component

74HC02M

Public Made by Adom

by adom

HGSEMI Gates, SOIC-14. Datasheet-verified pinout, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

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74HC02M

HGSEMI · Gates · SOIC-14

74HC02M from HGSEMI, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Y1 output Gate 1 NOR output. Y1 = NOT(A1 + B1). CMOS output capable of driving 10 LSTTL loads; VOH >= VCC-0.1 V and VOL <= 0.1 V at
2 A1 input Gate 1 NOR input A. High-impedance CMOS input; VIH >= 0.7VCC and VIL <= 0.3VCC (approx). Maximum input leakage 1.0 uA. Unused inputs must be tied to VCC or GND.
3 B1 input Gate 1 NOR input B. High-impedance CMOS input; must be tied to a valid logic level (unused inputs to VCC or GND).
4 Y2 output Gate 2 NOR output. Y2 = NOT(A2 + B2). CMOS push-pull output; drives 10 LSTTL loads.
5 A2 input Gate 2 NOR input A. High-impedance CMOS input.
6 B2 input Gate 2 NOR input B. High-impedance CMOS input.
7 GND power_in Device ground / 0 V reference. All inputs and outputs are referenced to GND.
8 A3 input Gate 3 NOR input A. High-impedance CMOS input.
9 B3 input Gate 3 NOR input B. High-impedance CMOS input.
10 Y3 output Gate 3 NOR output. Y3 = NOT(A3 + B3). CMOS push-pull output.
11 A4 input Gate 4 NOR input A. High-impedance CMOS input.
12 B4 input Gate 4 NOR input B. High-impedance CMOS input.
13 Y4 output Gate 4 NOR output. Y4 = NOT(A4 + B4). CMOS push-pull output.
14 VCC power_in Positive supply. Operating range 2.0 V to 6.0 V (absolute maximum 7.0 V). Bypass locally to GND with a 0.1 uF ceramic capacitor.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOIC-14
Category Logic
Pins 14

Ordering variants

Same part, different packaging or reel option.

  • 74HC02MM/TR
  • 74HC02MN
  • 74HC02MMT/TR
  • 74HC02MLQ/TR

CAD (KiCad official)

  • Symbol: 74HC02M
  • Footprint: Package_SO:SOIC-14_3.9x8.7mm_P1.27mm
  • 3D model: SOIC-14 (KiCad packages3D, STEP)
  • 3D model files: 74hc02m-etched.step / 74hc02m-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 74hc02m.step / 74hc02m.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (9 pp, sha256 868940124e153af6, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF