component

74HC00N

Public Made by Adom

by adom

HGSEMI Gates, DIP-14. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Symbol & Footprint

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Datasheet

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Contents

README

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74HC00N

HGSEMI · Gates · DIP-14

74HC00N from HGSEMI, in a DIP-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1A input Gate 1 data input A; input voltage 0 to VCC, clamp current ±20 mA max.
2 1B input Gate 1 data input B; input voltage 0 to VCC, clamp current ±20 mA max.
3 1Y output Gate 1 NAND data output; output current ±25 mA max.
4 2A input Gate 2 data input A; input voltage 0 to VCC, clamp current ±20 mA max.
5 2B input Gate 2 data input B; input voltage 0 to VCC, clamp current ±20 mA max.
6 2Y output Gate 2 NAND data output; output current ±25 mA max.
7 GND power_in Ground (system ground, 0 V reference).
8 3Y output Gate 3 NAND data output; output current ±25 mA max.
9 3A input Gate 3 data input A; input voltage 0 to VCC, clamp current ±20 mA max.
10 3B input Gate 3 data input B; input voltage 0 to VCC, clamp current ±20 mA max.
11 4Y output Gate 4 NAND data output; output current ±25 mA max.
12 4A input Gate 4 data input A; input voltage 0 to VCC, clamp current ±20 mA max.
13 4B input Gate 4 data input B; input voltage 0 to VCC, clamp current ±20 mA max.
14 VCC power_in Positive supply, recommended 2.0 V to 6.0 V, absolute maximum 7.0 V.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package DIP-14
Category Logic ICs
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC -0.5 7 V 4
Input clamp diode current Ilk 20 mA Vi<-0.5V or Vi>VCC+0.5V; printed ±20 4
Output clamp diode current Iok 20 mA Vo<-0.5V or VO>VCC+0.5V; printed ±20 4
Output current Io 25 mA -0.5V<Vo<VCC+0.5V; printed ±25 4
Supply/ground current Icc, IGND 50 mA printed ±50 4
Storage temperature Tstg -65 150 °C 4
Power dissipation PD 500 mW Tamb=-40~125°C 4
Soldering temperature TL 260 °C 10 s 4
Supply voltage VCC 2 5 6 V 4
Input voltage Vi 0 6 V max printed as VCC 4
Output voltage Vo 0 6 V max printed as VCC 4
Operating ambient temperature Tamb -40 25 85 °C 4
Input rise and fall time tr,tf 1000 ns VCC=2.0V 4
Input rise and fall time tr,tf 6 500 ns VCC=4.5V 4
Input rise and fall time tr,tf 400 ns VCC=6.0V 4
Input high voltage VIH 1.5 1.2 V VCC=2.0V; Tamb=-40~85°C 5
Input high voltage VIH 3.15 2.4 V VCC=4.5V; Tamb=-40~85°C 5
Input high voltage VIH 4.2 3.2 V VCC=6.0V; Tamb=-40~85°C 5
Input low voltage VIL 0.8 0.5 V VCC=2.0V; Tamb=-40~85°C 5
Input low voltage VIL 2.1 1.35 V VCC=4.5V; Tamb=-40~85°C 5
Input low voltage VIL 2.8 1.8 V VCC=6.0V; Tamb=-40~85°C 5
Output high voltage VOH 1.9 2 V Vi=VIH or VIL; VCC=2.0V; IO=-20uA 5
Output high voltage VOH 4.4 4.5 V Vi=VIH or VIL; VCC=4.5V; IO=-20uA 5
Output high voltage VOH 5.9 6 V Vi=VIH or VIL; VCC=6.0V; IO=-20uA 5
Output high voltage VOH 3.84 4.32 V Vi=VIH or VIL; VCC=4.5V; IO=-4.0mA 5
Output high voltage VOH 5.34 5.81 V Vi=VIH or VIL; VCC=6.0V; IO=-5.2mA 5
Output low voltage VOL 0 0.1 V Vi=VIH or VIL; VCC=2.0V; IO=20uA 5
Output low voltage VOL 0.15 0.33 V Vi=VIH or VIL; VCC=4.5V; IO=4.0mA 5
Output low voltage VOL 0.16 0.33 V Vi=VIH or VIL; VCC=6.0V; IO=5.2mA 5
Input leakage current ILI -1 1 uA VCC=6.0V=Vi=VCC or GND; printed ±1.0 5
Quiescent current ICCQ 20 uA VCC=6.0V=Vi=VCC or GND; IO=0 5
Propagation delay nA,nB to nY tPHL/tPLH 25 115 ns VCC=2.0V; Tamb=-40~85°C; CL=50pF 7
Propagation delay nA,nB to nY tPHL/tPLH 9 23 ns VCC=4.5V; Tamb=-40~85°C; CL=50pF 7
Propagation delay nA,nB to nY tPHL/tPLH 7 20 ns VCC=6.0V; Tamb=-40~85°C; CL=50pF 7
Output transition time tTHL/tTLH 19 95 ns VCC=2.0V; Tamb=-40~85°C; CL=50pF 7
Output transition time tTHL/tTLH 7 19 ns VCC=4.5V; Tamb=-40~85°C; CL=50pF 7
Output transition time tTHL/tTLH 6 16 ns VCC=6.0V; Tamb=-40~85°C; CL=50pF 7

CAD (KiCad official)

  • Symbol: 74HC00N
  • Footprint: Package_DIP:DIP-14_W7.62mm
  • 3D model: DIP-14 (KiCad packages3D, STEP)
  • 3D model files: 74hc00n-etched.step / 74hc00n-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 74hc00n.step / 74hc00n.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (12 pp, sha256 00d318954a98c98d, retrieved 2026-10-22, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF