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74HC244DRG

HANSCHIP semiconductor · Buffers, Drivers, Receivers, Transceivers · SOP-20

74HC244DRG from HANSCHIP semiconductor, in a SOP-20. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1OE input Active-LOW output enable for outputs 1Y0 to 1Y3; a HIGH on this input forces those outputs into the high-impedance OFF-state.
2 1A0 input Data input for the first buffer of the 1OE group, with clamp diodes that allow current-limiting resistors for interfacing to voltages above VCC.
3 2Y0 tri_state Non-inverting 3-state bus output of the 2OE group, high-impedance when 2OE is HIGH.
4 1A1 input Data input for the second buffer of the 1OE group, with clamp diodes that allow current-limiting resistors for interfacing to voltages above VCC.
5 2Y1 tri_state Non-inverting 3-state bus output of the 2OE group, high-impedance when 2OE is HIGH.
6 1A2 input Data input for the third buffer of the 1OE group, with clamp diodes that allow current-limiting resistors for interfacing to voltages above VCC.
7 2Y2 tri_state Non-inverting 3-state bus output of the 2OE group, high-impedance when 2OE is HIGH.
8 1A3 input Data input for the fourth buffer of the 1OE group, with clamp diodes that allow current-limiting resistors for interfacing to voltages above VCC.
9 2Y3 tri_state Non-inverting 3-state bus output of the 2OE group, high-impedance when 2OE is HIGH.
10 GND power_in Ground reference (0 V).
11 2A3 input Data input for the fourth buffer of the 2OE group, with clamp diodes that allow current-limiting resistors for interfacing to voltages above VCC.
12 1Y3 tri_state Non-inverting 3-state bus output of the 1OE group, high-impedance when 1OE is HIGH.
13 2A2 input Data input for the third buffer of the 2OE group, with clamp diodes that allow current-limiting resistors for interfacing to voltages above VCC.
14 1Y2 tri_state Non-inverting 3-state bus output of the 1OE group, high-impedance when 1OE is HIGH.
15 2A1 input Data input for the second buffer of the 2OE group, with clamp diodes that allow current-limiting resistors for interfacing to voltages above VCC.
16 1Y1 tri_state Non-inverting 3-state bus output of the 1OE group, high-impedance when 1OE is HIGH.
17 2A0 input Data input for the first buffer of the 2OE group, with clamp diodes that allow current-limiting resistors for interfacing to voltages above VCC.
18 1Y0 tri_state Non-inverting 3-state bus output of the 1OE group, high-impedance when 1OE is HIGH.
19 2OE input Active-LOW output enable for outputs 2Y0 to 2Y3; a HIGH on this input forces those outputs into the high-impedance OFF-state.
20 VCC power_in Supply voltage; 2.0 V to 6.0 V for 74HC244 and 4.5 V to 5.5 V for 74HCT244 per recommended operating conditions.

Key specifications

Parameter Value
Manufacturer HANSCHIP semiconductor
Package SOP-20
Category Logic
Pins 20

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
supply voltage VCC -0.5 7 V 4
input clamping current IIK -20 20 mA VI < -0.5V or VI > VCC+0.5V 4
output clamping current IOK -20 20 mA VO < -0.5V or VO > VCC+0.5V 4
output current IO -35 35 mA -0.5V < VO < VCC+0.5V 4
supply current ICC 70 mA 4
ground current IGND -70 mA 4
storage temperature Tstg -65 150 ℃ 4
total power dissipation Ptot 500 mW 4
soldering temperature TL 245 ℃ 10s 4
supply voltage (74HC244) VCC 2 5 6 V 4
input transition rise and fall rate Δt/ΔV 625 ns/V VCC=2.0V 4
input transition rise and fall rate Δt/ΔV 1.67 139 ns/V VCC=4.5V 4
input transition rise and fall rate Δt/ΔV 83 ns/V VCC=6.0V 4
ambient temperature Tamb -40 85 ℃ 4
HIGH-level input voltage VIH 3.15 2.4 V VCC=4.5V 5
HIGH-level input voltage VIH 4.2 3.2 V VCC=6.0V 5
LOW-level input voltage VIL 2.1 1.35 V VCC=4.5V 5
LOW-level input voltage VIL 2.8 1.8 V VCC=6.0V 5
HIGH-level output voltage VOH 4.4 4.5 V VI = VIH or VIL; IO=-20uA; VCC=4.5V 5
HIGH-level output voltage VOH 5.9 6 V VI = VIH or VIL; IO=-20uA; VCC=6.0V 5
HIGH-level output voltage VOH 3.98 4.32 V VI = VIH or VIL; IO=-6.0mA; VCC=4.5V 5
HIGH-level output voltage VOH 5.48 5.81 V VI = VIH or VIL; IO=-7.8mA; VCC=6.0V 5
LOW-level output voltage VOL 0 0.1 V VI = VIH or VIL; IO=20uA; VCC=4.5V 5
LOW-level output voltage VOL 0.15 0.26 V VI = VIH or VIL; IO=6.0mA; VCC=4.5V 5
LOW-level output voltage VOL 0.16 0.26 V VI = VIH or VIL; IO=7.8mA; VCC=6.0V 5
input leakage current II -0.1 0.1 uA VI=VCC or GND; VCC=6.0V 5
OFF-state output current IOZ -0.5 0.5 uA VI=VIH or VIL; VCC=6.0V; VO=VCC or GND 5
supply current ICC 8 uA VI=VCC or GND; IO=0A; VCC=6.0V 5
HIGH-level input voltage VIH 3.15 V VCC=4.5V 6
HIGH-level input voltage VIH 4.2 V VCC=6.0V 6
LOW-level input voltage VIL 1.35 V VCC=4.5V 6
LOW-level input voltage VIL 1.8 V VCC=6.0V 6
HIGH-level output voltage VOH 4.4 V VI = VIH or VIL; IO=-20uA; VCC=4.5V 6
HIGH-level output voltage VOH 5.9 V VI = VIH or VIL; IO=-20uA; VCC=6.0V 6
HIGH-level output voltage VOH 3.84 V VI = VIH or VIL; IO=-6.0mA; VCC=4.5V 6
HIGH-level output voltage VOH 5.34 V VI = VIH or VIL; IO=-7.8mA; VCC=6.0V 6
LOW-level output voltage VOL 0.1 V VI = VIH or VIL; IO=20uA; VCC=4.5V 6
LOW-level output voltage VOL 0.33 V VI = VIH or VIL; IO=6.0mA; VCC=4.5V 6
input leakage current II -1 1 uA VI=VCC or GND; VCC=6.0V 6
OFF-state output current IOZ -5 5 uA VI=VIH or VIL; VCC=6.0V; VO=VCC or GND 6
supply current ICC 80 uA VI=VCC or GND; IO=0A; VCC=6.0V 6
propagation delay nAn to nYn tpd 11 22 ns VCC=4.5V; see Figure 5 7
propagation delay nAn to nYn tpd 9 19 ns VCC=6.0V; see Figure 5 7
enable time nOE to nYn ten 13 30 ns VCC=4.5V; see Figure 6 7
enable time nOE to nYn ten 10 26 ns VCC=6.0V; see Figure 6 7
disable time nOE to nYn tdis 14 30 ns VCC=4.5V; see Figure 6 7
disable time nOE to nYn tdis 11 26 ns VCC=6.0V; see Figure 6 7
transition time tt 5 12 ns VCC=4.5V; see Figure 5 7
transition time tt 4 10 ns VCC=6.0V; see Figure 5 7
propagation delay nAn to nYn tpd 28 ns VCC=4.5V; see Figure 5 8
propagation delay nAn to nYn tpd 24 ns VCC=6.0V; see Figure 5 8
enable time nOE to nYn ten 38 ns VCC=4.5V; see Figure 6 8
enable time nOE to nYn ten 33 ns VCC=6.0V; see Figure 6 8
disable time nOE to nYn tdis 38 ns VCC=4.5V; see Figure 6 8
disable time nOE to nYn tdis 33 ns VCC=6.0V; see Figure 6 8
transition time tt 15 ns VCC=4.5V; see Figure 5 8
transition time tt 13 ns VCC=6.0V; see Figure 5 8

CAD (KiCad official)

  • Symbol: 74HC244DRG
  • Footprint: Package_SO:SOP-20_7.5x12.8mm_P1.27mm
  • 3D model: SOP-20, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 2.65 mm nominal SOIC height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: 74hc244drg-etched.step / 74hc244drg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 74hc244drg.step / 74hc244drg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HANSCHIP semiconductor datasheet (14 pp, sha256 89ae331fa36a036e, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF