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A4984SETTR-T
Public Made by Adomby adom
Allegro MicroSystems, LLC Gate Drive ICs, QFN-32(5x5). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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Datasheet
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Contents
README
markdownA4984SETTR-T
Allegro MicroSystems, LLC · Gate Drive ICs · QFN-32(5x5)
A4984SETTR-T from Allegro MicroSystems, LLC, in a QFN-32(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT2B | output | DMOS full bridge 2 output B; motor output voltage is rated -2.0 to 37 V with output current up to ±2 A. |
| 2 | NC | unconnected | No connection; in the ET package this pin separates critical output, sense and supply pins so that a pin-to-adjacent-pin short does not cause smoke or fire. |
| 3 | VBB2 | power_in | Load supply for full bridge 2; operating range is 8-35 V and 0-35 V during Sleep mode. |
| 4 | NC | unconnected | No connection; no-connect pin placed between critical output, sense and supply pins for no-smoke-no-fire compliance. |
| 5 | ENABLE | input | Active-low logic input that enables the FET outputs when low and disables them when high, while the translator inputs remain active; input high threshold is VDD × 0.7 minimum and low threshold is VDD × 0.3 maximum. |
| 6 | GND | power_in | Ground pin; the GND pins must be tied together externally to the PAD ground plane under the device. |
| 7 | CP1 | passive | Charge pump capacitor terminal; a 0.1 µF ceramic capacitor is connected between CP1 and CP2. |
| 8 | CP2 | passive | Charge pump capacitor terminal; a 0.1 µF ceramic capacitor is connected between CP1 and CP2. |
| 9 | VCP | passive | Charge pump reservoir capacitor terminal; a 0.1 µF ceramic capacitor is required between VCP and VBB, and an undervoltage on VCP disables the FET outputs. |
| 10 | VREG | power_out | Internally generated regulator output with nominal 7 V, which must be decoupled with a 0.22 µF ceramic capacitor to ground. |
| 11 | MS1 | input | Microstep select logic input with a 100 kΩ internal pull-down that sets the step resolution together with MS2. |
| 12 | MS2 | input | Microstep select logic input with a 50 kΩ internal pull-down that sets the step resolution together with MS1. |
| 13 | RESET | input | Active-low logic input that sets the translator to the Home state and turns off all FET outputs; STEP inputs are ignored until RESET is set high. |
| 14 | ROSC | input | Timing set pin; tied to VDD or directly to GND sets a 30 µs off-time, while a resistor to ground sets tOFF ≈ ROSC/825 µs (tOFF in µs). |
| 15 | SLEEP | input | Active-low logic input; a logic low puts the device into Sleep mode (below 10 µA), and a 1 ms delay is required after leaving Sleep before issuing a STEP command. |
| 16 | VDD | power_in | Logic supply with an operating range of 3.0-5.5 V. |
| 17 | STEP | input | Step logic input; each low-to-high transition advances the motor one microstep, with minimum HIGH and LOW pulse widths of 1 µs. |
| 18 | REF | input | Gm reference voltage input with an operating range of 0-4 V (absolute maximum 5.5 V), which sets the current trip level through ITripMAX = VREF/(8×RS). |
| 19 | GND | power_in | Ground pin; the GND pins must be tied together externally to the PAD ground plane under the device. |
| 20 | DIR | input | Direction logic input; changes to this input do not take effect until the next STEP rising edge. |
| 21 | NC | unconnected | No connection; no-connect pin placed between critical output, sense and supply pins for no-smoke-no-fire compliance. |
| 22 | VBB1 | power_in | Load supply for full bridge 1; operating range is 8-35 V and 0-35 V during Sleep mode. |
| 23 | NC | unconnected | No connection; no-connect pin placed between critical output, sense and supply pins for no-smoke-no-fire compliance. |
| 24 | OUT1B | output | DMOS full bridge 1 output B; motor output voltage is rated -2.0 to 37 V with output current up to ±2 A. |
| 25 | SENSE1 | passive | Sense resistor terminal for bridge 1; the SENSE1 voltage must not exceed the -0.5 V to 0.5 V absolute maximum rating. |
| 26 | NC | unconnected | No connection; no-connect pin placed between critical output, sense and supply pins for no-smoke-no-fire compliance. |
| 27 | OUT1A | output | DMOS full bridge 1 output A; motor output voltage is rated -2.0 to 37 V with output current up to ±2 A. |
| 28 | NC | unconnected | No connection; no-connect pin placed between critical output, sense and supply pins for no-smoke-no-fire compliance. |
| 29 | NC | unconnected | No connection; no-connect pin placed between critical output, sense and supply pins for no-smoke-no-fire compliance. |
| 30 | OUT2A | output | DMOS full bridge 2 output A; motor output voltage is rated -2.0 to 37 V with output current up to ±2 A. |
| 31 | NC | unconnected | No connection; no-connect pin placed between critical output, sense and supply pins for no-smoke-no-fire compliance. |
| 32 | SENSE2 | passive | Sense resistor terminal for bridge 2; the SENSE2 voltage must not exceed the -0.5 V to 0.5 V absolute maximum rating. |
| 33 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Allegro MicroSystems, LLC |
| Package | QFN-32(5x5) |
| Category | Power Management |
| Pins | 33 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Load Supply Voltage Range (Operating) | VBB | 8 | 35 | V | Operating | 4 | |
| Load Supply Voltage Range (During Sleep Mode) | VBB | 0 | 35 | V | During Sleep Mode | 4 | |
| Logic Supply Voltage Range | VDD | 3 | 5.5 | V | Operating | 4 | |
| Output On Resistance (Source Driver) | RDSON | 320 | 430 | mΩ | Source Driver, IOUT = -1.5 A | 4 | |
| Output On Resistance (Sink Driver) | RDSON | 320 | 430 | mΩ | Sink Driver, IOUT = 1.5 A | 4 | |
| Body Diode Forward Voltage (Source Diode) | VF | 1.3 | V | Source Diode, IF = -1.5 A | 4 | ||
| Body Diode Forward Voltage (Sink Diode) | VF | 1.3 | V | Sink Diode, IF = 1.5 A | 4 | ||
| Motor Supply Current | IBB | 4 | mA | fPWM < 50 kHz | 4 | ||
| Motor Supply Current (Operating, outputs disabled) | IBB | 2 | mA | Operating, outputs disabled | 4 | ||
| Motor Supply Current (Sleep Mode) | IBB | 10 | μA | Sleep Mode | 4 | ||
| Logic Supply Current | IDD | 8 | mA | fPWM < 50 kHz | 4 | ||
| Logic Supply Current (Outputs off) | IDD | 5 | mA | Outputs off | 4 | ||
| Logic Supply Current (Sleep Mode) | IDD | 10 | μA | Sleep Mode | 4 | ||
| Logic Input Current (high) | IIN(1) | -20 | 20 | µA | VIN = VDD × 0.7 | 4 | |
| Logic Input Current (low) | IIN(0) | -20 | 20 | µA | VIN = VDD × 0.3 | 4 | |
| Logic Input Hysteresis | VHYS(IN) | 5 | 11 | 19 | % | As a % of VDD | 4 |
| Blank Time | tBLANK | 0.7 | 1 | 1.3 | μs | 4 | |
| Fixed Off-Time | tOFF | 20 | 30 | 40 | μs | OSC = VDD or GND | 4 |
| Fixed Off-Time | tOFF | 23 | 30 | 37 | μs | ROSC = 25 kΩ | 4 |
| Reference Input Voltage Range | VREF | 0 | 4 | V | 4 | ||
| Reference Input Current | IREF | -3 | 0 | 3 | µA | 4 | |
| Current Trip-Level Error | errI | -15 | 15 | % | VREF = 2 V, %ITripMAX = 38.27% | 4 | |
| Current Trip-Level Error | errI | -5 | 5 | % | VREF = 2 V, %ITripMAX = 70.71% | 4 | |
| Crossover Dead Time | tDT | 100 | 475 | 800 | ns | 4 | |
| Overcurrent Protection Threshold | IOCPST | 2.1 | A | 4 | |||
| VDD Undervoltage Lockout | VDDUVLO | 2.7 | 2.8 | 2.9 | V | VDD rising | 4 |
| Load Supply Voltage | VBB | 35 | V | 2 | |||
| Output Current | IOUT | -2 | 2 | A | 2 | ||
| Logic Input Voltage | VIN | -0.3 | 5.5 | V | 2 | ||
| Logic Supply Voltage | VDD | -0.3 | 5.5 | V | 2 | ||
| Motor Outputs Voltage | -2 | 37 | V | 2 | |||
| Sense Voltage | VSENSE | -0.5 | 0.5 | V | 2 | ||
| Reference Voltage | VREF | 5.5 | V | 2 | |||
| Operating Ambient Temperature (Range S) | TA | -20 | 85 | °C | 2 | ||
| Maximum Junction Temperature | TJ(max) | 150 | °C | 2 | |||
| Storage Temperature | Tstg | -55 | 150 | °C | 2 | ||
| Package Thermal Resistance (ET, 32-pin QFN) | RθJA | 32 | °C/W | ET package; estimated, on 4-layer PCB, based on JEDEC standard; still air | 5 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | for enhanced thermal dissipation and are lead (Pb) free (suffix -T), with 100% matte tin plated leadframes. | 2 |
CAD (KiCad official)
- Symbol:
A4984SETTR-T - Footprint:
Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm - 3D model: QFN-32(5x5) (KiCad packages3D, STEP)
- 3D model files:
a4984settr-t-etched.step/a4984settr-t-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);a4984settr-t.step/a4984settr-t.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Allegro MicroSystems, LLC datasheet (22 pp, sha256
62200312e9097918, retrieved 2026-10-28, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).