component
A1126LLHLT-T
Public Made by Adomby adom
Allegro MicroSystems LLC Linear Hall Sensors, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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A1126LLHLT-T
Allegro MicroSystems LLC · Linear Hall Sensors · SOT-23
A1126LLHLT-T from Allegro MicroSystems LLC, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | Connects the power supply to the chip, with a forward supply voltage absolute maximum of 28 V and a reverse supply voltage of -18 V. |
| 2 | VOUT | output | Output from the circuit, rated for an output off voltage of 28 V maximum with continuous output current internally limited. |
| 3 | GND | power_in | Ground connection for the device. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Allegro MicroSystems LLC |
| Package | SOT-23 |
| Category | Magnetic Sensors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Forward Supply Voltage | VCC | 28 | V | 2 | |||
| Reverse Supply Voltage | VRCC | -18 | V | 2 | |||
| Output Off Voltage | VOUT | 28 | V | 2 | |||
| Reverse Supply Current | IRCC | -2 | mA | 2 | |||
| Operating Ambient Temperature | TA | -40 | 150 | °C | L temperature range | 2 | |
| Maximum Junction Temperature | TJ(max) | 165 | °C | 2 | |||
| Storage Temperature | Tstg | -65 | 170 | °C | 2 | ||
| Supply Voltage | VCC | 3 | 24 | V | Operating, TJ < 165°C | 3 | |
| Output Leakage Current | IOUTOFF | 10 | µA | VOUT = 24 V, B < BRPS | 3 | ||
| Output On Voltage | VOUT(SAT) | 185 | 500 | mV | IOUT = 20 mA, B > BOP | 3 | |
| Output Current Limit | IOM | 30 | 60 | mA | B > BOP | 3 | |
| Power-On Time | tPO | 25 | µs | 3 | |||
| Output Rise Time | tr | 0.2 | 2 | µs | RLOAD = 820 Ω, CS = 20 pF | 3 | |
| Output Fall Time | tf | 0.1 | 2 | µs | RLOAD = 820 Ω, CS = 20 pF | 3 | |
| Supply Current (on) | ICC(ON) | 4 | mA | B > BOP, VCC = 12 V | 3 | ||
| Supply Current (off) | ICC(OFF) | 4 | mA | B < BRP, VCC = 12 V | 3 | ||
| Supply Zener Clamp Voltage | VZ | 28 | V | ICC = 6.5 mA; TA = 25°C | 3 | ||
| Supply Zener Current | IZSUPPLY | 6.5 | mA | VS = 28 V | 3 | ||
| Operate Point (south) | BOPS | 15 | 38 | 55 | G | South pole adjacent to branded face | 3 |
| Operate Point (north) | BOPN | -55 | -38 | -15 | G | North pole adjacent to branded face | 3 |
| Release Point (south) | BRPS | 5 | 20 | 50 | G | South pole adjacent to branded face | 3 |
| Release Point (north) | BRPN | -50 | -20 | -5 | G | North pole adjacent to branded face | 3 |
| Hysteresis | BHYS | 5 | 30 | G | /BOPS, BRPS/, /BOPN, BRPN/ | 3 | |
| Package Thermal Resistance, 1-layer PCB with copper limited to solder pads (Package LH) | RθJA | 228 | °C/W | Package LH, 1-layer PCB with copper limited to solder pads | 8 | ||
| Package Thermal Resistance, 2-layer PCB with 0.463 in.2 copper each side connected by thermal vias (Package LH) | RθJA | 110 | °C/W | Package LH, 2-layer PCB with 0.463 in.2 of copper area each side connected by thermal vias | 8 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | UA is a three-lead ultra-mini SIP for through-hole mounting. Each package is lead (Pb) free, with 100% matte-tin-plated leadframe. | 2 |
CAD (KiCad official)
- Symbol:
A1126LLHLT-T - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files:
a1126llhlt-t-etched.step/a1126llhlt-t-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);a1126llhlt-t.step/a1126llhlt-t.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Allegro MicroSystems LLC datasheet (15 pp, sha256
bc714a8c6d89c20b, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# A1126LLHLT-T
**Allegro MicroSystems LLC** · Linear Hall Sensors · SOT-23
A1126LLHLT-T from Allegro MicroSystems LLC, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | Connects the power supply to the chip, with a forward supply voltage absolute maximum of 28 V and a reverse supply voltage of -18 V. |
| 2 | VOUT | output | Output from the circuit, rated for an output off voltage of 28 V maximum with continuous output current internally limited. |
| 3 | GND | power_in | Ground connection for the device. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Allegro MicroSystems LLC |
| Package | SOT-23 |
| Category | Magnetic Sensors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Forward Supply Voltage | VCC | | | 28 | V | | 2 |
| Reverse Supply Voltage | VRCC | -18 | | | V | | 2 |
| Output Off Voltage | VOUT | | | 28 | V | | 2 |
| Reverse Supply Current | IRCC | -2 | | | mA | | 2 |
| Operating Ambient Temperature | TA | -40 | | 150 | °C | L temperature range | 2 |
| Maximum Junction Temperature | TJ(max) | | | 165 | °C | | 2 |
| Storage Temperature | Tstg | -65 | | 170 | °C | | 2 |
| Supply Voltage | VCC | 3 | | 24 | V | Operating, TJ < 165°C | 3 |
| Output Leakage Current | IOUTOFF | | | 10 | µA | VOUT = 24 V, B < BRPS | 3 |
| Output On Voltage | VOUT(SAT) | | 185 | 500 | mV | IOUT = 20 mA, B > BOP | 3 |
| Output Current Limit | IOM | 30 | | 60 | mA | B > BOP | 3 |
| Power-On Time | tPO | | | 25 | µs | | 3 |
| Output Rise Time | tr | | 0.2 | 2 | µs | RLOAD = 820 Ω, CS = 20 pF | 3 |
| Output Fall Time | tf | | 0.1 | 2 | µs | RLOAD = 820 Ω, CS = 20 pF | 3 |
| Supply Current (on) | ICC(ON) | | | 4 | mA | B > BOP, VCC = 12 V | 3 |
| Supply Current (off) | ICC(OFF) | | | 4 | mA | B < BRP, VCC = 12 V | 3 |
| Supply Zener Clamp Voltage | VZ | 28 | | | V | ICC = 6.5 mA; TA = 25°C | 3 |
| Supply Zener Current | IZSUPPLY | | | 6.5 | mA | VS = 28 V | 3 |
| Operate Point (south) | BOPS | 15 | 38 | 55 | G | South pole adjacent to branded face | 3 |
| Operate Point (north) | BOPN | -55 | -38 | -15 | G | North pole adjacent to branded face | 3 |
| Release Point (south) | BRPS | 5 | 20 | 50 | G | South pole adjacent to branded face | 3 |
| Release Point (north) | BRPN | -50 | -20 | -5 | G | North pole adjacent to branded face | 3 |
| Hysteresis | BHYS | 5 | | 30 | G | /BOPS, BRPS/, /BOPN, BRPN/ | 3 |
| Package Thermal Resistance, 1-layer PCB with copper limited to solder pads (Package LH) | RθJA | | 228 | | °C/W | Package LH, 1-layer PCB with copper limited to solder pads | 8 |
| Package Thermal Resistance, 2-layer PCB with 0.463 in.2 copper each side connected by thermal vias (Package LH) | RθJA | | 110 | | °C/W | Package LH, 2-layer PCB with 0.463 in.2 of copper area each side connected by thermal vias | 8 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | | tin | UA is a three-lead ultra-mini SIP for through-hole mounting. Each package is lead (Pb) free, with 100% matte-tin-plated leadframe. | 2 |
## CAD (KiCad official)
- Symbol: `A1126LLHLT-T`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files: `a1126llhlt-t-etched.step` / `a1126llhlt-t-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `a1126llhlt-t.step` / `a1126llhlt-t.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Allegro MicroSystems LLC datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588912039570124800) (15 pp, sha256 `bc714a8c6d89c20b`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/a1126llhlt-t-datasheet.pdf)