component
A31315LLUBTR-XZ-S-AR-10
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Allegro MicroSystems, LLC Position Sensor, TSSOP-14. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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A31315LLUBTR-XZ-S-AR-10
Allegro MicroSystems, LLC · Position Sensor · TSSOP-14
A31315LLUBTR-XZ-S-AR-10 from Allegro MicroSystems, LLC, in a TSSOP-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | Not connected in die 1; connect to GND for optimal ESD performance. |
| 2 | NC | unconnected | Not connected in die 1; connect to GND for optimal ESD performance. |
| 3 | VCC_1 | power_in | Supply voltage input for die 1 of the dual stacked die device. |
| 4 | NC | unconnected | Not connected in die 1; connect to GND for optimal ESD performance. |
| 5 | GND_1 | power_in | Ground reference for die 1. |
| 6 | OUT_1 | output | Device output of die 1, carrying the selected angle or single-axis field signal. |
| 7 | NC | unconnected | Not connected in die 1; connect to GND for optimal ESD performance. |
| 8 | NC | unconnected | Not connected in die 2; connect to GND for optimal ESD performance. |
| 9 | VCC_2 | power_in | Supply voltage input for die 2 of the dual stacked die device. |
| 10 | NC | unconnected | Not connected in die 2; connect to GND for optimal ESD performance. |
| 11 | GND_2 | power_in | Ground reference for die 2. |
| 12 | NC | unconnected | Not connected in die 2; connect to GND for optimal ESD performance. |
| 13 | OUT_2 | output | Device output of die 2, carrying the selected angle or single-axis field signal. |
| 14 | NC | unconnected | Not connected in die 2; connect to GND for optimal ESD performance. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Allegro MicroSystems, LLC |
| Package | TSSOP-14 |
| Category | Sensors |
| Pins | 14 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Forward Supply Voltage | VCC(absmax) | 18 | V | Supply is clamped with 20 V limit to GND | 4 | ||
| Reverse Supply Voltage | VRCC(absmax) | -18 | V | Supply is clamped with -20 V limit to GND | 4 | ||
| Forward VOUT-VCC Voltage | VOUT-CC(absmax) | 18 | V | VOUT is clamped with 20 V limit to VCC; no reverse VOUT-VCC clamp | 4 | ||
| Forward Output Voltage | VOUT(absmax) | 18 | V | Output is clamped with 20 V limit to GND | 4 | ||
| Reverse Output Voltage | VROUT(absmax) | -6 | V | Output is clamped with -10 V limit to GND | 4 | ||
| Forward Supply Current | ICC | 30 | mA | 4 | |||
| Reverse Supply Current | IRCC | -30 | mA | 4 | |||
| Output Current Limit (source) | IOUT(SOURCE) | 30 | mA | VOUT shorted to GND | 4 | ||
| Output Current Limit (sink) | IOUT(SINK) | -30 | mA | VCC shorted to VOUT | 4 | ||
| Extended Operating Ambient Temperature | TA(EXT) | -45 | 165 | °C | Device will work within this temperature range, but performance is not specified | 4 | |
| Maximum Junction Temperature | TJ(MAX) | 165 | °C | 4 | |||
| Storage Temperature | Tstg | -65 | 165 | °C | 4 | ||
| Supply Voltage | VCC | 4.5 | 5 | 5.5 | V | 8 | |
| Supply Buffer Capacitor | CSUP | 10 | 100 | 600 | nF | 8 | |
| Supply Current | ICC | 5 | 8.5 | 10 | mA | Each die | 8 |
| Ambient Operating Temperature | TA | -40 | 150 | °C | 8 | ||
| Number of EEPROM Writes | NEEPROM | 100 | writes | TA = 25°C | 8 | ||
| Magnetic Flux Density | /BIN/ | 300 | 1000 | G | For xxx-10 parts, devices tested at /BIN/ = 300 G; operation below this value is characterized, but not specified | 8 | |
| Undervoltage Detection Threshold (LOW, FALL) | VUVD (LOW, FALL) | 3.6 | 4.1 | V | VCC falling, uvd_sel = '0' | 9 | |
| Undervoltage Detection Threshold (LOW, RISE) | VUVD (LOW, RISE) | 3.7 | 4.2 | V | VCC rising, uvd_sel = '0' | 9 | |
| Undervoltage Detection Threshold (HIGH, FALL) | VUVD (HIGH, FALL) | 4.1 | 4.4 | V | VCC falling, uvd_sel = '1' | 9 | |
| Undervoltage Detection Threshold (HIGH, RISE) | VUVD (HIGH, RISE) | 4.2 | 4.5 | V | VCC rising, uvd_sel = '1' | 9 | |
| Overvoltage Detection Threshold (LOW, FALL) | VOVD (LOW, FALL) | 5.6 | 6 | V | VCC falling, ovd_sel = '1' | 9 | |
| Overvoltage Detection Threshold (LOW, RISE) | VOVD (LOW, RISE) | 5.65 | 6.05 | V | VCC rising, ovd_sel = '1' | 9 | |
| Overvoltage Detection Threshold (HIGH, FALL) | VOVD (HIGH, FALL) | 8.4 | 10.2 | V | VCC falling, ovd_sel = '0' | 9 | |
| Overvoltage Detection Threshold (HIGH, RISE) | VOVD (HIGH, RISE) | 8.6 | 10.4 | V | VCC rising, ovd_sel = '0' | 9 | |
| Power-On Reset Voltage (FALL) | VPOR(FALL) | 2.6 | 2.9 | V | VCC falling | 9 | |
| Power-On Reset Voltage (RISE) | VPOR(RISE) | 2.8 | 3.1 | V | VCC rising | 9 | |
| Angle Error (XZ) | ERRANG(XZ) | -1 | 1 | degrees | TA = 25°C | 9 | |
| Angle Error (XZ) | ERRANG(XZ) | -1.2 | 1.2 | degrees | -40 ≤ TA ≤ 150°C | 9 | |
| Angle Drift (XZ) over temperature | DRIFTAng,Temp(XZ) | -1.2 | 1.2 | degrees | Change in angle relative to TA = 25°C | 9 | |
| Channel Sensitivity Error (Z) | ERRSens(Z) | -1.5 | 1.5 | % | TA = 25°C | 10 | |
| Channel Sensitivity Error (Z) | ERRSens(Z) | -4 | 4 | % | -40 ≤ TA ≤ 150°C | 10 | |
| Channel Offset Error (Z) | ERROff(Z) | -1.5 | 1.5 | G | TA = 25°C | 10 | |
| Channel Linearity Error (Z) | ERRLin(Z) | -0.3 | 0.3 | % | 100 G ≤ BIN ≤ 1000 G | 10 | |
| Channel Sensitivity Error Drift over temperature (Z) | DRIFTSens,Temp(Z) | -3 | 3 | % | Change in sensitivity relative to TA = 25°C | 10 | |
| Channel Sensitivity Error Drift over life (Z) | DRIFTSens,Life(Z) | -3.5 | 2.5 | 3.5 | % | Change in sensitivity relative to pre-stress conditions | 10 |
| Channel Offset Drift over temperature (Z) | DRIFTOff,Temp(Z) | -1.5 | 1.5 | G | Change in offset relative to TA = 25°C | 10 | |
| Channel Offset Drift over life (Z) | DRIFTOff,Life(Z) | -0.6 | 0.5 | 0.6 | G | Change in offset relative to pre-stress conditions | 10 |
| Broken Wire Response Time | tBW | 500 | µs | Time after VCC, GND = 0.2 V, either VCC or GND wire broken, CL = 100 nF, CSUP = 100 nF | 11 | ||
| Filter Step Response Time | tRESP | 396 | 450 | µs | bw_sel = 5, time to 90% response to step | 11 | |
| Analog Low Operating Range | VLIMOUT(L) | 0 | 0 | 0.014 | V | VCC = 5 V, ana_range_sel = '0' | 13 |
| Analog Low Operating Range | VLIMOUT(L) | 0.186 | 0.2 | 0.214 | V | VCC = 5 V, ana_range_sel = '1' | 13 |
| Analog Low Operating Range | VLIMOUT(L) | 0.236 | 0.25 | 0.264 | V | VCC = 5 V, ana_range_sel = '2' | 13 |
| Analog Low Operating Range | VLIMOUT(L) | 0.286 | 0.3 | 0.314 | V | VCC = 5 V, ana_range_sel = '3' | 13 |
| Analog Low Operating Range | VLIMOUT(L) | 0.336 | 0.35 | 0.364 | V | VCC = 5 V, ana_range_sel = '4' | 13 |
| Analog Low Operating Range | VLIMOUT(L) | 0.386 | 0.4 | 0.414 | V | VCC = 5 V, ana_range_sel = '5' | 13 |
| Analog Low Operating Range | VLIMOUT(L) | 0.486 | 0.5 | 0.514 | V | VCC = 5 V, ana_range_sel = '6' | 13 |
| Analog Low Operating Range | VLIMOUT(L) | 0.736 | 0.75 | 0.764 | V | VCC = 5 V, ana_range_sel = '7' | 13 |
| Analog High Operating Range | VLIMOUT(H) | 4.986 | 5 | 5 | V | VCC = 5 V, ana_range_sel = '0' | 13 |
| Analog High Operating Range | VLIMOUT(H) | 4.786 | 4.8 | 4.814 | V | VCC = 5 V, ana_range_sel = '1' | 13 |
| Analog High Operating Range | VLIMOUT(H) | 4.736 | 4.75 | 4.764 | V | VCC = 5 V, ana_range_sel = '2' | 13 |
| Analog High Operating Range | VLIMOUT(H) | 4.686 | 4.7 | 4.714 | V | VCC = 5 V, ana_range_sel = '3' | 13 |
| Analog High Operating Range | VLIMOUT(H) | 4.636 | 4.65 | 4.664 | V | VCC = 5 V, ana_range_sel = '4' | 13 |
| Analog High Operating Range | VLIMOUT(H) | 4.586 | 4.6 | 4.614 | V | VCC = 5 V, ana_range_sel = '5' | 13 |
| Analog High Operating Range | VLIMOUT(H) | 4.486 | 4.5 | 4.514 | V | VCC = 5 V, ana_range_sel = '6' | 13 |
| Analog High Operating Range | VLIMOUT(H) | 4.236 | 4.25 | 4.264 | V | VCC = 5 V, ana_range_sel = '7' | 13 |
| Package Thermal Resistance (TSSOP-14) | RϴJA | 214 | °C/W | 4 | |||
| Default Channel Sensitivity | SENS | 32.125 | LSB / G | Target Selection Guide Part Number: XXX-10 | 10 |
CAD (KiCad official)
- Symbol:
A31315LLUBTR-XZ-S-AR-10 - Footprint:
Package_SO:TSSOP-14_4.4x5mm_P0.65mm - 3D model: TSSOP-14 (KiCad packages3D, STEP)
- 3D model files:
a31315llubtr-xz-s-ar-10-etched.step/a31315llubtr-xz-s-ar-10-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);a31315llubtr-xz-s-ar-10.step/a31315llubtr-xz-s-ar-10.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Allegro MicroSystems, LLC datasheet (70 pp, sha256
5e17bbddc669f0d8, retrieved 2026-11-02, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).