimum setting) | VOVPMIN | 7.5 | 8 | 8.5 | V | OVP register = xxx0 0000 | 6 |
| Overvoltage Threshold (maximum setting) | VOVPMAX | 38 | 39 | 40 | V | OVP register = xxx1 1111 | 6 |
| OVP Leakage Current | IOVPLKG | | 0.1 | 1 | µA | VOVP =16 V, EN = VEN(L) | 6 |
| Switch On-Resistance | RDS(ON) | | 220 | 350 | mΩ | ISW = 0.750 A, VIN = 16 V | 6 |
| Switch Leakage Current | ISWLKG | | 0.1 | 10 | µA | VSW = 16 V, EN = VEN(L), TA = TJ = -40°C to 85°C | 6 |
| Cycle-by-Cycle Switch Current Limit | ISW(LIM) | 3.6 | 4.2 | 4.8 | A | | 6 |
| Secondary Switch Current Limit | ISWLIM(sec) | 5.6 | 7 | | A | Higher than maximum ISW(LIM) at any condition (A8522 latches when detected) | 6 |
| Minimum Switch On-Time | tSWONTIME | | 85 | 120 | ns | RFSET = 10 kΩ | 6 |
| Minimum Switch Off-Time | tSWOFFTIME | | 55 | 85 | ns | RFSET = 10 kΩ | 6 |
| Boost Stage Switching Frequency | fSW | 1.8 | 2 | 2.2 | MHz | RFSET = 10 kΩ | 7 |
| Synchronized Boost Stage Switching Frequency | fSW_SYNC | 400 | | 2300 | kHz | | 7 |
| Synchronization Input Minimum Off-Time | tSYNCPWOFF | 150 | | | ns | | 7 |
| Synchronization Input Minimum On-Time | tSYNCPWON | 150 | | | ns | | 7 |
| Synchronization Input Logic, Low | VSYNCON(L) | | | 0.4 | V | | 7 |
| Synchronization Input Logic, High | VSYNCON(H) | 2 | | | V | | 7 |
| LEDx Accuracy (Average) | ErrLEDx | | 0.7 | 3 | % | Measured at ILEDMAX (maximum LED current) | 7 |
| LEDx Matching | ΔILEDx | | 0.8 | 3 | % | Compared to average ILEDx, measured at ILEDMAX | 7 |
| LEDx Regulation Voltage | VREG | | 0.85 | 1 | V | ISET register= xx11 1111 | 7 |
| ILEDx Step Size | ISETSTEP | 0.9 | 1 | 1.1 | mA | Total 64 steps | 7 |
| Maximum LEDx Current (Average) | ILEDMAX | 62 | 64 | 66 | mA | ISET register = xx11 1111 | 7 |
| Interrupt Pin Pull-Down Voltage | | | | 0.4 | V | Fault/Interrupt condition asserted, pull-up current = 0.5 mA | 7 |
| Interrupt Pin Leakage Current | | | | 1 | µA | Fault/Interrupt condition cleared, pull-up to 3.6 V | 7 |
| Master Clock Period | TCLK | 120 | 150 | 180 | ns | | 7 |
| Master Clock Temperature Deviation | DTCLK | -2.5 | | 2.5 | % | TCLK change over temperature range | 7 |
| GATE Voltage at On | VGSON | 5 | | 8 | V | Gate-to-source voltage when gate is on, measured as VIN, VGATE | 8 |
| GATE Pin Leakage Current | IGLKG | | | 1 | µA | EN = VEN(L), VGATE = VIN | 8 |
| INS Trip Point | VINSTRIP | 90 | 105 | 120 | mV | Measured between VIN and INS | 8 |
| Thermal Shutdown Threshold | TSD | 155 | 170 | | °C | Temperature rising | 8 |
| Logic Input (SDA, SCL), Low | VSCL(L) | | | 0.8 | V | | 8 |
| Logic Input (SDA, SCL), High | VSCL(H) | 2.3 | | | V | | 8 |
| Logic Input Current | II2CI | -1 | | 1 | µA | | 8 |
| Output Voltage SDA | VI2COut(L) | | | 0.4 | V | SDA = low, pull-up current = 2.5 mA | 8 |
| Output Leakage SDA | II2CLKG | | | 1 | µA | EN = low, pull-up to 5.5 V | 8 |
| SCL Clock Frequency | fCLK | | | 400 | kHz | | 8 |
| Voltage Level for Address 100,0000 | VADDLEVEL1 | 0 | | 0.5 | V | ADDR connected to GND | 8 |
| Voltage Level for Address 101,0000 | VADDLEVEL2 | 0.9 | | 1.3 | V | RADDR = 110 kΩ from ADDR to GND | 8 |
| Voltage Level for Address 110,0000 | VADDLEVEL3 | 1.75 | | 2.45 | V | RADDR = 210 kΩ from ADDR to GND | 8 |
| Voltage Level for Address 111,0000 | VADDLEVEL4 | 3.2 | | 3.6 | V | ADDR connected to VDD pin or open | 8 |
| ADDR Pull-Up Current | IADDR | -8.5 | -10 | -11.5 | µA | VADDR = 1 V | 8 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | | tin | A8522KLPTR-T -40 to 125 28-pin TSSOP with exposed thermal pad 4000 pieces per 13-in. reel 100% matte tin | 2 |
## CAD (KiCad official)
- Symbol: `A8522KLPTR-T`
- Footprint: `Package_SO:TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x6.7mm`
- 3D model: TSSOP-28-EP (KiCad packages3D, STEP)
- 3D model files: `a8522klptr-t-etched.step` / `a8522klptr-t-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `a8522klptr-t.step` / `a8522klptr-t.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Allegro MicroSystems, LLC datasheet](docs/a8522klptr-t-datasheet.pdf) (65 pp, sha256 `d6a7732d3abb26ac`, retrieved 2026-11-05, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/a8522klptr-t-datasheet.pdf)