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74LVC1G04Z-7
Public Made by Adomby adom
Diodes Incorporated Inverters, SOT-553. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdown74LVC1G04Z-7
Diodes Incorporated · Inverters · SOT-553
74LVC1G04Z-7 from Diodes Incorporated, in a SOT-553. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No connection. |
| 2 | A | input | Data input; tolerates up to 5.5V, and unused inputs should be held at VCC or ground. |
| 3 | GND | power_in | Ground. |
| 4 | Y | output | Data output (push-pull), the inverse of A (Y = A inverted), with IOFF protection disabling the output when powered down. |
| 5 | VCC | power_in | Supply voltage, operating range 1.65V to 5.5V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | SOT-553 |
| Category | Logic |
| Pins | 5 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| High-Level Output Voltage | VOH | 0.95 | V | IOH = -4mA; VCC = 1.65V; TA -40°C to +125°C | 4 | ||
| High-Level Output Voltage | VOH | 1.7 | V | IOH = -8mA; VCC = 2.3V; TA -40°C to +125°C | 4 | ||
| High-Level Output Voltage | VOH | 1.9 | V | IOH = -12mA; VCC = 2.7V; TA -40°C to +125°C | 4 | ||
| High-Level Output Voltage | VOH | 2.2 | V | IOH = -16mA; VCC = 3V; TA -40°C to +125°C | 4 | ||
| High-Level Output Voltage | VOH | 2 | V | IOH = -24mA; VCC = 3V; TA -40°C to +125°C | 4 | ||
| High-Level Output Voltage | VOH | 3.4 | V | IOH = -32mA; VCC = 4.5V; TA -40°C to +125°C | 4 | ||
| Low-Level Output Voltage | VOL | 0.1 | V | IOL = 100µA; VCC = 1.65V to 5.5V; TA -40°C to +125°C | 4 | ||
| Low-Level Output Voltage | VOL | 0.45 | V | IOL = 4mA; VCC = 1.65V; TA -40°C to +125°C | 4 | ||
| Low-Level Output Voltage | VOL | 0.3 | V | IOL = 8mA; VCC = 2.3V; TA -40°C to +125°C | 4 | ||
| Low-Level Output Voltage | VOL | 0.6 | V | IOL = 12mA; VCC = 2.7V; TA -40°C to +125°C | 4 | ||
| Low-Level Output Voltage | VOL | 0.4 | V | IOL = 16mA; VCC = 3V; TA -40°C to +125°C | 4 | ||
| Low-Level Output Voltage | VOL | 0.55 | V | IOL = 24mA; VCC = 3V; TA -40°C to +125°C | 4 | ||
| Input Current | II | -5 | 0.1 | 5 | µA | VI = 5.5V or GND; VCC = 0 to 5.5V; TA -40°C to +125°C | 4 |
| Power Down Leakage Current | IOFF | -10 | 10 | µA | VI or VO = 5.5V; VCC = 0V; TA -40°C to +125°C | 4 | |
| Supply Current | ICC | 0.1 | 10 | µA | VI = 5.5V or GND; IO = 0; VCC = 5.5V; TA -40°C to +125°C | 4 | |
| Additional Supply Current | ΔICC | 5000 | µA | Input at VCC -0.6V; VCC = 3V to 5.5V; TA -40°C to +125°C | 4 | ||
| Propagation Delay A or B to Y | tpd | 1 | 3 | 9.5 | ns | VCC = 1.8V ±0.15V; TA -40°C to +125°C; typ at TA +25°C | 5 |
| Propagation Delay A or B to Y | tpd | 0.5 | 2 | 6.5 | ns | VCC = 2.5V ±0.2V; TA -40°C to +125°C; typ at TA +25°C | 5 |
| Propagation Delay A or B to Y | tpd | 0.5 | 2.3 | 7 | ns | VCC = 2.7V; TA -40°C to +125°C; typ at TA +25°C | 5 |
| Propagation Delay A or B to Y | tpd | 0.5 | 2 | 5.5 | ns | VCC = 3.3V ±0.3V; TA -40°C to +125°C; typ at TA +25°C | 5 |
| Propagation Delay A or B to Y | tpd | 0.5 | 1.6 | 5 | ns | VCC = 5.0V ±0.5V; TA -40°C to +125°C; typ at TA +25°C | 5 |
| Operating Voltage | VCC | 1.65 | 5.5 | V | Operating | 3 | |
| Data Retention Voltage | VCC | 1.5 | V | Data retention only | 3 | ||
| High-Level Input Voltage | VIH | 1.7 | V | VCC = 2.3V to 2.7V | 3 | ||
| High-Level Input Voltage | VIH | 2 | V | VCC = 3V to 3.6V | 3 | ||
| Low-Level Input Voltage | VIL | 0.7 | V | VCC = 2.3V to 2.7V | 3 | ||
| Low-Level Input Voltage | VIL | 0.8 | V | VCC = 3V to 3.6V | 3 | ||
| Input Voltage | VI | 0 | 5.5 | V | 3 | ||
| High-Level Output Current | IOH | -4 | mA | VCC = 1.65V | 3 | ||
| High-Level Output Current | IOH | -8 | mA | VCC = 2.3V | 3 | ||
| High-Level Output Current | IOH | -12 | mA | VCC = 2.7V | 3 | ||
| High-Level Output Current | IOH | -16 | mA | VCC = 3V | 3 | ||
| High-Level Output Current | IOH | -24 | mA | VCC = 3V | 3 | ||
| High-Level Output Current | IOH | -32 | mA | VCC = 4.5V | 3 | ||
| Low-Level Output Current | IOL | 4 | mA | VCC = 1.65V | 3 | ||
| Low-Level Output Current | IOL | 8 | mA | VCC = 2.3V | 3 | ||
| Low-Level Output Current | IOL | 12 | mA | VCC = 2.7V | 3 | ||
| Low-Level Output Current | IOL | 16 | mA | VCC = 3V | 3 | ||
| Low-Level Output Current | IOL | 24 | mA | VCC = 3V | 3 | ||
| Low-Level Output Current | IOL | 32 | mA | VCC = 4.5V | 3 | ||
| Input Transition Rise or Fall Rate | Δt/ΔV | 20 | ns/V | VCC = 1.8V ±0.15V, 2.5V ±0.2V | 3 | ||
| Input Transition Rise or Fall Rate | Δt/ΔV | 10 | ns/V | VCC = 3.3V ±0.3V | 3 | ||
| Input Transition Rise or Fall Rate | Δt/ΔV | 5 | ns/V | VCC = 5V ±0.5V | 3 | ||
| Operating Free-Air Temperature | TA | -40 | 125 | °C | 3 | ||
| Supply Voltage Range | VCC | -0.5 | 6.5 | V | 3 | ||
| Input Voltage Range | VI | -0.5 | 6.5 | V | 3 | ||
| Voltage Applied to Output in High Impedance or IOFF State | VO | -0.5 | 6.5 | V | 3 | ||
| Voltage Applied to Output in High or Low State | VO | -0.5 | V | Printed maximum is VCC + 0.5 V (not numeric) | 3 | ||
| Input Clamp Current | IIK | -50 | mA | VI < 0 | 3 | ||
| Output Clamp Current | IOK | -50 | mA | 3 | |||
| Continuous Output Current | IO | -50 | 50 | mA | 3 | ||
| Continuous Current Through VCC or GND | ICC, IGN | -100 | 100 | mA | 3 | ||
| Operating Junction Temperature | TJ | -40 | 150 | °C | 3 | ||
| Storage Temperature | TSTG | -65 | 150 | °C | 3 | ||
| ESD Human Body Model Protection | ESD HBM | 2 | kV | 3 | |||
| ESD Charged Device Model Protection | ESD CDM | 1 | kV | 3 | |||
| ESD Machine Model Protection | ESD MM | 200 | V | 3 | |||
| Thermal Resistance Junction-to-Ambient (SOT553) | θJA | 231 | °C/W | Note 10: FR-4 PCB, 2oz copper, minimum recommended pad layout | 4 | ||
| Thermal Resistance Junction-to-Case (SOT553) | θJC | 105 | °C/W | Note 10: FR-4 PCB, 2oz copper, minimum recommended pad layout | 4 |
CAD (KiCad official)
- Symbol:
74LVC1G04Z-7 - Footprint:
Package_TO_SOT_SMD:SOT-553 - 3D model: SOT-553 (KiCad packages3D, STEP)
- 3D model files:
74lvc1g04z-7-etched.step/74lvc1g04z-7-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);74lvc1g04z-7.step/74lvc1g04z-7.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Diodes Incorporated datasheet (16 pp, sha256
bd8d1ceb6035a261, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).