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74LVCE1G02SE-7

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Diodes Incorporated Logic Gates, SOT-353. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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74LVCE1G02SE-7

Diodes Incorporated · Logic Gates · SOT-353

74LVCE1G02SE-7 from Diodes Incorporated, in a SOT-353. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A input Data input A of the NOR gate, tolerant to 5.5V, with unused inputs to be held at Vcc or ground.
2 B input Data input B of the NOR gate, tolerant to 5.5V, with unused inputs to be held at Vcc or ground.
3 GND power_in Ground pin.
4 Y output Totem-pole data output providing ±24mA drive at 3.3V that is disabled by the IOFF circuitry when the device is powered down.
5 Vcc power_in Supply voltage pin for an operating range of 1.4V to 5.5V.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-353
Category Logic
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating Voltage VCC 1.4 5.5 V Operating 4
Data retention only VCC 1.2 V Data retention only 4
High-level Input Voltage VIH 1.7 V VCC = 2.3 V to 2.7 V 4
High-level Input Voltage VIH 2 V VCC = 3 V to 3.6 V 4
Low-level input voltage VIL 0.7 V VCC = 2.3 V to 2.7 V 4
Low-level input voltage VIL 0.8 V VCC = 3 V to 3.6 V 4
Input Voltage VI 0 5.5 V 4
Output Voltage VO 0 V 4
Operating free-air temperature TA -40 85 °C 4
High-level output current IOH -3 mA Vcc=1.4 V 4
High-level output current IOH -4 mA VCC = 1.65 V 4
High-level output current IOH -8 mA VCC = 2.3 V 4
High-level output current IOH -16 mA VCC = 3 V 4
High-level output current IOH -24 mA 4
High-level output current IOH -32 mA VCC = 4.5 V 4
Low-level output current IOL 3 mA Vcc=1.4 V 4
Low-level output current IOL 4 mA VCC = 1.65 V 4
Low-level output current IOL 8 mA VCC = 2.3 V 4
Low-level output current IOL 16 mA VCC = 3 V 4
Low-level output current IOL 24 mA 4
Low-level output current IOL 32 mA VCC = 4.5 V 4
Input transition rise or fall rate Δt/ΔV 20 ns/V VCC = 1.4 to 3V 4
Input transition rise or fall rate Δt/ΔV 10 ns/V VCC = 3.3 V ± 0.3 V 4
Input transition rise or fall rate Δt/ΔV 5 ns/V VCC = 5 V ± 0.5 V 4
ESD HBM Human Body Model ESD Protection ESD HBM 2 KV Human Body Model 3
ESD MM Machine Model ESD Protection ESD MM 200 V Machine Model 3
Supply Voltage Range VCC -0.5 6.5 V 3
Input Voltage Range VI -0.5 6.5 V 3
Voltage applied to output in high impedance or IOFF state Vo -0.5 6.5 V high impedance or IOFF state 3
Voltage applied to output in high or low state Vo -0.3 V high or low state; upper limit VCC +0.5 V 3
Input Clamp Current IIK -50 mA VI<0 3
Output Clamp Current IOK -50 mA 3
Continuous output current IO -50 50 mA 3
Continuous current through Vdd or GND -100 100 mA 3
Operating Junction Temperature TJ -40 150 °C 3
Storage Temperature TSTG -65 150 °C 3
High Level Output Voltage VOH 1.05 V IOH = -3mA, VCC 1.4 V 5
High Level Output Voltage VOH 1.2 V IOH = -4mA, VCC 1.65 V 5
High Level Output Voltage VOH 1.9 V IOH = -8mA, VCC 2.3 V 5
High Level Output Voltage VOH 2.4 V IOH = -16mA, VCC 3 V 5
High Level Output Voltage VOH 2.3 V IOH = -24mA 5
High Level Output Voltage VOH 3.8 V IOH = -32mA, VCC 4.5 V 5
Low Level Output Voltage VOL 0.1 V IOL = 100μA, VCC 1.4 V to 5.5V 5
Low Level Output Voltage VOL 0.4 V IOL = 3mA, VCC 1.4V 5
Low Level Output Voltage VOL 0.45 V IOL = 4mA, VCC 1.65 V 5
Low Level Output Voltage VOL 0.3 V IOL = 8mA, VCC 2.3V 5
Low Level Output Voltage VOL 0.55 V IOL = 24mA 5
Input Current II -5 5 μA VI = 5.5 V or GND, VCC 0 to 5.5 V 5
Power Down Leakage Current IOFF -10 10 μA VI or VO = 5.5V, VCC 0 5
Supply Current ICC 10 μA VI = 5.5V or GND, IO=0, VCC 1.4 V to 5.5V 5
Additional Supply Current ΔICC 500 μA One input at VCC -0.6 V, other inputs at VCC or GND, VCC 3 V to 5.5V 5
Thermal Resistance Junction-to-Ambient SOT353 θJA 371 °C/W Note 5: FR-4 PCB, 2oz copper, minimum recommended pad layout 5
Thermal Resistance Junction-to-Case SOT353 θJC 143 °C/W Note 5: FR-4 PCB, 2oz copper, minimum recommended pad layout 5
Propagation delay A or B to Y, CL=15pF tpd 1.9 7.2 ns CL = 15pF, VCC = 1.5 V ±0.1V 6
Propagation delay A or B to Y, CL=15pF tpd 1.3 5 ns CL = 15pF, VCC = 1.8 V ±0.15V 6
Propagation delay A or B to Y, CL=15pF tpd 0.6 3.5 ns CL = 15pF, VCC = 2.5 V ±0.2V 6
Propagation delay A or B to Y, CL=15pF tpd 0.6 2.9 ns CL = 15pF, VCC = 3.3 V ±0.3V 6
Propagation delay A or B to Y, CL=15pF tpd 0.7 2.9 ns CL = 15pF, VCC = 5 V ±0.5V 6
Propagation delay A or B to Y, CL=30 or 50pF tpd 2.8 8 ns CL = 30pF, VCC = 1.5 V ±0.1V 6
Propagation delay A or B to Y, CL=30 or 50pF tpd 1.9 5.6 ns CL = 30pF, VCC = 1.8 V ±0.15V 6
Propagation delay A or B to Y, CL=30 or 50pF tpd 0.9 4.4 ns CL = 50pF, VCC = 2.5 V ±0.2V 6
Propagation delay A or B to Y, CL=30 or 50pF tpd 0.8 3.6 ns CL = 50pF, VCC = 3.3 V ±0.3V 6
Propagation delay A or B to Y, CL=30 or 50pF tpd 0.9 3.6 ns CL = 50pF, VCC = 5 V ±0.5V 6

CAD (KiCad official)

  • Symbol: 74LVCE1G02SE-7
  • Footprint: Package_TO_SOT_SMD:SOT-353_SC-70-5
  • 3D model: SOT-353 (KiCad packages3D, STEP)
  • 3D model files: 74lvce1g02se-7-etched.step / 74lvce1g02se-7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 74lvce1g02se-7.step / 74lvce1g02se-7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (14 pp, sha256 81007202ea5e2187, retrieved 2026-10-27, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF