main
John Lauer Add manufacturer originals and grouped buffer library candidate 9481d76 1mo ago
(footprint "74LVC2G07GV-Q100H" (version 20241229) (generator "DepthLab")
(layer "F.Cu") (attr smd)
(descr "Nexperia SOT457 reflow copper/paste candidate; mask and seating pending")
(fp_text reference "REF**" (at 0 -2.2) (layer "F.SilkS") (effects (font (size 0.6 0.6) (thickness 0.12))))
(fp_text value "74LVC2G07GV-Q100H" (at 0 2.2) (layer "F.Fab") (effects (font (size 0.5 0.5) (thickness 0.1))))
(fp_rect (start -0.75 -1.45) (end 0.75 1.45) (stroke (width 0.1) (type default)) (fill none) (layer "F.Fab"))
(fp_line (start -0.75 -1.15) (end -0.45 -1.45) (stroke (width 0.1) (type default)) (layer "F.Fab"))
(fp_rect (start -1.85 -1.7) (end 1.85 1.7) (stroke (width 0.05) (type default)) (fill none) (layer "F.CrtYd"))
(fp_line (start -0.75 -1.6) (end 0.75 -1.6) (stroke (width 0.12) (type default)) (layer "F.SilkS"))
(fp_line (start -0.75 1.6) (end 0.75 1.6) (stroke (width 0.12) (type default)) (layer "F.SilkS"))
(fp_circle (center -1.8 -1.45) (end -1.74 -1.45) (stroke (width 0.1) (type default)) (fill solid) (layer "F.SilkS"))
(pad "1" smd rect (at -1.2 -0.95) (size 0.8 0.55) (layers "F.Cu" "F.Paste" "F.Mask") (solder_mask_margin 0.05) (solder_paste_margin -0.05))
(pad "2" smd rect (at -1.2 0) (size 0.8 0.55) (layers "F.Cu" "F.Paste" "F.Mask") (solder_mask_margin 0.05) (solder_paste_margin -0.05))
(pad "3" smd rect (at -1.2 0.95) (size 0.8 0.55) (layers "F.Cu" "F.Paste" "F.Mask") (solder_mask_margin 0.05) (solder_paste_margin -0.05))
(pad "4" smd rect (at 1.2 0.95) (size 0.8 0.55) (layers "F.Cu" "F.Paste" "F.Mask") (solder_mask_margin 0.05) (solder_paste_margin -0.05))
(pad "5" smd rect (at 1.2 0) (size 0.8 0.55) (layers "F.Cu" "F.Paste" "F.Mask") (solder_mask_margin 0.05) (solder_paste_margin -0.05))
(pad "6" smd rect (at 1.2 -0.95) (size 0.8 0.55) (layers "F.Cu" "F.Paste" "F.Mask") (solder_mask_margin 0.05) (solder_paste_margin -0.05))
)