component
A31315LLUBTR-XZ-S-SE-10
Public Made by Adomby adom
Allegro MicroSystems, LLC Position Sensor, TSSOP-14. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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Symbol & Footprint
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PCB Footprint
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Datasheet
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README
markdownA31315LLUBTR-XZ-S-SE-10
Allegro MicroSystems, LLC · Position Sensor · TSSOP-14
A31315LLUBTR-XZ-S-SE-10 from Allegro MicroSystems, LLC, in a TSSOP-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | Not connected (die 1); connect to GND for optimal ESD performance. |
| 2 | NC | unconnected | Not connected (die 1); connect to GND for optimal ESD performance. |
| 3 | VCC_1 | power_in | Supply voltage for die 1, 4.5 to 5.5 V operating range. |
| 4 | NC | unconnected | Not connected (die 1); connect to GND for optimal ESD performance. |
| 5 | GND_1 | power_in | Ground for die 1. |
| 6 | OUT_1 | output | Device output of die 1 (ratiometric analog, PWM, or SENT). |
| 7 | NC | unconnected | Not connected (die 1); connect to GND for optimal ESD performance. |
| 8 | NC | unconnected | Not connected (die 2); connect to GND for optimal ESD performance. |
| 9 | VCC_2 | power_in | Supply voltage for die 2, 4.5 to 5.5 V operating range. |
| 10 | NC | unconnected | Not connected (die 2); connect to GND for optimal ESD performance. |
| 11 | GND_2 | power_in | Ground for die 2. |
| 12 | NC | unconnected | Not connected (die 2); connect to GND for optimal ESD performance. |
| 13 | OUT_2 | output | Device output of die 2 (ratiometric analog, PWM, or SENT). |
| 14 | NC | unconnected | Not connected (die 2); connect to GND for optimal ESD performance. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Allegro MicroSystems, LLC |
| Package | TSSOP-14 |
| Category | Sensors |
| Pins | 14 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage | VCC | 4.5 | 5 | 5.5 | V | 8 | |
| Supply Buffer Capacitor | CSUP | 10 | 100 | 600 | nF | 8 | |
| Supply Current | ICC | 5 | 8.5 | 10 | mA | Each die | 8 |
| Ambient Operating Temperature | TA | -40 | 150 | °C | 8 | ||
| Number of EEPROM Writes | NEEPROM | 100 | writes | TA = 25°C | 8 | ||
| Magnetic Flux Density | /BIN/ | 300 | 1000 | G | For xxx-10 parts, devices tested at /BIN/ = 300 G | 8 | |
| Forward Supply Voltage | VCC(absmax) | 18 | V | Supply is clamped with 20 V limit to GND | 4 | ||
| Reverse Supply Voltage | VRCC(absmax) | -18 | V | Supply is clamped with -20 V limit to GND | 4 | ||
| Forward VOUT-VCC Voltage | VOUT-CC(absmax) | 18 | V | VOUT is clamped with 20 V limit to VCC | 4 | ||
| Forward Output Voltage | VOUT(absmax) | 18 | V | Output is clamped with 20 V limit to GND | 4 | ||
| Reverse Output Voltage | VROUT(absmax) | -6 | V | Output is clamped with -10 V limit to GND | 4 | ||
| Forward Supply Current | ICC | 30 | mA | 4 | |||
| Reverse Supply Current | IRCC | -30 | mA | 4 | |||
| Output Current Limit (source) | IOUT(SOURCE) | 30 | mA | VOUT shorted to GND | 4 | ||
| Output Current Limit (sink) | IOUT(SINK) | -30 | mA | VCC shorted to VOUT | 4 | ||
| Extended Operating Ambient Temperature | TA(EXT) | -45 | 165 | °C | Device will work within this temperature range, but performance is not specified | 4 | |
| Maximum Junction Temperature | TJ(MAX) | 165 | °C | 4 | |||
| Storage Temperature | Tstg | -65 | 165 | °C | 4 | ||
| Package Thermal Resistance TSSOP-14 | RϴJA | 214 | °C/W | TSSOP-14 | 4 | ||
| UVD Threshold (low, falling) | VUVD(LOW, FALL) | 3.6 | 4.1 | V | VCC falling, uvd_sel = '0' | 9 | |
| UVD Threshold (low, rising) | VUVD(LOW, RISE) | 3.7 | 4.2 | V | VCC rising, uvd_sel = '0' | 9 | |
| UVD Threshold (high, falling) | VUVD(HIGH, FALL) | 4.1 | 4.4 | V | VCC falling, uvd_sel = '1' | 9 | |
| UVD Threshold (high, rising) | VUVD(HIGH, RISE) | 4.2 | 4.5 | V | VCC rising, uvd_sel = '1' | 9 | |
| OVD Threshold (low, falling) | VOVD(LOW, FALL) | 5.6 | 6 | V | VCC falling, ovd_sel = '1' | 9 | |
| OVD Threshold (low, rising) | VOVD(LOW, RISE) | 5.65 | 6.05 | V | VCC rising, ovd_sel = '1' | 9 | |
| OVD Threshold (high, falling) | VOVD(HIGH, FALL) | 8.4 | 10.2 | V | VCC falling, ovd_sel = '0' | 9 | |
| OVD Threshold (high, rising) | VOVD(HIGH, RISE) | 8.6 | 10.4 | V | VCC rising, ovd_sel = '0' | 9 | |
| Power-On Reset Voltage (fall) | VPOR(FALL) | 2.6 | 2.9 | V | VCC falling | 9 | |
| Power-On Reset Voltage (rise) | VPOR(RISE) | 2.8 | 3.1 | V | VCC rising | 9 | |
| Power-On Time | tPO | 1 | 1.7 | ms | Time from VCC > VCC(MIN) until unfiltered output is settled | 9 | |
| Oscillator Frequency | fOSC | 7.36 | 8 | 8.64 | MHz | 9 | |
| Angle Error (XZ) | ERRANG(XZ) | -1 | 1 | degrees | TA = 25°C | 9 | |
| Angle Error (XZ) | ERRANG(XZ) | -1.2 | 1.2 | degrees | -40 ≤ TA ≤ 150°C | 9 | |
| Angle Drift over temperature (XZ) | DRIFTAng,Temp(XZ) | -1.2 | 1.2 | degrees | Change in angle relative to TA = 25°C | 9 | |
| Angle Drift over life (XZ) | DRIFTAng,Life(XZ) | -1.33 | 0.91 | 1.33 | degrees | Change in angle relative to pre-stress conditions | 9 |
| Channel Sensitivity Error (X) | ERRSens(X,Y) | -1.5 | 1.5 | % | TA = 25°C | 10 | |
| Channel Sensitivity Error (X) | ERRSens(X,Y) | -3 | 3 | % | -40 ≤ TA ≤ 150°C | 10 | |
| Channel Sensitivity Error (Z) | ERRSens(Z) | -1.5 | 1.5 | % | TA = 25°C | 10 | |
| Channel Sensitivity Error (Z) | ERRSens(Z) | -4 | 4 | % | -40 ≤ TA ≤ 150°C | 10 | |
| Channel Offset Error (X) | ERROff(X,Y) | -1.5 | 1.5 | G | TA = 25°C | 10 | |
| Channel Offset Error (X) | ERROff(X,Y) | -4 | 4 | G | -40 ≤ TA ≤ 150°C | 10 | |
| Channel Offset Error (Z) | ERROff(Z) | -1.5 | 1.5 | G | TA = 25°C | 10 | |
| Channel Linearity Error (X) | ERRLin(X,Y) | -0.3 | 0.3 | % | 100 G ≤ BIN ≤ 1000 G | 10 | |
| Channel Linearity Error (Z) | ERRLin(Z) | -0.3 | 0.3 | % | 100 G ≤ BIN ≤ 1000 G | 10 | |
| Sensitivity Drift over temperature (X) | DRIFTSens,Temp(X,Y) | -2 | 2 | % | Change in sensitivity relative to TA = 25°C | 10 | |
| Sensitivity Drift over life (X) | DRIFTSens,Life(X,Y) | -2.5 | 1.3 | 2.5 | % | Change in sensitivity relative to pre-stress conditions | 10 |
| Sensitivity Drift over temperature (Z) | DRIFTSens,Temp(Z) | -3 | 3 | % | Change in sensitivity relative to TA = 25°C | 10 | |
| Sensitivity Drift over life (Z) | DRIFTSens,Life(Z) | -3.5 | 2.5 | 3.5 | % | Change in sensitivity relative to pre-stress conditions | 10 |
| Offset Drift over temperature (X) | DRIFTOff,Temp(X,Y) | -3.5 | 3.5 | G | Change in offset relative to TA = 25°C | 10 | |
| Offset Drift over life (X) | DRIFTOff,Life(X,Y) | -0.9 | 0.25 | 0.9 | G | Change in offset relative to pre-stress conditions | 10 |
| Offset Drift over temperature (Z) | DRIFTOff,Temp(Z) | -1.5 | 1.5 | G | Change in offset relative to TA = 25°C | 10 | |
| Offset Drift over life (Z) | DRIFTOff,Life(Z) | -0.6 | 0.5 | 0.6 | G | Change in offset relative to pre-stress conditions | 10 |
| Broken Wire Response Time | tBW | 500 | µs | Time after VCC, GND = 0.2 V, either VCC or GND wire broken, CL = 100 nF, CSUP = 100 nF | 11 | ||
| High-Z Leakage | Ileak(Hi-Z) | -10 | 10 | µA | Device in High-Z mode, output shorted to GND or VCC | 11 | |
| Filter Step Response Time | tRESP | 396 | 450 | µs | bw_sel = 5, time to 90% response to step | 11 | |
| Angle Update Rate | tUPDATE | 14.72 | 16 | 17.28 | µs | Valid for all bandwidth settings | 11 |
| SENT Tick Time | tTICK | 2.76 | 3 | 3.24 | µs | Valid for all SENT Modes, dig_out_data_rate = '0' | 11 |
| SENT Tick Time Tolerance | TOLTICK | -8 | 8 | % | Valid for all selectable tick times | 11 | |
| SENT Output Saturation Voltage | VSAT(LOW) | 0.55 | V | Output current = -4.7 mA, VCC = 5 V, output FET on | 11 | ||
| SENT Output Load Resistance | RL(PULLUP) | 1.2 | kΩ | Output Current ≥ -10 mA | 11 | ||
| SENT Output High Voltage | VOH | 4.1 | V | High state voltage with 0.1 mA DC load current | 11 | ||
| SENT Output Low Voltage | VOL | 0.5 | V | Low state voltage with 0.52 mA DC load current | 11 | ||
| SENT Output Load Capacitance | CL | 4.7 | 5.7 | nF | 11 |
CAD (KiCad official)
- Symbol:
A31315LLUBTR-XZ-S-SE-10 - Footprint:
Package_SO:TSSOP-14_4.4x5mm_P0.65mm - 3D model: TSSOP-14 (KiCad packages3D, STEP)
- 3D model files:
a31315llubtr-xz-s-se-10-etched.step/a31315llubtr-xz-s-se-10-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);a31315llubtr-xz-s-se-10.step/a31315llubtr-xz-s-se-10.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Allegro MicroSystems, LLC datasheet (70 pp, sha256
5e17bbddc669f0d8, retrieved 2026-10-31, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).