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Ray Publish 0.1.0 6d210d8 10d ago

93LC56

Microchip Tech · Pre-ordered Chips · SOIC-8

93LC56 from Microchip Tech, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CS input Chip Select: a high level selects the device and a low level deselects it and forces Standby mode, and CS must be low for 250 ns minimum (TCSL) between consecutive instructions.
2 CLK input Serial Data Clock that synchronizes communication with the master, clocking opcode, address and data in on the positive edge, with a clock frequency of up to 2 MHz at VCC ≥ 4.5V and 1 MHz otherwise.
3 DI input Serial Data Input used to clock in the Start bit, opcode, address and data synchronously with the CLK input.
4 DO tri_state Serial Data Output that outputs data synchronously with CLK (TPD max 400 ns) in Read mode, gives Ready/Busy status during erase/write, is High-Z otherwise, and needs a pull-up resistor to read the Ready signal if status is checked after the cycle.
5 VSS power_in Ground.
6 ORG input Memory Configuration: tied to VCC selects x16 organization and tied to VSS selects x8, and it may be floated only for clock speeds of 1 MHz or less in x16 organization.
7 NU unconnected Not Utilized.
8 VCC power_in Power supply, with DC characteristics specified for VCC = 2.5V to 5.5V and an absolute maximum of 6.5V.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOIC-8
Category Interface ICs
Pins 8

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin packages. The rotated pin-out 93LC46X/56X/66X are offered in the “SN” package only. 1

CAD (KiCad official)

  • Symbol: 93LC56
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: 93lc56-etched.step / 93lc56-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 93lc56.step / 93lc56.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (20 pp, sha256 89cef746eb0ce6c8, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF