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Contents

README

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74HC4051N

HGSEMI · Analog Switches, Multiplexers · DIP-16

74HC4051N from HGSEMI, in a DIP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Y4 bidirectional Independent analog input/output channel 4, which connects to common Z when selected by A0-A2 with E low; analog voltage must stay between VEE and VDD and switch current is limited to ±10 mA.
2 Y6 bidirectional Independent analog input/output channel 6, which connects to common Z when selected by A0-A2 with E low; analog voltage must stay between VEE and VDD and switch current is limited to ±10 mA.
3 Z bidirectional Common analog input/output that connects to whichever Y channel is selected; Y and Z voltages must not exceed VDD or fall below VEE, and switch current is limited to ±10 mA.
4 Y7 bidirectional Independent analog input/output channel 7, which connects to common Z when selected by A0-A2 with E low; analog voltage must stay between VEE and VDD and switch current is limited to ±10 mA.
5 Y5 bidirectional Independent analog input/output channel 5, which connects to common Z when selected by A0-A2 with E low; analog voltage must stay between VEE and VDD and switch current is limited to ±10 mA.
6 E input Active-low enable input; when driven high, all switches are turned off (high impedance) and A0-A2 are ignored, while the datasheet's absolute maximum input voltage is VDD+0.5 V relative to VSS.
7 VEE power_in Negative power supply; the datasheet limits VDD−VEE to 9 V maximum and VEE to −12 V to +0.5 V (referenced to the supply) in absolute maximum ratings.
8 VSS power_in Ground reference for the digital control inputs (A0-A2 and E); when the device is used as a digital multiplexer, VEE and VSS are tied together, typically to ground.
9 A2 input Channel select input bit 2 (most significant) that, with A1 and A0, selects one of Y0-Y7 when E is low; the datasheet notes these inputs must not be changed to switch channels while E is high because they are ignored.
10 A1 input Channel select input bit 1 that, with A2 and A0, selects one of Y0-Y7 when E is low; digital input range is 0 V to VDD.
11 A0 input Channel select input bit 0 (least significant) that, with A2 and A1, selects one of Y0-Y7 when E is low; digital input range is 0 V to VDD.
12 Y3 bidirectional Independent analog input/output channel 3, which connects to common Z when selected by A0-A2 with E low; analog voltage must stay between VEE and VDD and switch current is limited to ±10 mA.
13 Y0 bidirectional Independent analog input/output channel 0, which connects to common Z when selected by A0-A2 with E low; analog voltage must stay between VEE and VDD and switch current is limited to ±10 mA.
14 Y1 bidirectional Independent analog input/output channel 1, which connects to common Z when selected by A0-A2 with E low; analog voltage must stay between VEE and VDD and switch current is limited to ±10 mA.
15 Y2 bidirectional Independent analog input/output channel 2, which connects to common Z when selected by A0-A2 with E low; analog voltage must stay between VEE and VDD and switch current is limited to ±10 mA.
16 VDD power_in Positive power supply; the datasheet specifies VDD−VEE of 3.0 V to 9.0 V, with absolute maximum VDD of −0.5 V to +12 V.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package DIP-16
Category Interface
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Positive supply voltage VDD VDD -0.5 12 V Tamb=25℃ unless otherwise specified 5
Negative supply voltage VEE VEE -12 0.5 V Referenced to power supply, as printed 5
Input voltage range VI -0.5 V Upper limit printed as VDD+0.5 V (not numeric) 5
Switch on-state current I -10 10 mA 5
Power dissipation (DIP16) PD 700 mW DIP16, Tamb -40℃~+85℃ 5
Power dissipation per output Po 100 mW 5
Operating ambient temperature Tamb -40 85 ℃ 5
Storage temperature Tstg -65 150 ℃ 5
Soldering temperature (DIP) TL 245 ℃ 10 s, DIP package 5
Supply voltage VDD (recommended) VDD 3 5 9 V Tamb=25℃; RL=10kΩ; CL=50pF; Vis=VDD=5V (square wave) 5
Supply voltage VEE (recommended) VEE -6 0 V Tamb=25℃; RL=10kΩ; CL=50pF; Vis=VDD=5V (square wave) 5
Supply voltage VDD-VEE (recommended) VDD-VEE 3 9 V Tamb=25℃; RL=10kΩ; CL=50pF; Vis=VDD=5V (square wave) 5
Input voltage (recommended) VI 0 V Upper limit printed as VDD (not numeric) 5
Output disable time (high to off) tPHZ 85 170 ns E→Z or E→Yn 5
Output disable time (low to off) tPLZ 115 230 ns E→Z or E→Yn 5
Output enable time (off to high/low) tPZH, tPZL 40 80 ns E→Z or E→Yn 5
Propagation delay Z→Yn / Yn→Z tPHL, tPLH 15 30 ns VDD=5V; E=VSS; Vis=VDD (square wave); Tamb=25℃ 7
Propagation delay Z→Yn / Yn→Z tPHL, tPLH 5 10 ns VDD=9V; E=VSS; Vis=VDD (square wave); Tamb=25℃ 7
Propagation delay An→Yn / An→Z (high to low) tPHL 150 300 ns VDD=5V; E=VSS; An=VDD (square wave) 7
Propagation delay An→Yn / An→Z (high to low) tPHL 60 120 ns VDD=9V; E=VSS; An=VDD (square wave) 7
Propagation delay An→Yn / An→Z (low to high) tPLH 150 300 ns VDD=5V; E=VSS; An=VDD (square wave); Vis=VDD 7
Propagation delay An→Yn / An→Z (low to high) tPLH 65 130 ns VDD=9V; E=VSS; An=VDD (square wave); Vis=VDD 7
Output disable time E→Yn/Z (high to off) tPHZ 120 240 ns VDD=5V; E=VDD (square wave); Vis=VDD 7
Output disable time E→Yn/Z (high to off) tPHZ 90 180 ns VDD=9V; E=VDD (square wave); Vis=VDD 7
Output disable time E→Yn/Z (low to off) tPLZ 145 290 ns VDD=5V; E=VDD (square wave); Vis=VEE 7
Output disable time E→Yn/Z (low to off) tPLZ 120 240 ns VDD=9V; E=VDD (square wave); Vis=VEE 7
Output enable time E→Yn/Z (off to high) tPZH 140 280 ns VDD=5V; E=VDD (square wave); Vis=VDD 7
Output enable time E→Yn/Z (off to high) tPZH 55 110 ns VDD=9V; E=VDD (square wave); Vis=VDD 7
Output enable time E→Yn/Z (off to low) tPZL 140 280 ns VDD=5V; E=VDD (square wave); Vis=VEE 7
Output enable time E→Yn/Z (off to low) tPZL 55 110 ns VDD=9V; E=VDD (square wave); Vis=VEE 8
Quiescent supply current IDD 20 µA Tamb=25℃; VI=VDD or VSS, IO=0A; VDD=5V 6
Quiescent supply current IDD 40 µA Tamb=25℃; VI=VDD or VSS, IO=0A; VDD=9V 6
High-level input voltage VIH 3.5 V Tamb=25℃; /IO/<1µA; VDD=5V, VO=0.5V or 4.5V 6
High-level input voltage VIH 7 V Tamb=25℃; /IO/<1µA; VDD=9V, VO=0.5V or 8V 6
Low-level input voltage VIL 1.5 V Tamb=25℃; /IO/<1µA; VDD=5V, VO=0.5V or 4.5V 6
Low-level input voltage VIL 3 V Tamb=25℃; /IO/<1µA; VDD=9V, VO=0.5V or 8V 6
Input leakage current ILI 0.3 µA Tamb=25℃; VI=0V or 9V, VDD=9V 6
3-state output leakage current (to VDD) IOZ 1.6 µA Tamb=25℃; VDD=9V; output to VDD 6
3-state output leakage current (to VSS) IOZ -1.6 µA Tamb=25℃; VDD=9V; output to VSS 6
Off-state leakage current (all channels off) IL(OFF) 1000 nA Tamb=25℃; VSS=VEE; VDD-VEE=9V; all channels off; E=VDD 6
Off-state leakage current (any channel off) IL(OFF) 200 nA Tamb=25℃; VSS=VEE; VDD-VEE=9V; any channel off; E=VSS 6
On-resistance RON 350 2500 Ω Tamb=25℃; Vis=0V~VDD-VEE; VDD-VEE=5V 6
On-resistance RON 80 245 Ω Tamb=25℃; Vis=0V~VDD-VEE; VDD-VEE=9V 6
On-resistance RON 115 340 Ω Tamb=25℃; Vis=0V; VDD-VEE=5V 6
On-resistance RON 50 160 Ω Tamb=25℃; Vis=0V; VDD-VEE=9V 6
On-resistance RON 120 365 Ω Tamb=25℃; Vis=VDD-VEE; VDD-VEE=5V 6
On-resistance RON 65 200 Ω Tamb=25℃; Vis=VDD-VEE; VDD-VEE=9V 6
On-resistance change between any two channels ΔRON 25 Ω Tamb=25℃; Vis=0V~VDD-VEE; VDD-VEE=5V 6
On-resistance change between any two channels ΔRON 10 Ω Tamb=25℃; Vis=0V~VDD-VEE; VDD-VEE=9V 6
Quiescent supply current IDD 150 µA Tamb=85℃; VI=VDD or VSS, IO=0A; VDD=5V 7
Quiescent supply current IDD 300 µA Tamb=85℃; VI=VDD or VSS, IO=0A; VDD=9V 7
High-level input voltage VIH 3.5 V Tamb=85℃; /IO/<1µA; VDD=5V, VO=0.5V or 4.5V 7
High-level input voltage VIH 7 V Tamb=85℃; /IO/<1µA; VDD=9V, VO=0.5V or 8V 7
Low-level input voltage VIL 1.5 V Tamb=85℃; /IO/<1µA; VDD=5V, VO=0.5V or 4.5V 7
Low-level input voltage VIL 3 V Tamb=85℃; /IO/<1µA; VDD=9V, VO=0.5V or 8V 7
Input leakage current ILI 1 µA Tamb=85℃; VI=0V or 9V, VDD=9V 7
3-state output leakage current (to VDD) IOZ 12 µA Tamb=85℃; VDD=9V; output to VDD 7
3-state output leakage current (to VSS) IOZ -12 µA Tamb=85℃; VDD=9V; output to VSS 7
Digital input capacitance Ci 7.5 pF 6
Crosstalk between channels Vct 50 mV RL=10kΩ; CL=15pF; E or An=VDD (square wave); VDD=9V 8

CAD (KiCad official)

  • Symbol: 74HC4051N
  • Footprint: Package_DIP:DIP-16_W7.62mm
  • 3D model: DIP-16 (KiCad packages3D, STEP)
  • 3D model files: 74hc4051n-etched.step / 74hc4051n-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 74hc4051n.step / 74hc4051n.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (16 pp, sha256 e76afd9e53c61c06, retrieved 2026-10-19, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF