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Contents

README

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A4953ELJTR-T

Allegro MicroSystems, LLC · Motor Driver ICs · SOIC-8-EP

A4953ELJTR-T from Allegro MicroSystems, LLC, in a SOIC-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground; a star ground should be located as close to the device as possible.
2 IN2 input Logic input 2 for bridge control (VIN(1) min 2.0 V, VIN(0) max 0.8 V, 50 kΩ typ internal pull-down); both inputs low for over 1 ms enters Low Power Standby mode.
3 IN1 input Logic input 1 for bridge control (VIN(1) min 2.0 V, VIN(0) max 0.8 V, 50 kΩ typ internal pull-down); both inputs low for over 1 ms enters Low Power Standby mode.
4 VREF power_in Analog input setting the PWM current limit, 0 to 5 V input range (ITripMAX = VREF / (AV × RS)).
5 VBB power_in Load supply voltage, 8 to 40 V operating range; decouple with a 100 µF electrolytic in parallel with a lower-value ceramic capacitor.
6 OUT1 output DMOS full bridge output 1, with up to 2 A continuous output current.
7 LSS passive Power return, connection for the current sense resistor to ground; limit the sense voltage to ±500 mV.
8 OUT2 output DMOS full bridge output 2, with up to 2 A continuous output current.
9 PAD passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Allegro MicroSystems, LLC
Package SOIC-8-EP
Category Power Management ICs
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Load Supply Voltage Range VBB 8 40 V 3
Sink+Source Total RDS(on) RDS(on) 0.8 1 Ω IOUT = /1.5 A/, TJ = 25°C 3
Sink+Source Total RDS(on) RDS(on) 1.3 1.6 Ω IOUT = /1.5 A/, TJ = 125°C 3
Load Supply Current IBB 10 mA fPWM < 30 kHz 3
Load Supply Current standby IBB 10 µA Low Power Standby mode 3
Body Diode Forward Voltage (source) Vf 1.5 V Source diode, If = -1.5 A 3
Body Diode Forward Voltage (sink) Vf 1.5 V Sink diode, If = 1.5 A 3
Logic Input High Voltage VIN(1) 2 V INx pins 3
Logic Input Low Voltage VIN(0) 0.8 V INx pins 3
Standby Input Voltage VIN(STANDBY) 0.4 V INx pins, Low Power Standby mode 3
Logic Input Current high IIN(1) 40 100 µA INx pins, VIN = 2.0 V 3
Logic Input Current low IIN(0) 16 40 µA INx pins, VIN = 0.8 V 3
Input Hysteresis VHYS 250 550 mV 3
Logic Input Pull-Down Resistance RLOGIC(PD) 50 kΩ VIN = 0 V = IN1 = IN2 3
Crossover Delay tCOD 50 400 500 ns 3
VREF Input Voltage Range VREF 0 5 V 3
Current Gain AV 9.5 10.5 V/V VREF / ISS, VREF = 5 V 3
Current Gain AV 9 10 V/V VREF / ISS, VREF = 2.5 V 3
Current Gain AV 8 10 V/V VREF / ISS, VREF = 1 V 3
Blank Time tBLANK 2 3 4 µs 3
Constant Off-time toff 16 25 34 µs 3
Standby Timer tst 1 1.5 ms IN1 = IN2 < VIN(STANDBY) 3
Power-Up Delay tpu 30 µs 3
UVLO Enable Threshold VBBUVLO 7 7.5 7.95 V VBB increasing 3
UVLO Hysteresis VBBUVLOhys 500 mV 3
Thermal Shutdown Temperature TJTSD 160 °C Temperature increasing 3
Thermal Shutdown Hysteresis TTSDhys 20 °C Recovery = TJTSD, TTSDhys 3
Overcurrent Protection Limit IOCP 2.5 6.5 A 3
Overcurrent Protection Pulse Width tOCP 1 4 µs 3
Load Supply Voltage VBB 40 V 2
Logic I/O Voltage Range VIN -0.3 6 V 2
VREF Input Voltage Range VREF -0.3 6 V 2
Sense Voltage (LSS pin) VS -0.5 0.5 V 2
Motor Outputs Voltage VOUT -2 42 V 2
Output Current IOUT 2 A Duty cycle = 100% 2
Transient Output Current iOUT 6 A TW < 500 ns 2
Operating Temperature Range TA -40 85 °C Temperature Range E 2
Maximum Junction Temperature TJ(max) 150 °C 2
Storage Temperature Range Tstg -55 150 °C 2
FLTn Sink Current IFLTN 10 mA 2
Package Thermal Resistance RθJA 35 ºC/W LJ package, on 4-layer PCB based on JEDEC standard 2
Package Thermal Resistance RθJA 62 ºC/W LJ package, on 2-layer PCB with 0.8 in2. 2-oz. copper each side 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin 8-pin SOICN package (suffix LJ). Both packages have an exposed thermal pad, and are lead (Pb) free, with 100% matte tin 1

CAD (KiCad official)

  • Symbol: A4953ELJTR-T
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
  • 3D model: SOIC-8-EP (KiCad packages3D, STEP)
  • 3D model files: a4953eljtr-t-etched.step / a4953eljtr-t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); a4953eljtr-t.step / a4953eljtr-t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Allegro MicroSystems, LLC datasheet (11 pp, sha256 9b8c176dcbf20a12, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF