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74HC245BM

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HGSEMI Buffers, Drivers, Receivers, Transceivers, SOP-20-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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74HC245BM

HGSEMI · Buffers, Drivers, Receivers, Transceivers · SOP-20-300mil

74HC245BM from HGSEMI, in a SOP-20-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 DIR input Transmission direction control that selects the direction of data transfer between the A and B ports, as defined in the truth table.
2 A0 bidirectional Data input/output on the A bus; positive-logic tri-state outputs.
3 A1 bidirectional Data input/output on the A bus; positive-logic tri-state outputs.
4 A2 bidirectional Data input/output on the A bus; positive-logic tri-state outputs.
5 A3 bidirectional Data input/output on the A bus; positive-logic tri-state outputs.
6 A4 bidirectional Data input/output on the A bus; positive-logic tri-state outputs.
7 A5 bidirectional Data input/output on the A bus; positive-logic tri-state outputs.
8 A6 bidirectional Data input/output on the A bus; positive-logic tri-state outputs.
9 A7 bidirectional Data input/output on the A bus; positive-logic tri-state outputs.
10 GND power_in Ground (0 V) reference.
11 B7 bidirectional Data input/output on the B bus; positive-logic tri-state outputs.
12 B6 bidirectional Data input/output on the B bus; positive-logic tri-state outputs.
13 B5 bidirectional Data input/output on the B bus; positive-logic tri-state outputs.
14 B4 bidirectional Data input/output on the B bus; positive-logic tri-state outputs.
15 B3 bidirectional Data input/output on the B bus; positive-logic tri-state outputs.
16 B2 bidirectional Data input/output on the B bus; positive-logic tri-state outputs.
17 B1 bidirectional Data input/output on the B bus; positive-logic tri-state outputs.
18 B0 bidirectional Data input/output on the B bus; positive-logic tri-state outputs.
19 OE input Active-low output enable; when high, the A and B ports are placed in high impedance (Z). The overline is lost in the text extraction, so the name is shown without it.
20 VCC power_in Power supply voltage; recommended operating range 2.0 V to 6.0 V, absolute maximum 7.0 V.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-20-300mil
Category Logic
Pins 20

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage (absolute maximum) VCC -0.5 7 V 4
Input clamp current Ilk -20 20 mA VI<-0.5V or VI>Vcc+0.5V 4
Output clamp current Iok -20 20 mA Vo<-0.5V or Vo>Vcc+0.5V 4
Output or input/output current Io -35 35 mA -0.5V<Vo<Vcc+0.5V 4
VCC or GND current ICC,IGND -70 70 mA 4
Storage temperature Tstg -65 150 ℃ 4
Power dissipation (SOP-20W package) PD 500 mW SOP-20W package 4
Soldering temperature TL 245 ℃ 10 s, SOP 4
Supply voltage VCC 2 5 6 V 4
Input voltage VI 0 V 4
Output voltage Vo 0 V 4
Operating ambient temperature Tamb -40 85 ℃ 4
Input rise and fall time tr ,tf 625 ns VCC=2.0V 4
Input rise and fall time tr ,tf 139 ns VCC=4.5V 4
Input rise and fall time tr ,tf 83 ns VCC=6.0V 4
High-level input voltage VIH 1.5 1.2 V Tamb=25℃, GND=0; VCC=2.0V 4
High-level input voltage VIH 3.15 2.4 V Tamb=25℃, GND=0; VCC=4.5V 4
High-level input voltage VIH 4.2 3.2 V Tamb=25℃, GND=0; VCC=6.0V 4
Low-level input voltage VIL 0.8 0.5 V Tamb=25℃, GND=0; VCC=2.0V 4
Low-level input voltage VIL 2.1 1.35 V Tamb=25℃, GND=0; VCC=4.5V 4
Low-level input voltage VIL 2.8 1.8 V Tamb=25℃, GND=0; VCC=6.0V 4
High-level output voltage VOH 1.9 2 V Tamb=25℃, GND=0; VI=VIH or VIL, VCC=2.0V, IO=-20uA 4
High-level output voltage VOH 4.4 4.5 V Tamb=25℃, GND=0; VI=VIH or VIL, VCC=4.5V, IO=-20uA 4
High-level output voltage VOH 5.9 6 V Tamb=25℃, GND=0; VI=VIH or VIL, VCC=6.0V, IO=-20uA 5
High-level output voltage VOH 3.98 4.32 V Tamb=25℃, GND=0; VI=VIH or VIL, VCC=4.5V, IO=-6.0mA 5
High-level output voltage VOH 5.48 5.81 V Tamb=25℃, GND=0; VI=VIH or VIL, VCC=6.0V, IO=-4mA 5
Low-level output voltage VOL 0 0.1 V Tamb=25℃, GND=0; VI=VIH or VIL, VCC=2.0V, IO=20uA 5
Low-level output voltage VOL 0.15 0.26 V Tamb=25℃, GND=0; VI=VIH or VIL, VCC=4.5V, IO=6.0mA 5
Low-level output voltage VOL 0.16 0.26 V Tamb=25℃, GND=0; VI=VIH or VIL, VCC=6.0V, IO=4mA 5
Input leakage current ILI -1 0.1 1 uA Tamb=25℃, GND=0; VI=VCC or GND, VCC=6.0V 5
Off-state output current IOZ -0.5 0.5 uA Tamb=25℃, GND=0; VI=VIH or VIL, Vo=VCC or GND, VCC=6.0V 5
Quiescent supply current ICC -1 10 uA Tamb=25℃, GND=0; VI=VCC or GND, VCC=6.0V, IO=0 5
High-level input voltage VIH 1.5 V Tamb=-40 to +85℃, GND=0; VCC=2.0V 5
High-level input voltage VIH 3.15 V Tamb=-40 to +85℃, GND=0; VCC=4.5V 5
High-level input voltage VIH 4.2 V Tamb=-40 to +85℃, GND=0; VCC=6.0V 5
Low-level input voltage VIL 0.5 V Tamb=-40 to +85℃, GND=0; VCC=2.0V 5
Low-level input voltage VIL 1.35 V Tamb=-40 to +85℃, GND=0; VCC=4.5V 5
Low-level input voltage VIL 1.8 V Tamb=-40 to +85℃, GND=0; VCC=6.0V 5
High-level output voltage VOH 1.9 V Tamb=-40 to +85℃, GND=0; VI=VIH or VIL, VCC=2.0V, IO=-20uA 5
High-level output voltage VOH 4.4 V Tamb=-40 to +85℃, GND=0; VI=VIH or VIL, VCC=4.5V, IO=-20uA 5
High-level output voltage VOH 5.9 V Tamb=-40 to +85℃, GND=0; VI=VIH or VIL, VCC=6.0V, IO=-20uA 5
High-level output voltage VOH 3.84 V Tamb=-40 to +85℃, GND=0; VI=VIH or VIL, VCC=4.5V, IO=-6.0mA 5
High-level output voltage VOH 5.34 V Tamb=-40 to +85℃, GND=0; VI=VIH or VIL, VCC=6.0V, IO=-7.8mA 5
Low-level output voltage VOL 0.1 V Tamb=-40 to +85℃, GND=0; VI=VIH or VIL, VCC=2.0V, IO=20uA 5
Low-level output voltage VOL 0.33 V Tamb=-40 to +85℃, GND=0; VI=VIH or VIL, VCC=4.5V, IO=6.0mA 5
Input leakage current ILI -1 1 uA Tamb=-40 to +85℃, GND=0; VI=VCC or GND, VCC=6.0V 5
Off-state output current IOZ -5 5 uA Tamb=-40 to +85℃, GND=0; VI=VIH or VIL, Vo=VCC or GND, VCC=6.0V 5
Quiescent supply current ICC 80 uA Tamb=-40 to +85℃, GND=0; VI=VCC or GND, VCC=6.0V, IO=0 5
Propagation delay An to Bn or Bn to An tPHL/tPLH 25 900 ns Tamb=25℃, GND=0, tr=tf=6.0ns, CL=50pF; VCC=2.0V, see Fig.4 6
Propagation delay An to Bn or Bn to An tPHL/tPLH 9 18 ns Tamb=25℃, GND=0, tr=tf=6.0ns, CL=50pF; VCC=4.5V, see Fig.4 6
Propagation delay An to Bn or Bn to An tPHL/tPLH 7 15 ns Tamb=25℃, GND=0, tr=tf=6.0ns, CL=50pF; VCC=6.0V, see Fig.4 6
Propagation delay An to Bn or Bn to An tPHL/tPLH 115 ns Tamb=-40 to +85℃, GND=0, tr=tf=6.0ns, CL=50pF; VCC=2.0V, see Fig.4 7
Propagation delay An to Bn or Bn to An tPHL/tPLH 23 ns Tamb=-40 to +85℃, GND=0, tr=tf=6.0ns, CL=50pF; VCC=4.5V, see Fig.4 7
Propagation delay An to Bn or Bn to An tPHL/tPLH 20 ns Tamb=-40 to +85℃, GND=0, tr=tf=6.0ns, CL=50pF; VCC=6.0V, see Fig.4 7

CAD (KiCad official)

  • Symbol: 74HC245BM
  • Footprint: Package_SO:SOP-20_7.5x12.8mm_P1.27mm
  • 3D model: SOP-20-300mil, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 2.65 mm nominal SOIC height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: 74hc245bm-etched.step / 74hc245bm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 74hc245bm.step / 74hc245bm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (13 pp, sha256 3809a15d1ae8f70c, retrieved 2026-10-19, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF