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74HC2G32DP

Nexperia · Logic Gates · TSSOP-8

74HC2G32DP from Nexperia, in a TSSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1A input Data input for gate 1; inputs include clamp diodes so current-limiting resistors can interface them to voltages above VCC, with the input voltage range 0 V to VCC and input clamping current limited to ±20 mA.
2 1B input Data input for gate 1; inputs include clamp diodes so current-limiting resistors can interface them to voltages above VCC, with the input voltage range 0 V to VCC and input clamping current limited to ±20 mA.
3 2Y output Data output of gate 2; the output voltage range is 0 V to VCC and the output current is limited to 25 mA.
4 GND power_in Ground (0 V) reference for all voltages on the device.
5 2A input Data input for gate 2; inputs include clamp diodes so current-limiting resistors can interface them to voltages above VCC, with the input voltage range 0 V to VCC and input clamping current limited to ±20 mA.
6 2B input Data input for gate 2; inputs include clamp diodes so current-limiting resistors can interface them to voltages above VCC, with the input voltage range 0 V to VCC and input clamping current limited to ±20 mA.
7 1Y output Data output of gate 1; the output voltage range is 0 V to VCC and the output current is limited to 25 mA.
8 VCC power_in Supply voltage: 2.0 V to 6.0 V for 74HC2G32 and 4.5 V to 5.5 V for 74HCT2G32 per recommended operating conditions, with an absolute maximum of 7.0 V.

Key specifications

Parameter Value
Manufacturer Nexperia
Package TSSOP-8
Category Logic
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
supply voltage VCC -0.5 7 V 3
input clamping current IIK -20 20 mA VI < -0.5 V or VI > VCC + 0.5 V 3
output clamping current IOK -20 20 mA VO < -0.5 V or VO > VCC + 0.5 V 3
output current IO 25 mA VO = -0.5 V to (VCC + 0.5 V) 3
supply current ICC 50 mA 3
ground current IGND -50 mA 3
storage temperature Tstg -65 150 °C 3
dynamic power dissipation PD 250 mW Tamb = -40 °C to +125 °C 3
supply voltage VCC 2 5 6 V 74HC2G32 3
input voltage VI 0 V 3
output voltage VO 0 V 3
ambient temperature Tamb -40 25 125 °C 3
input transition rise and fall rate Δt/ΔV 625 ns/V VCC = 2.0 V 3
input transition rise and fall rate Δt/ΔV 1.67 139 ns/V VCC = 4.5 V 3
input transition rise and fall rate Δt/ΔV 83 ns/V VCC = 6.0 V 3
HIGH-level input voltage VIH 1.5 1.2 V VCC = 2.0 V; Tamb = 25 °C 3
HIGH-level input voltage VIH 1.5 V VCC = 2.0 V; Tamb = -40 °C to +125 °C 3
HIGH-level input voltage VIH 3.15 2.4 V VCC = 4.5 V; Tamb = 25 °C 3
HIGH-level input voltage VIH 3.15 V VCC = 4.5 V; Tamb = -40 °C to +125 °C 3
HIGH-level input voltage VIH 4.2 3.2 V VCC = 6.0 V; Tamb = 25 °C 3
HIGH-level input voltage VIH 4.2 V VCC = 6.0 V; Tamb = -40 °C to +125 °C 3
LOW-level input voltage VIL 0.8 0.5 V VCC = 2.0 V; Tamb = 25 °C 3
LOW-level input voltage VIL 0.5 V VCC = 2.0 V; Tamb = -40 °C to +125 °C 3
LOW-level input voltage VIL 2.1 1.35 V VCC = 4.5 V; Tamb = 25 °C 3
LOW-level input voltage VIL 1.35 V VCC = 4.5 V; Tamb = -40 °C to +125 °C 3
LOW-level input voltage VIL 2.8 1.8 V VCC = 6.0 V; Tamb = 25 °C 3
LOW-level input voltage VIL 1.8 V VCC = 6.0 V; Tamb = -40 °C to +125 °C 3
HIGH-level output voltage VOH 1.9 2 V VI = VIH or VIL; IO = -20 μA; VCC = 2.0 V; Tamb = 25 °C 3
HIGH-level output voltage VOH 1.9 V VI = VIH or VIL; IO = -20 μA; VCC = 2.0 V; Tamb = -40 °C to +125 °C 4
HIGH-level output voltage VOH 4.4 4.5 V VI = VIH or VIL; IO = -20 μA; VCC = 4.5 V; Tamb = 25 °C 4
HIGH-level output voltage VOH 4.4 V VI = VIH or VIL; IO = -20 μA; VCC = 4.5 V; Tamb = -40 °C to +125 °C 4
HIGH-level output voltage VOH 5.9 6 V VI = VIH or VIL; IO = -20 μA; VCC = 6.0 V; Tamb = 25 °C 4
HIGH-level output voltage VOH 5.9 V VI = VIH or VIL; IO = -20 μA; VCC = 6.0 V; Tamb = -40 °C to +125 °C 4
HIGH-level output voltage VOH 4.18 4.32 V VI = VIH or VIL; IO = -4.0 mA; VCC = 4.5 V; Tamb = 25 °C 4
HIGH-level output voltage VOH 3.7 V VI = VIH or VIL; IO = -4.0 mA; VCC = 4.5 V; Tamb = -40 °C to +125 °C 4
HIGH-level output voltage VOH 5.68 5.81 V VI = VIH or VIL; IO = -5.2 mA; VCC = 6.0 V; Tamb = 25 °C 4
HIGH-level output voltage VOH 5.2 V VI = VIH or VIL; IO = -5.2 mA; VCC = 6.0 V; Tamb = -40 °C to +125 °C 4
LOW-level output voltage VOL 0 0.1 V VI = VIH or VIL; IO = 20 μA; VCC = 2.0 V; Tamb = 25 °C 4
LOW-level output voltage VOL 0.1 V VI = VIH or VIL; IO = 20 μA; VCC = 2.0 V; Tamb = -40 °C to +125 °C 4
LOW-level output voltage VOL 0.15 0.26 V VI = VIH or VIL; IO = 4.0 mA; VCC = 4.5 V; Tamb = 25 °C 4
LOW-level output voltage VOL 0.4 V VI = VIH or VIL; IO = 4.0 mA; VCC = 4.5 V; Tamb = -40 °C to +125 °C 4
LOW-level output voltage VOL 0.16 0.26 V VI = VIH or VIL; IO = 5.2 mA; VCC = 6.0 V; Tamb = 25 °C 4
input leakage current II -1 1 μA VI = VCC or GND; VCC = 6.0 V; Tamb = -40 °C to +125 °C 4
supply current ICC 20 μA VI = VCC or GND; IO = 0 A; VCC = 6.0 V; Tamb = -40 °C to +125 °C 4
propagation delay nA, nB to nY tpd 24 75 ns VCC = 2.0 V; see Fig. 4; Tamb = 25 °C 5
propagation delay nA, nB to nY tpd 110 ns VCC = 2.0 V; see Fig. 4; Tamb = -40 °C to +125 °C 5
propagation delay nA, nB to nY tpd 9 15 ns VCC = 4.5 V; see Fig. 4; Tamb = 25 °C 5
propagation delay nA, nB to nY tpd 22 ns VCC = 4.5 V; see Fig. 4; Tamb = -40 °C to +125 °C 5
propagation delay nA, nB to nY tpd 7 13 ns VCC = 6.0 V; see Fig. 4; Tamb = 25 °C 5
propagation delay nA, nB to nY tpd 20 ns VCC = 6.0 V; see Fig. 4; Tamb = -40 °C to +125 °C 5
transition time nY tt 18 75 ns VCC = 2.0 V; see Fig. 4; Tamb = 25 °C 5
transition time nY tt 125 ns VCC = 2.0 V; see Fig. 4; Tamb = -40 °C to +125 °C 5
transition time nY tt 6 15 ns VCC = 4.5 V; see Fig. 4; Tamb = 25 °C 5
transition time nY tt 25 ns VCC = 4.5 V; see Fig. 4; Tamb = -40 °C to +125 °C 5
transition time nY tt 20 ns VCC = 6.0 V; see Fig. 4; Tamb = -40 °C to +125 °C 5

CAD (KiCad official)

  • Symbol: 74HC2G32DP
  • Footprint: Package_SO:TSSOP-8_3x3mm_P0.65mm
  • 3D model: TSSOP-8 (KiCad packages3D, STEP)
  • 3D model files: 74hc2g32dp-etched.step / 74hc2g32dp-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 74hc2g32dp.step / 74hc2g32dp.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (11 pp, sha256 18680a461bd2c4b2, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF