93LC66BX-I from Microchip Tech, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	NC	unconnected	No internal connection on the rotated SOIC package.
2	VCC	power_in	Power supply input; the 93LC66 devices operate from 2.5V to 5.5V, and VCC must be 4.5V or higher for proper WRAL operation.
3	CS	input	Chip Select: a high level selects the device, a low level deselects it and forces Standby mode, and CS must be low for at least 250 ns (TCSL) between instructions.
4	CLK	input	Serial Clock that synchronizes host communication, with opcodes, address and data bits clocked in on the positive edge of CLK.
5	DI	input	Serial Data In, used to clock in the start bit, opcode, address and data synchronously with CLK.
6	DO	tri_state	Serial Data Out, which outputs read data synchronously with CLK, gives Ready/Busy status during erase/write cycles, and is High-Z when status is not available.
7	VSS	power_in	Ground.
8	NC	unconnected	No internal connection on the 93LC66B (the ORG function applies only to the 93XX66C; the B device is fixed x16).

Key specifications

Parameter	Value
Manufacturer	Microchip Tech
Package	SOIC-8
Category	Interface ICs
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
High-level Input Voltage	VIH1	2			V	VCC ≥ 2.7V	3
High-level Input Voltage	VIH2	0.7			xVCC	VCC < 2.7V	3
Low-level Input Voltage	VIL1	-0.3		0.8	V	VCC ≥ 2.7V	3
Low-level Input Voltage	VIL2	-0.3		0.2	xVCC	VCC < 2.7V (min -0.3 V, max 0.2 VCC)	3
Low-level Output Voltage	VOL1			0.4	V	IOL = 2.1 mA, VCC = 4.5V	3
Low-level Output Voltage	VOL2			0.2	V	IOL = 100 µA, VCC = 2.5V	3
High-level Output Voltage	VOH1	2.4			V	IOH = -400 µA, VCC = 4.5V	3
Input Leakage Current	ILI	-1		1	µA	VIN = VSS or VCC	3
Output Leakage Current	ILO	-1		1	µA	VOUT = VSS or VCC	3
Pin Capacitance (all inputs/outputs)	CIN, COUT			7	pF	VIN/VOUT = 0V, TA = +25°C, FCLK = 1 MHz	3
Write Current	ICC write			2	mA	FCLK = 3 MHz, Vcc = 5.5V	3
Write Current	ICC write		500		µA	FCLK = 2 MHz, Vcc = 2.5V	3
Read Current	ICC read			1	mA	FCLK = 3 MHz, VCC = 5.5V	3
Read Current	ICC read			500	µA	FCLK = 2 MHz, VCC = 3.0V	3
Read Current	ICC read		100		µA	FCLK = 2 MHz, VCC = 2.5V	3
Standby Current	ICCS			1	µA	I-Temp, CS = 0V, ORG = DI = CLK = VSS or VCC	3
VCC voltage detect	VPOR		1.5		V	93AA66A/B/C, 93LC66A/B/C (Note 1)	4
Clock Frequency	FCLK			2	MHz	2.5V ≤ VCC < 5.5V	4
Clock High Time	TCKH	250			ns	2.5V ≤ VCC < 5.5V	4
Clock Low Time	TCKL	200			ns	2.5V ≤ VCC < 5.5V	4
Chip Select Setup Time	TCSS	50			ns	4.5V ≤ VCC < 5.5V	4
Chip Select Setup Time	TCSS	100			ns	2.5V ≤ VCC < 4.5V	4
Chip Select Hold Time	TCSH	0			ns	1.8V ≤ VCC < 5.5V	4
Chip Select Low Time	TCSL	250			ns	1.8V ≤ VCC < 5.5V	4
Data Input Setup Time	TDIS	100			ns	2.5V ≤ VCC < 5.5V	4
Data Input Hold Time	TDIH	100			ns	2.5V ≤ VCC < 5.5V	4
Data Output Delay Time	TPD			200	ns	4.5V ≤ VCC < 5.5V, CL = 100 pF	4
Data Output Delay Time	TPD			250	ns	2.5V ≤ VCC < 4.5V, CL = 100 pF	4
Data Output Disable Time	TCZ			100	ns	4.5V ≤ VCC < 5.5V, (Note 1)	4
Data Output Disable Time	TCZ			200	ns	1.8V ≤ VCC < 4.5V, (Note 1)	4
Status Valid Time	TSV			200	ns	4.5V ≤ VCC < 5.5V, CL = 100 pF	4
Status Valid Time	TSV			300	ns	2.5V ≤ VCC < 4.5V, CL = 100 pF	4
Program Cycle Time	TWC			6	ms	Erase/Write mode (AA and LC versions)	5
Program Cycle Time	TWL			15	ms	WRAL mode, 4.5V ≤ VCC ≤ 5.5V	5
Supply voltage	VCC			7	V		3
All inputs and outputs w.r.t. VSS		-0.6			V	-0.6V to VCC +1.0V	3
Storage temperature		-65		150	°C		3
Ambient temperature with power applied		-40		125	°C		3
ESD protection on all pins		4			kV	≥ 4 kV	3
Operating temperature (Industrial)	TA	-40		85	°C	Industrial (I)	3
Supply voltage range	VCC	2.5		5.5	V	93LC66B VCC range (Device Selection Table)	1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
contacts		tin	Part Number VCC Range ORG Pin Word Size Temperature Ranges Packages 93AA66A 1.8V-5.5V No 8-bit I MC, MS, P, SN, OT, MN,ST	1

CAD (KiCad official)

Symbol: 93LC66BX-I
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOIC-8 (KiCad packages3D, STEP)
3D model files: 93lc66bx-i-etched.step / 93lc66bx-i-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 93lc66bx-i.step / 93lc66bx-i.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Microchip Tech datasheet (43 pp, sha256 04494d6624e9f111, retrieved 2026-10-31, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

93LC66BX-I

Verified 93LC66BX-I

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

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