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A3214LLHLT-T

Allegro MicroSystems LLC · Linear Hall Sensors · SOT-23W

A3214LLHLT-T from Allegro MicroSystems LLC, in a SOT-23W. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD power_in Input power supply; tie to GND with a bypass capacitor, with operating supply voltage range 2.4 V to 5.5 V and absolute maximum supply voltage of 6 V.
2 VOUT output Output signal; the output switches low (turns on) when the magnetic flux exceeds the operate point and can sink up to 1 mA, with absolute maximum output off voltage of 6 V.
3 GND power_in Ground reference for the device; a bypass capacitor should be connected between supply and ground close to the Hall element.

Key specifications

Parameter Value
Manufacturer Allegro MicroSystems LLC
Package SOT-23W
Category Magnetic Sensors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage Range VDD 2.4 3 5.5 V Operating [2] 4
Output Leakage Current IOFF 1 µA VOUT = 5.5 V, BRPN < B < BRPS 4
Output On Voltage VOUT(ON) 100 300 mV Output on, IOUT = 1 mA, VDD = 3.0 V 4
Awake Time tawake 60 90 µs 4
Period (A3214) tperiod 60 90 ms TA = 25°C, VDD = 3 V 4
Supply Current, chip awake (enabled) IDD(EN) 2 mA Chip awake (enabled) 4
Supply Current, chip asleep (disabled) IDD(DIS) 8 µA Chip asleep (disabled) 4
Average Supply Current (A3214) IDD(AVG) 6 22 µA A3214 4
Supply Voltage VDD 6 V 2
Output Off Voltage VOUT 6 V 2
Output Current IOUT 1 mA 2
Operating Ambient Temperature Range L TA -40 150 °C Range L 2
Maximum Junction Temperature TJ(max) 165 °C 2
Storage Temperature Tstg -65 170 °C 2
Package Thermal Resistance, LH 1-layer PCB RθJA 228 °C/W Package LH, 1-layer PCB with copper limited to solder pads 5
Package Thermal Resistance, LH 2-layer PCB RθJA 110 °C/W Package LH, 2-layer PCB with 0.463 in.2 of copper area each side connected by thermal vias 5

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin miniature low-profile surface-mount package, ‘UA’ is a three￾lead SIP for through-hole mounting. Each package is lead (Pb) free (suffix, -T) , with a 100% matte-tin-plated leadframe. 2

CAD (KiCad official)

  • Symbol: A3214LLHLT-T
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23W (KiCad packages3D, STEP)
  • 3D model files: a3214llhlt-t-etched.step / a3214llhlt-t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); a3214llhlt-t.step / a3214llhlt-t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Allegro MicroSystems LLC datasheet (12 pp, sha256 ecfb8b30803c8732, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF