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A80601KESJSR-1

Allegro MicroSystems, LLC · LED Drivers · QFN-24-EP(4x4)

A80601KESJSR-1 from Allegro MicroSystems, LLC, in a QFN-24-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 FAULT output Open-drain output pulled low when a fault occurs, requiring a pull-up resistor to the desired logic-level voltage.
2 VDD power_out Output of the internal LDO bias regulator, regulated at about 4.25 V, with a 1 µF decoupling capacitor to AGND.
3 AGND power_in LED current ground that also serves as the quiet ground for analog signals.
4 COMP passive Output of the error amplifier and compensation node, with a series RZ-CZ network from this pin to AGND for loop compensation.
5 ISET passive Resistor RISET connected between this pin and AGND sets the 100% LED current.
6 PEB passive Pre-Emptive Boost control, where a resistor to AGND fine-tunes the delay between boost switch and LED sinks, and leaving the pin open gives a minimum delay of 1 µs.
7 DITH passive Dithering control, where a capacitor to AGND sets the modulation frequency (1 to 22 kHz) and a resistor to FSET sets the range (such as ±5% of fSW).
8 FSET input Frequency and synchronization pin, where RFSET to AGND sets fSW from 200 kHz to 2.3 MHz, or an external clock from 260 kHz to 2.3 MHz synchronizes it with dithering disabled.
9 ADIM input Analog dimming input accepting a 40 to 1000 kHz PWM clock or a DC level of 0.2 to 2 V for 10% to 100% current, and pulled above 2 V for 100% if unused.
10 PWM input Controls the on/off state of the LED current sinks for PWM dimming, typically at 200 Hz to 2 kHz, and may be tied to EN for single-wire dimming.
11 EN input Enables the IC when pulled high; when taken low the IC stays in standby for up to 16 ms before full shutdown.
12 CLKOUT output Logic output representing the boost oscillator switching frequency, active as long as the IC is enabled, for synchronizing other converters.
13 LED4 passive LED current sink #4, where the cathode of the LED string connects and an unused pin must be terminated to AGND through 2.37 kΩ.
14 LED3 passive LED current sink #3, where the cathode of the LED string connects and an unused pin must be terminated to AGND through 2.37 kΩ.
15 LED2 passive LED current sink #2, where the cathode of the LED string connects and an unused pin must be terminated to AGND through 2.37 kΩ.
16 LED1 passive LED current sink #1, where the cathode of the LED string connects and an unused pin must be terminated to AGND through 2.37 kΩ.
17 OVP input Overvoltage protection input, where an external resistor from VOUT sets the overvoltage protection threshold.
18 PGND power_in Power ground for the internal gate driver, to be connected to external power GND by the shortest path.
19 VDRV power_out Gate driver supply of about 6.5 V, which requires a 2.2 µF MLCC to PGND for buffering.
20 CS input Current sense for peak current control of the power switch, connected to the sense resistor at the source of the external power MOSFET.
21 GDRV output Gate driver for the external power switch, connected to the MOSFET gate, which must be fully enhanced at VGS = 5 V.
22 GATE output Gate driver output for the external P-channel MOSFET used as the input disconnect switch.
23 VSENSE input Negative sense side of the input current sense resistor RSC, with the trip threshold measured as VIN minus VSENSE and a fixed iADJ current sink for adjustment.
24 VIN power_in Input power to the IC and the positive side of the input current sense resistor, with an operating input range of 4.5 to 40 V.
25 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Allegro MicroSystems, LLC
Package QFN-24-EP(4x4)
Category Display Modules / LED Drivers / Display Drivers
Pins 25

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
LEDx Pin Voltage VLEDx -0.3 40 V x = 1..4 2
OVP Pin Voltage VOVP -0.3 40 V 2
Input Voltage VIN -0.3 40 V 2
Gate Driver Supply Voltage VDRV, VGDRV -1 7.5 V VDRV, GDRV pins 2
Current Sense Pin Voltage VCS -0.3 7 V 2
Logic and Control Input Voltage -0.3 5.5 V EN, PWM, FAULT, ADIM, CLKOUT, COMP, DITH, PEB, FSET, ISET, VDD; external input signals must not be higher than VIN + 0.4 V 2
Operating Ambient Temperature TA -40 125 °C Range K 2
Maximum Junction Temperature TJ(max) 150 °C 2
Storage Temperature Tstg -55 150 °C 2
Operating Input Voltage Range VIN 4.5 40 V 6
VIN UVLO Start Threshold VUVLO(rise) 4.45 V VIN rising 6
VIN UVLO Stop Threshold VUVLO(fall) 4.05 V VIN falling 6
UVLO Hysteresis VUVLO_HYS 300 400 500 mV 6
VIN Pin Operating Current IOP 22 32 mA EN and PWM = H, CGATE = 1 nF from GDRV to PGND, fSW = 2 MHz 6
VIN Pin Quiescent Current IQ 4 6 mA EN = H and PWM = L, fCLKOUT = 2 MHz 6
VIN Pin Sleep Current ISLEEP 1 5 µA VIN = 16 V, VEN / VPWM = VSYNC = 0 V 6
Input Logic Level-Low VIL 0.4 V 6
Input Logic Level-High VIH 1.5 V 6
Input Pull-Down Resistor (EN, PWM) REN, RPWM 60 100 140 kΩ Input = 5 V 6
Input Pull-Down Resistor (ADIM) RADIM 30 50 70 kΩ Input = 5 V 6
Output Logic Level-Low VOL 0.3 V 5 V < VIN < 40 V, iLOAD = 1 mA 6
Output Logic Level-High VOH 1.8 V 5 V < VIN < 40 V, iLOAD = 1 mA 6
CLKOUT Duty Cycle DCLKOUT 33 50 67 % fSW = 2 MHz, no external sync 6
Analog Dimming Current Level (0.5 V on ADIM) iADIM25 23 25 27 % DC 0.5 V applied to ADIM pin 6
APWM Frequency Range fAPWM 40 1000 kHz Clock signal applied to ADIM pin 6
APWM Duty Cycle Range DAPWM 0 90 % Clock signal applied to ADIM pin 6
VDD Regulator Output Voltage VDD 4.05 4.25 4.45 V VIN > 6 V, iLOAD < 1 mA 6
OVP Pin Voltage Threshold VOVP(th) 2.2 2.5 2.8 V OVP pin connected to VOUT 7
OVP Pin Sense Current Threshold iOVP(th) 140 146.5 153 µA Current into OVP pin at 125ºC 7
OVP Pin Sense Current Threshold (over temperature) iOVP(th) 140 150 160 µA Measured over temperature 7
OVP Variation at Output (first limit) ΔOVP 4 % Measured at VOUT when ROVP = 188 kΩ 7
OVP Variation at Output (second limit) ΔOVP 7 % 7
Undervoltage Detection Threshold VUVP(th) 2.4 2.55 2.7 V Measured at VOUT when ROVP = 188 kΩ 7
Undervoltage Detection Threshold (ROVP = 0 Ω) VUVP(th) 0.13 0.2 0.25 V Measured at VOUT when ROVP = 0 Ω 7
Gate Driver Minimum On-Time tSW(ON) 100 ns 7
Gate Driver Minimum Off-Time tSW(OFF) 100 ns 7
Primary Current Sense Limit iCS(LIM1) 175 210 245 mV Exceeding iCS(LIM1) causes gate driver to truncate existing cycle, but does not shut down 7
Oscillator Frequency fSW 1.95 2.15 2.35 MHz RFSET = 10 kΩ 7
Sync Input Logic Low VSYNCL 0.4 V FSET/SYNC pin logic Low 7
Sync Input Logic High VSYNCH 1.5 V FSET/SYNC pin logic High 7
Synchronized PWM Frequency fSWSYNC 260 2300 kHz 7
Synchronization Input Min Off-Time tPWSYNCOFF 150 ns 7
Synchronization Input Min On-Time tPWSYNCON 150 ns 7
LEDx Accuracy ErrLED 0.7 3 % ISET = 120 µA (RISET = 8.33 kΩ) 8
LEDx Matching ΔLEDx 0.8 2 % ISET = 120 µA 8
LEDx Regulation Voltage (A80601-1) VLED 760 860 960 mV A80601-1 row; measured individually with all other LED pins tied to ≥1 V, ISET = 120 µA, VADIM > 2.1 V 8
IISET to ILEDx Current Gain AISET 1432 1466 1500 A/A ISET = 120 µA 8
ISET Pin Voltage VISET 0.955 0.985 1.015 V VADIM > 2.1 V 8
Allowable ISET Current iISET 20 144 µA VADIM > 2.1 V 8
LED String Partial-Short Detect VLEDSD 4.9 5.5 6.1 V Sensed from each LED pin to GND while its current sink is in regulation; all other LED pins tied to 1 V 8
Soft-Start Ramp-Up Time tSSRU 6.6 8.2 9.8 ms Maximum time duration before all LED channels come into regulation, or OVP is tripped, whichever comes first 8
Enable Pin Shut Down Delay tEN(OFF) 10 16 22 ms EN goes from High to Low; exceeding tEN(OFF) results in IC shutdown 8
Minimum PWM On-Time tPWMH 0.3 0.4 µs First and subsequent PWM pulses 8
VSENSE Pin Sink Current iADJ 16 20 24 µA 8
VSENSE Trip Point VSENSETRIP 88 98 108 mV Measured between VIN and VSENSE, RADJ = 0 Ω 8
FAULT Output Pull-Down Voltage VFAULT 0.5 V FAULT = 1 mA 8
External FAULT Input High VFIH 1.5 V No internal faults 8
Gate Shutdown Delay When Overcurrent Fault Is Tripped tGATEFAULT 3 µs VIN, VSENSE = 200 mV; monitored at FAULT pin 8
Thermal Shutdown Threshold TSD 155 170 °C Temperature rising 8
Package Thermal Resistance (junction to ambient) RθJA 37 °C/W ES package measured on 4-layer PCB based on JEDEC standard 2

CAD (KiCad official)

  • Symbol: A80601KESJSR-1
  • Footprint: Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm
  • 3D model: QFN-24-EP(4x4) (KiCad packages3D, STEP)
  • 3D model files: a80601kesjsr-1-etched.step / a80601kesjsr-1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); a80601kesjsr-1.step / a80601kesjsr-1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Allegro MicroSystems, LLC datasheet (41 pp, sha256 7385a7f901821bc9, retrieved 2026-10-31, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF