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A1212LLHLX-T

Allegro MicroSystems LLC · Linear Hall Sensors · SOT-23W

A1212LLHLX-T from Allegro MicroSystems LLC, in a SOT-23W. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in Connects the power supply to the chip; operating supply voltage is 3.8 to 24 V (TJ < 165°C), with absolute maximum supply voltage of 30 V.
2 VOUT output Open-drain NMOS output from the circuit; it sinks up to 25 mA, the output-on voltage is 400 mV max at IOUT = 20 mA, and the output off voltage is 30 V max.
3 GND power_in Ground connection for the device.

Key specifications

Parameter Value
Manufacturer Allegro MicroSystems LLC
Package SOT-23W
Category Magnetic Sensors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VCC 3.8 24 V Operating, TJ < 165°C 4
Output Leakage Current IOUTOFF 10 µA VOUT = 24 V, B < BRP 4
Output On Voltage VOUT(SAT) 215 400 mV IOUT = 20 mA, B > BOP 4
Power-On Time tPO 4 µs Slew rate (dVCC/dt) < 2.5 V/μs, B > BOP + 5 G or B < BRP 4
Output Rise Time tr 400 ns VCC = 12 V, RLOAD = 820 Ω, CS = 12 pF 4
Output Fall Time tf 400 ns VCC = 12 V, RLOAD = 820 Ω, CS = 12 pF 4
Supply Current (On) ICCON 4.1 7.5 mA B > BOP 4
Supply Current (Off) ICCOFF 3.8 7.5 mA B < BRP 4
Reverse Battery Current IRCC -10 mA VRCC = -30 V 4
Supply Zener Clamp Voltage VZ 32 V ICC = 10.5 mA; TA = 25°C 4
Supply Zener Current IZ 10.5 mA VZ = 32 V; TA = 25°C 4
Operate Point (A1212) BOP 50 107 175 G South pole adjacent to branded face of device 4
Release Point (A1212) BRP -175 -117 -50 G North pole adjacent to branded face of device 4
Hysteresis (A1212) BHYS 100 225 350 G BOP, BRP 4
Supply Voltage (reverse, absolute maximum) VCC 30 V 2
Reverse Supply Voltage VRCC -30 V 2
Output Off Voltage VOUT 30 V 2
Reverse Output Voltage VROUT -0.5 V 2
Output Current IOUTSINK 25 mA 2
Operating Ambient Temperature (Range L) TA -40 150 °C Range L 2
Maximum Junction Temperature TJ(max) 165 °C 2
Storage Temperature Tstg -65 170 °C 2
Package Thermal Resistance (single-sided PCB) RθJA 228 °C/W Package LH, on single layer, single-sided PCB with copper limited to solder pads 5
Package Thermal Resistance (double-sided PCB) RθJA 110 °C/W Package LH, on single layer, double-sided PCB with 0.926 in2 copper area 5

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin ultra mini SIP for through-hole mounting. Each package is lead (Pb) free, with 100% matte-tin-plated leadframes. 1

CAD (KiCad official)

  • Symbol: A1212LLHLX-T
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23W (KiCad packages3D, STEP)
  • 3D model files: a1212llhlx-t-etched.step / a1212llhlx-t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); a1212llhlx-t.step / a1212llhlx-t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Allegro MicroSystems LLC datasheet (15 pp, sha256 dff414de859efd3e, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF