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93LC56-I

Microchip Tech · EEPROM · SOIC-8

93LC56-I from Microchip Tech, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	CS	input	Chip Select: a high level selects the device and a low level deselects it and forces Standby mode, with CS required to be low for 250 ns minimum (TCSL) between consecutive instructions.
2	CLK	input	Serial Data Clock: opcode, address and data bits are clocked in on its positive edge, data is clocked out on the positive edge, and CLK is a don't-care while CS is low.
3	DI	input	Serial Data Input: clocks in the Start bit, opcode, address and data synchronously with CLK.
4	DO	tri_state	Serial Data Output: outputs read data synchronously with CLK (TPD after the positive CLK edge) and provides Ready/Busy status during erase and write cycles, otherwise held in High-Z.
5	VSS	power_in	Ground reference for the device.
6	ORG	input	Memory organization select: tied to VCC selects x16 organization and tied to VSS selects x8; for clock speeds above 1 MHz it must be tied to VCC or VSS and may only be floated at 1 MHz or less for x16.
7	NU	unconnected	Not Utilized; listed as NU in the pin function table and not used by the device.
8	VCC	power_in	Power supply, specified as +1.8V to 5.5V in the pin function table (the DC and AC characteristics are specified for VCC = +2.5V to +5.5V).

Key specifications

Parameter	Value
Manufacturer	Microchip Tech
Package	SOIC-8
Category	Memory
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Supply voltage VCC (operating range)	VCC	2.5		5.5	V	Industrial (I): TA = -40°C to +85°C	2
Ambient temperature, industrial	TA	-40		85	°C	Industrial (I)	2
All inputs and outputs w.r.t. VSS		-0.6			V		2
Storage temperature		-65		150	°C		2
Ambient temperature with power applied		-40		125	°C		2
ESD protection on all pins		4			kV		2
High-level input voltage VIH1	VIH1	2			V	VCC 2.7V	2
High-level input voltage VIH2	VIH2	0.7			VCC	VCC 2.7V	2
Low-level input voltage VIL1	VIL1	-0.3		0.8	V	VCC 2.7V	2
Low-level input voltage VIL2	VIL2	-0.3		0.2	VCC	VCC 2.7V	2
Low-level output voltage VOL1	VOL1			0.4	V	IOL = 2.1 mA, VCC = 4.5V	2
Low-level output voltage VOL2	VOL2			0.3	V	IOL = 100 µA, VCC = 2.5V	2
High-level output voltage VOH1	VOH1	2.4			V	IOL = 400 µA, VCC = 4.5V	2
High-level output voltage VOH2	VOH2	-0.2			VCC	IOL = 100 µA, VCC = 2.5V	2
Input leakage current ILI	ILI	-10		10	µA	VIN = 0.1V to VCC	2
Output leakage current ILO	ILO	-10		10	µA	VOUT = 0.1V to VCC	2
Pin capacitance (all inputs/outputs)	CIN, COUT			7	pF	VIN/VOUT = 0V (Note 1 & 2), TA = 25°C, FCLK = 1 MHz	2
ICC write operating current	ICC write			3	mA	FCLK = 2 MHz, VCC = 5.5V (Note 2)	2
ICC read operating current	ICC read			1	mA	FCLK = 2 MHz, VCC = 5.5V	2
ICC read operating current	ICC read			500	µA	FCLK = 1 MHz, VCC = 3.0V	2
Standby current ICCS	ICCS			100	µA	CLK = CS = 0V; VCC = 5.5V	2
Standby current ICCS	ICCS			30	µA	CLK = CS = 0V; VCC = 3.0V	2
Clock frequency FCLK	FCLK			2	MHz	VCC 4.5V	3
Clock frequency FCLK	FCLK			1	MHz	VCC 4.5V	3
Clock high time TCKH	TCKH	250			ns		3
Clock low time TCKL	TCKL	250			ns		3
Chip select setup time TCSS	TCSS	50			ns	Relative to CLK	3
Chip select hold time TCSH	TCSH	0			ns	Relative to CLK	3
Chip select low time TCSL	TCSL	250			ns		3
Data input setup time TDIS	TDIS	100			ns	Relative to CLK	3
Data input hold time TDIH	TDIH	100			ns	Relative to CLK	3
Data output delay time TPD	TPD			400	ns	CL = 100 pF	3
Data output disable time TCZ	TCZ			100	ns	CL = 100 pF (Note 2)	3
Status valid time TSV	TSV			500	ns	CL = 100 pF	3
Program cycle time TWC	TWC		4	10	ms	Erase/Write mode	3
ERAL cycle time TEC	TEC		8	15	ms	ERAL mode (VCC=5V ±10%)	3
WRAL cycle time TWL	TWL		16	30	ms	WRAL mode (VCC=5V ±10%)	3
Endurance		1			M cycles	25°C, VCC = 5.0V, Block mode (Note 3)	3
Standby current ICCS	ICCS		3		µA	CLK = CS = 0V; VCC = 2.5V	2
ICC read operating current	ICC read		100		µA	FCLK = 1 MHz, VCC = 2.5V	2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
contacts		tin	packages. The rotated pin-out 93LC46X/56X/66X are offered in the “SN” package only.	1

CAD (KiCad official)

Symbol: 93LC56-I
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOIC-8 (KiCad packages3D, STEP)
3D model files: 93lc56-i-etched.step / 93lc56-i-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 93lc56-i.step / 93lc56-i.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Microchip Tech datasheet (20 pp, sha256 4505cc44abc8619f, retrieved 2026-10-21, tier: lcsc)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF