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74HC04DN

Public Made by Adom

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HGSEMI Inverters, DIP-14. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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74HC04DN

HGSEMI · Inverters · DIP-14

74HC04DN from HGSEMI, in a DIP-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 input Input of inverter 1; input voltage must stay within -0.3 V to VCC+0.3 V.
2 Y1 output Push-pull buffered output of inverter 1; single-pin output current limit is ±25 mA.
3 A2 input Input of inverter 2; input voltage must stay within -0.3 V to VCC+0.3 V.
4 Y2 output Push-pull buffered output of inverter 2; single-pin output current limit is ±25 mA.
5 A3 input Input of inverter 3; input voltage must stay within -0.3 V to VCC+0.3 V.
6 Y3 output Push-pull buffered output of inverter 3; single-pin output current limit is ±25 mA.
7 GND power_in Ground reference for the device; VCC or GND current is limited to ±50 mA.
8 Y4 output Push-pull buffered output of inverter 4; single-pin output current limit is ±25 mA.
9 A4 input Input of inverter 4; input voltage must stay within -0.3 V to VCC+0.3 V.
10 Y5 output Push-pull buffered output of inverter 5; single-pin output current limit is ±25 mA.
11 A5 input Input of inverter 5; input voltage must stay within -0.3 V to VCC+0.3 V.
12 Y6 output Push-pull buffered output of inverter 6; single-pin output current limit is ±25 mA.
13 A6 input Input of inverter 6; input voltage must stay within -0.3 V to VCC+0.3 V.
14 VCC power_in Positive supply; operating range is 2.0 V to 6.0 V with an absolute maximum of 6.5 V.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package DIP-14
Category Logic
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating voltage (absolute maximum) VCC 6.5 V 3
Input/output voltage (absolute maximum) VIN、VOUT -0.3 V 3
Single pin output current IOUT -25 25 mA 3
VCC or GND current ICC -50 50 mA 3
Power dissipation PD 500 mW 3
Operating temperature (absolute maximum) TA 0 70 ℃ 3
Storage temperature TS -65 150 ℃ 3
Lead soldering temperature TL 245 ℃ 10 s 3
Operating voltage VCC 2 5 6 V 4
Input/output voltage VIN、Vout 0 V 4
Input rise/fall time Tr, tf 0 1000 ns VCC=2.0V 4
Input rise/fall time Tr, tf 0 500 ns VCC=4.5V 4
Input rise/fall time Tr, tf 0 400 ns VCC=6.0V 4
Operating temperature (recommended) TA 0 60 ℃ 4
High-level input voltage VIH 1.5 V TA=25℃; VCC=2.0 V 4
High-level input voltage VIH 3.15 V TA=25℃; VCC=4.5 V 4
High-level input voltage VIH 4.2 V TA=25℃; VCC=6.0 V 4
Low-level input voltage VIL 0.5 V TA=25℃; VCC=2.0 V 4
Low-level input voltage VIL 1.35 V TA=25℃; VCC=4.5 V 4
Low-level input voltage VIL 1.8 V TA=25℃; VCC=6.0 V 4
High-level output voltage VOH 1.9 V TA=25℃; VI=VIH or VIL; /IOUT/≤20μA; VCC=2.0 V 4
High-level output voltage VOH 4.4 V TA=25℃; VI=VIH or VIL; /IOUT/≤20μA; VCC=4.5 V 4
High-level output voltage VOH 5.9 V TA=25℃; VI=VIH or VIL; /IOUT/≤20μA; VCC=6.0 V 4
High-level output voltage VOH 3.7 4.4 V TA=25℃; VI=VIH or VIL; /IOUT/≤4.0mA; VCC=4.5 V 4
High-level output voltage VOH 5.2 5.8 V TA=25℃; VI=VIH or VIL; /IOUT/≤5.2mA; VCC=6.0 V 4
Low-level output voltage VOL 0.1 V TA=25℃; VI=VIH or VIL; /IOUT/≤20μA; VCC=2.0 V 4
Low-level output voltage VOL 0.06 0.4 V TA=25℃; VI=VIH or VIL; /IOUT/≤4.0mA; VCC=4.5 V 4
Low-level output voltage VOL 0.07 0.5 V TA=25℃; VI=VIH or VIL; /IOUT/≤5.2mA; VCC=6.0 V 4
Input current IIN 1 uA TA=25℃; VI=VCC or GND; VCC=6.0 V 4
Operating current ICC 5.5 uA TA=25℃; VI=VCC or GND; IOUT=0μA; VCC=6.0 V 4
Propagation delay A to Y (high-to-low) tPHL 17 ns TA=25℃; VCC=5.0V; tr=tf≤20ns; CL=15pF 5
Propagation delay A to Y (low-to-high) tPLH 15 ns TA=25℃; VCC=5.0V; tr=tf≤20ns; CL=15pF 5

CAD (KiCad official)

  • Symbol: 74HC04DN
  • Footprint: Package_DIP:DIP-14_W7.62mm
  • 3D model: DIP-14 (KiCad packages3D, STEP)
  • 3D model files: 74hc04dn-etched.step / 74hc04dn-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 74hc04dn.step / 74hc04dn.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (9 pp, sha256 cf4c39256634a932, retrieved 2026-10-15, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF