component

80SQ045NG

Public Made by Adom

by adom

onsemi Schottky Barrier Diodes (SBD), DO-27. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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80SQ045NG

onsemi · Schottky Barrier Diodes (SBD) · DO-27

80SQ045NG from onsemi, in a DO-27. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode, indicated by the polarity band; rated for 45 V peak repetitive reverse/DC blocking voltage (VRRM/VRWM/VR).
2 A passive Anode; carries up to 8.0 A average rectified forward current (IO) at TL = 75°C with a 0.55 V maximum forward voltage at 8.0 A.

Key specifications

Parameter Value
Manufacturer onsemi
Package DO-27
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage / Working Peak Reverse Voltage / DC Blocking Voltage VRRM/VRWM/VR 45 V 1
Average Rectified Forward Current IO 8 A TL = 75°C (PsiJL = 12°C/W, P.C. Board Mounting, Note 2) 1
Non-Repetitive Peak Surge Current IFSM 140 A Surge applied at rated load conditions, halfwave, single phase, 60 Hz 1
Operating and Storage Junction Temperature Range TJ, Tstg -65 125 °C Reverse voltage applied 1
Voltage Rate of Change dv/dt 10 V/ns Rated VR 1
Maximum Instantaneous Forward Voltage vF 0.55 V iF = 8.0 A, TL = 25°C 2
Maximum Instantaneous Reverse Current, TL = 25°C iR 1 mA Rated dc voltage, TL = 25°C 2
Maximum Instantaneous Reverse Current, TL = 100°C iR 50 mA Rated dc voltage, TL = 100°C 2
Thermal Resistance, Junction-to-Lead (0.9 in x 0.9 in copper pad) RJL 13 °C/W 0.9 in x 0.9 in Copper Pad Size 2
Thermal Resistance, Junction-to-Lead (6.75 in x 6.75 in copper pad) RJL 12 °C/W 6.75 in x 6.75 in Copper Pad Size 2
Thermal Resistance, Junction-to-Ambient (0.9 in x 0.9 in copper pad) RJA 50 °C/W 0.9 in x 0.9 in Copper Pad Size 2
Thermal Resistance, Junction-to-Ambient (6.75 in x 6.75 in copper pad) RJA 40 °C/W 6.75 in x 6.75 in Copper Pad Size 2

CAD (KiCad official)

  • Symbol: 80SQ045NG
  • Footprint: Diode_THT:D_DO-27_P15.24mm_Horizontal
  • 3D model: DO-27 (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (4 pp, sha256 60760058a8109b2f, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF