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74LVC2G07DW-7

Diodes Incorporated · Buffers / Drivers · SOT-363

74LVC2G07DW-7 from Diodes Incorporated, in a SOT-363. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1A input Data input for gate 1; inputs accept up to 5.5V and unused inputs should be held at VCC or ground.
2 GND power_in Ground.
3 2A input Data input for gate 2; inputs accept up to 5.5V and unused inputs should be held at VCC or ground.
4 2Y output Open-drain data output of gate 2 (high-Z when input is high, low when input is low), with maximum sink current of 32mA.
5 VCC power_in Supply voltage, operating range 1.65V to 5.5V.
6 1Y output Open-drain data output of gate 1 (high-Z when input is high, low when input is low), with maximum sink current of 32mA.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-363
Category Logic ICs
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage Range VCC -0.5 6.5 V 3
Input Voltage Range VI -0.5 6.5 V 3
Output Voltage in High Impedance or IOFF State VO -0.5 6.5 V High impedance or IOFF state 3
Output Voltage in High or Low State VO -0.3 5.5 V High or Low state; max printed as VCC+0.5 3
Input Clamp Current IIK -50 mA VI < 0 3
Output Clamp Current IOK -50 mA VO < 0 3
Continuous Output Current IO -50 mA 3
Continuous Current through Vdd or GND -100 100 mA 3
Operating Junction Temperature TJ -40 150 °C 3
Storage Temperature TSTG -65 150 °C 3
Operating Voltage VCC 1.65 5.5 V Operating 3
Operating Voltage Data Retention VCC 1.5 V Data retention only 3
Input Voltage VI 0 5.5 V 3
Output Voltage VO 0 5.5 V max printed as VCC 3
Operating Free-air Temperature TA -40 125 °C 3
Low-Level Output Voltage VOL 0.1 V IOL = 100μA, VCC = 1.65V to 5.5V, -40°C to +85°C 4
Low-Level Output Voltage VOL 0.45 V IOL = 4mA, VCC = 1.65V, -40°C to +85°C 4
Low-Level Output Voltage VOL 0.3 V IOL = 8mA, VCC = 2.3V, -40°C to +85°C 4
Low-Level Output Voltage VOL 0.4 V IOL = 16mA, VCC = 3V, -40°C to +85°C 4
Low-Level Output Voltage VOL 0.55 V IOL = 24mA, VCC = 3V, -40°C to +85°C 4
Low-Level Output Voltage VOL 0.7 V IOL = 4mA, VCC = 1.65V, -40°C to +125°C 4
Low-Level Output Voltage VOL 0.6 V IOL = 16mA, VCC = 3V, -40°C to +125°C 4
Low-Level Output Voltage VOL 0.8 V IOL = 24mA, VCC = 3V, -40°C to +125°C 4
Input Current II -5 5 μA VI = 5.5V or GND, VCC = 0 to 5.5V, -40°C to +85°C 4
Input Current II -20 20 μA VI = 5.5V or GND, VCC = 0 to 5.5V, -40°C to +125°C 4
Z State Leakage Current IOZ -10 10 μA VO = 0 to 5.5V, VCC = 3.6V, -40°C to +85°C 4
Power Down Leakage Current IOFF -10 10 μA VI or VO = 5.5V, VCC = 0V, -40°C to +85°C 4
Power Down Leakage Current IOFF -20 20 μA VI or VO = 5.5V, VCC = 0V, -40°C to +125°C 4
Supply Current ICC 10 μA VI = 5.5V or GND, IO = 0, VCC = 1.65V to 5.5V, -40°C to +85°C 4
Supply Current ICC 40 μA VI = 5.5V or GND, IO = 0, VCC = 1.65V to 5.5V, -40°C to +125°C 4
Additional Supply Current ∆ICC 500 μA Input at VCC -0.6V, VCC = 3V to 5.5V, -40°C to +85°C 4
Additional Supply Current ∆ICC 5000 μA Input at VCC -0.6V, VCC = 3V to 5.5V, -40°C to +125°C 4
Propagation Delay A to Y tPD 0.5 6.7 ns VCC = 1.8V±0.15V, CL = 30 or 50pF, TA = -40°C to +85°C 4
Propagation Delay A to Y tPD 0.5 4.3 ns VCC = 2.5V±0.2V, CL = 30 or 50pF, TA = -40°C to +85°C 4
Propagation Delay A to Y tPD 0.5 3.7 ns VCC = 3.3V±0.3V, CL = 30 or 50pF, TA = -40°C to +85°C 4
Propagation Delay A to Y tPD 0.5 2.9 ns VCC = 5V±0.5V, CL = 30 or 50pF, TA = -40°C to +85°C 4
Propagation Delay A to Y tPD 0.5 8.4 ns VCC = 1.8V±0.15V, CL = 30 or 50pF, TA = -40°C to +125°C 4
Propagation Delay A to Y tPD 0.5 5.5 ns VCC = 2.5V±0.2V, CL = 30 or 50pF, TA = -40°C to +125°C 4
Propagation Delay A to Y tPD 0.5 4.7 ns VCC = 3.3V±0.3V, CL = 30 or 50pF, TA = -40°C to +125°C 4
Input Capacitance CI 3.5 pF VCC = 3.3V, VI = VCC or GND, TA = +25°C 4
Thermal Resistance Junction-to-Ambient θJA 371 °C/W SOT363, FR-4 PC board, 2oz copper, minimum recommended pad layout 4
Thermal Resistance Junction-to-Case θJC 143 °C/W SOT363, FR-4 PC board, 2oz copper, minimum recommended pad layout 4
Power Dissipation Capacitance CPD 3 pF f = 10MHz, VCC = 1.8V, TA = +25°C 5
Power Dissipation Capacitance CPD 4 pF f = 10MHz, VCC = 3.3V, TA = +25°C 5
Power Dissipation Capacitance CPD 6 pF f = 10MHz, VCC = 5V, TA = +25°C 5

CAD (KiCad official)

  • Symbol: 74LVC2G07DW-7
  • Footprint: Package_TO_SOT_SMD:SOT-363_SC-70-6
  • 3D model: SOT-363 (KiCad packages3D, STEP)
  • 3D model files: 74lvc2g07dw-7-etched.step / 74lvc2g07dw-7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 74lvc2g07dw-7.step / 74lvc2g07dw-7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (13 pp, sha256 c281bc51d2007258, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF