component
74HC138N
Public Made by Adomby adom
HGSEMI Signal Switches, Multiplexers, Decoders, DIP-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdown74HC138N
HGSEMI · Signal Switches, Multiplexers, Decoders · DIP-16
74HC138N from HGSEMI, in a DIP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A | input | Binary-weighted address input A (least significant bit) that, together with B and C, selects which one of Y0-Y7 is driven low; input voltage must stay within -0.5 V to VCC+0.5 V. |
| 2 | B | input | Binary-weighted address input B that, together with A and C, selects which one of Y0-Y7 is driven low; input voltage must stay within -0.5 V to VCC+0.5 V. |
| 3 | C | input | Binary-weighted address input C (most significant bit) that, together with A and B, selects which one of Y0-Y7 is driven low; input voltage must stay within -0.5 V to VCC+0.5 V. |
| 4 | G2B | input | Active-low enable input; the decoder is enabled only when G2B and G2A are both low and G1 is high, and the input voltage must stay within -0.5 V to VCC+0.5 V. |
| 5 | G2A | input | Active-low enable input; the decoder is enabled only when G2A and G2B are both low and G1 is high, and the input voltage must stay within -0.5 V to VCC+0.5 V. |
| 6 | G1 | input | Active-high enable input that must be high (with G2A and G2B low) for the decoder outputs to be active; input voltage must stay within -0.5 V to VCC+0.5 V. |
| 7 | Y7 | output | Active-low decoded output Y7, driven low when address 111 is selected with the device enabled; output current is limited to 25 mA per pin. |
| 8 | GND | power_in | Ground reference pin for the device. |
| 9 | Y6 | output | Active-low decoded output Y6, driven low when address 110 is selected with the device enabled; output current is limited to 25 mA per pin. |
| 10 | Y5 | output | Active-low decoded output Y5, driven low when address 101 is selected with the device enabled; output current is limited to 25 mA per pin. |
| 11 | Y4 | output | Active-low decoded output Y4, driven low when address 100 is selected with the device enabled; output current is limited to 25 mA per pin. |
| 12 | Y3 | output | Active-low decoded output Y3, driven low when address 011 is selected with the device enabled; output current is limited to 25 mA per pin. |
| 13 | Y2 | output | Active-low decoded output Y2, driven low when address 010 is selected with the device enabled; output current is limited to 25 mA per pin. |
| 14 | Y1 | output | Active-low decoded output Y1, driven low when address 001 is selected with the device enabled; output current is limited to 25 mA per pin. |
| 15 | Y0 | output | Active-low decoded output Y0, driven low when address 000 is selected with the device enabled; output current is limited to 25 mA per pin. |
| 16 | VCC | power_in | Positive supply pin; the datasheet recommends 2 V to 6 V (typical 5 V) and gives an absolute maximum of -0.5 V to 6.5 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | DIP-16 |
| Category | Logic |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VCC | 2 | 5 | 6 | V | 4 | |
| Input/output voltage | VIN, Vout | 0 | V | max = VCC (symbolic, as printed) | 4 | ||
| Input rise/fall time | tr tf | 0 | 1000 | ns | VCC=2.0V | 4 | |
| Input rise/fall time | tr tf | 0 | 500 | ns | VCC=4.5V | 4 | |
| Input rise/fall time | tr tf | 0 | 400 | ns | VCC=6.0V | 4 | |
| Supply voltage | VCC | -0.5 | 6.5 | V | 4 | ||
| Input/output voltage | VIN, VOUT | -0.5 | V | max = VCC+0.5 (symbolic, as printed) | 4 | ||
| Input/output clamp current | IIK, IOK | 20 | mA | 4 | |||
| Single pin output current | IOUT | 25 | mA | 4 | |||
| Current per pin into VCC or GND | ICC | 50 | mA | 4 | |||
| Power dissipation | PD | 500 | mW | 4 | |||
| Operating temperature | TA | -40 | 85 | ℃ | 4 | ||
| Storage temperature | TS | -65 | 150 | ℃ | 4 | ||
| Lead soldering temperature | TL | 260 | ℃ | 10s | 4 | ||
| High-level input voltage | VIH | 1.5 | V | VCC=2.0V | 5 | ||
| High-level input voltage | VIH | 3.15 | V | VCC=4.5V | 5 | ||
| High-level input voltage | VIH | 4.2 | V | VCC=6.0V | 5 | ||
| Low-level input voltage | VIL | 0.5 | V | VCC=2.0V | 5 | ||
| Low-level input voltage | VIL | 1.35 | V | VCC=4.5V | 5 | ||
| Low-level input voltage | VIL | 1.8 | V | VCC=6.0V | 5 | ||
| High-level output voltage | VOH | 1.9 | V | VI= VIH or VIL, IOH=20μA, VCC=2.0V | 5 | ||
| High-level output voltage | VOH | 4.4 | V | VI= VIH or VIL, IOH=20μA, VCC=4.5V | 5 | ||
| High-level output voltage | VOH | 5.9 | V | VI= VIH or VIL, IOH=20μA, VCC=6.0V | 5 | ||
| High-level output voltage | VOH | 3.9 | 4.3 | V | VI= VIH or VIL, IOH=4.0mA, VCC=4.5V | 5 | |
| High-level output voltage | VOH | 5.2 | 5.7 | V | VI= VIH or VIL, IOH=5.2mA, VCC=6.0V | 5 | |
| Low-level output voltage | VOL | 0.1 | V | VI= VIH or VIL, IOH=20μA, VCC=2.0V (label as printed) | 5 | ||
| Low-level output voltage | VOL | 0.2 | 0.5 | V | VI= VIH or VIL, IOH=4.0mA, VCC=4.5V (label as printed) | 5 | |
| Low-level output voltage | VOL | 0.3 | 0.5 | V | VI= VIH or VIL, IOH=5.2mA, VCC=6.0V (label as printed) | 5 | |
| Input current | IIN | 1 | uA | VI=VCC or GND, VCC=6.0V | 5 | ||
| Operating (quiescent) supply current | ICC | 5 | uA | VI=VCC or GND, IOUT=0μA, VCC=6.0V | 5 | ||
| Operating voltage | VCC | 2 | 6 | V | 5 | ||
| Propagation delay A, B, C to Output (high-to-low) | tPHL | 24 | ns | VCC=5.0V, CL=16pF, tr=tf≤20ns | 5 | ||
| Propagation delay A, B, C to Output (low-to-high) | tPLH | 18 | ns | VCC=5.0V, CL=16pF, tr=tf≤20ns | 5 | ||
| Propagation delay G1 to Output (high-to-low) | tPHL | 25 | ns | VCC=5.0V, CL=16pF, tr=tf≤20ns | 5 | ||
| Propagation delay G1 to Output (low-to-high) | tPLH | 17 | ns | VCC=5.0V, CL=16pF, tr=tf≤20ns | 5 | ||
| Propagation delay G2A/G2B to Output (high-to-low) | tPHL | 22 | ns | VCC=5.0V, CL=16pF, tr=tf≤20ns | 5 | ||
| Propagation delay G2A/G2B to Output (low-to-high) | tPLH | 18 | ns | VCC=5.0V, CL=16pF, tr=tf≤20ns | 5 |
CAD (KiCad official)
- Symbol:
74HC138N - Footprint:
Package_DIP:DIP-16_W7.62mm - 3D model: DIP-16 (KiCad packages3D, STEP)
- 3D model files:
74hc138n-etched.step/74hc138n-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);74hc138n.step/74hc138n.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (10 pp, sha256
c942e8bd63c757ae, retrieved 2026-10-15, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).